Category: Integrated Circuits
Asia Integrated Circuits
-
Japan Semiconductor Fabrication Materials Market Assessment, By Material Type [Silicon wafers, Wet Chemicals, CMP slurry and pads, Photomasks, Photoresist & Photoresist ancillaries, Industrial Gases (Argon, Helium, Rare Gases, Others), Sputter targets, Electrostatic chunks, IC lead frame, Others], By Semiconductor type [n-type, p-type], By End-user [Electrical & Electronics (Consumer Electronics, Appliances, Others), Energy & Power, Medical devices, Transportation (Automotive, Marine, Aerospace, Others), Telecommunication, Others], By Region, Opportunities and Forecast, FY2017-FY2031
... frame, Others], By Semiconductor type [n-type, p-type], By End-user [Electrical & Electronics (Consumer Electronics, Appliances, Others), Energy & Power, Medical devices, Transportation (Automotive, Marine, Aerospace, Others), Telecommunication, Others], By Region, Opportunities and Forecast, FY2017-FY2031 Japan ... Read More
-
Electronic Design Automation (EDA) Tools Market - Global Size, Share, Trend Analysis, Opportunity and Forecast Report, 2019–2030, Segmented By Product (Computer-aided Engineering (CAE), IC Physical Design & Verification, Printed Circuit Board & Multi-chip Module (PCB & MCM), Semiconductor Intellectual Property (SIP)); By Application (Communication, Consumer Electronics, Automotive, Industrial); By Region (North America, Europe, Asia Pacific (APAC), Latin America (LATAM), Middle East and Africa (MEA))
... of electronic devices, spurring demand for efficient chip designs, and growing semiconductor industry. BlueWeave Consulting, a leading strategic consulting and market research firm, in its recent study, estimated the Global Electronic Design Automation (EDA) Tools ... Read More
-
Alloy Strips Market, By Alloy Type (Aluminum Alloys, Stainless Steel Alloys, Copper Alloys, Nickel Alloys, Titanium Alloys, Others), By End-Use Industry (Automotive, Aerospace and Defense, Electronics and Electrical, Construction and Architecture, Manufacturing, Energy and Utilities, Consumer Goods, Others), By Form (Flat Alloy Strips, Coiled Alloy Strips), By Thickness Range (Thin Alloy Strips ( 2 mm)), By Width Range (Narrow Alloy Strips ( 500 mm)), By Surface Finish (Mill Finish, Polished Finish, Brushed Finish, Others), By Alloy Formulation (Binary Alloys, Ternary Alloys, Quaternary Alloys, Others), By Application (Heat Exchangers and Radiators, Electrical Connectors and Switches, Roofing and Cladding, Automotive Structural Components, Printed Circuit Boards (PCBs), Electronic Enclosures, Semiconductor Packaging, Consumer Electronics Components, Oil and Gas Pipelines, Marine Components, Architectural Trim, Others), By Geography (North America, Latin America, Europe, Asia Pacific, M
... Consumer Goods, Others), By Form (Flat Alloy Strips, Coiled Alloy Strips), By Thickness Range (Thin Alloy Strips ( 2 mm)), By Width Range (Narrow Alloy Strips ( 500 mm)), By Surface Finish (Mill Finish, Polished ... Read More
-
Polycrystalline Silicon Market, By Application (Photovoltaics (solar cells and solar panels), Electronics (semiconductors and integrated circuits), Photovoltaic solar cells), By End User Industry (Solar Energy Industry, Electronics and Semiconductor Industry), By Manufacturing Technology (Siemens Process, Fluidized Bed Reactor (FBR) Process, Upgraded Metallurgical Grade (UMG) Process), By Purity Level (Electronic Grade and Solar Grade Distribution Channel: Direct Sales to Manufacturers, Distributors and Traders), By Geography (North America, Latin America, Europe, Middle East & Africa, and Asia Pacific)
... Fluidized Bed Reactor (FBR) Process, Upgraded Metallurgical Grade (UMG) Process), By Purity Level (Electronic Grade and Solar Grade Distribution Channel: Direct Sales to Manufacturers, Distributors and Traders), By Geography (North America, Latin America, Europe, Middle ... Read More
-
Southeast Asia Redistribution Layer Material Market Size and Forecasts (2020 - 2030), Regional Share, Trends, and Growth Opportunity Analysis Report Coverage: By Type (Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others) and Application (Fan-Out Wafer Level Packaging (FOWLP) and 2 5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others])
... Level Packaging (FOWLP) and 2 5D/3D IC Packaging [High Bandwidth Memory (HBM), Multi-Chip Integration, Package on Package (FOPOP), and Others]) The Southeast Asia redistribution layer material market is expected to grow from US$ 54.51 million ... Read More
-
Development of the China IC Packaging and Testing Industry and Key Players
... RMB (US$171.4 billion; US$=7 RMB). Among them, the proportions of IC design industry, IC manufacturing industry, and IC packaging and testing industry in the total sales revenue were 43%, 32%, and 25%, respectively. The IC ... Read More
-
Integrated Circuit Market in the Philippines (2018-2028)
... industry's rise has not only contributed to economic development but has also positioned the country as a reliable contributor to the global electronics supply chain. Philippine made integrated circuits have gained recognition on the international ... Read More
-
Asia-Pacific (APAC) Control Systems Market Summary, Competitive Analysis and Forecast to 2027
... and forecast to 2027). The profile also contains descriptions of the leading players including key financial metrics and analysis of competitive pressures within the market. Key Highlights The control systems market is made up of ... Read More
-
Taiwan IC Packaging and Testing Industry, 2Q 2023
... with a review of the recent quarters from 4Q 2020 to 4Q 2023. The report also includes a breakdown of the shipment value by customer origin and service type. The survey conducted for this research ... Read More
-
Taiwan Fabless IC Industry, 2Q 2023
... mix, and application mix and includes major vendors' latest shipment value ranking. The content of this report is based on primary data obtained from interviews with Taiwanese fabless IC design houses and publicly available information ... Read More
-
Development of the IC Design Industry and Major Players in China
... to China using U.S. equipment or software are required to obtain a license, regardless of where the chips are manufactured. According to the data released by the business information query platform "Qichacha" in China, as ... Read More
-
Electronic Components and Boards Market in China to 2027
... research includes historic data from 2019 to 2022 and forecasts until 2027 which makes the report an invaluable resource for business leaders, decision-makers, consultants, analysts, and other people looking for key industry data in a ... Read More
-
Remote Power Panel Market by Type (Wall-mounted, Floor-standing), Application (Network Cabinets, Server Rooms, Data Centers (Cloud, Enterprise)) & Region (North America, Europe, Asia Pacific, South America, Middle East & Africa) - Global Forecast to 2028
... The global remote power panel market is estimated to grow from USD 1.1 Billion in 2023 to USD 1.4 Billion by 2028; it is expected to record a CAGR of 4.8% during the forecast period. ... Read More
-
Vietnam Common Mode Chokes Market: Prospects, Trends Analysis, Market Size and Forecasts up to 2030
... market. Moreover, the report provides deep insights into demand forecasts, market trends, and, micro and macro indicators in the Vietnam market. Also, factors that are driving and restraining the common mode chokes market are highlighted ... Read More
-
Indian PCB (Printed Circuit Board) Market: Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
... market to reach US$ 11.8 Billion by 2028, exhibiting a growth rate (CAGR) of 16.6% during 2023-2028. Printed circuit boards (PCBs) are non-conductive, copper laminated boards that help to connect electronic and electrical components without ... Read More
-
Data Converter Market by Type (Analog-to-Digital Converters, Digital-to-Analog Converters), Sampling Rate (High-Speed Data Converters, General-Purpose Data Converters), Application and Region (North America, Europe, APAC, RoW) - Global Forecast to 2028
... is valued at USD 5.5 Billion in 2023 and is anticipated to be USD 7.4 Billion by 2028; growing at a CAGR of 6.0% from 2023 to 2028. Factors such as the Rising demand for ... Read More
-
Photonic IC Market, By Components (Lasers, Modulators, Detectors, Attenuators, MUX/DEMUX, Optical Amplifiers), By Integration Type (Monolithic Integration, Hybrid Integration and Module Integration), By Raw Material (Indium Phosphide, Gallium Arsenide, Lithium Niobate, Silicon, Silica-on-Insulator and Others), By Application (Optical communications, Sensing, Biophotonics and Optical signal processing), By Region (North America, Europe, Asia Pacific, Latin America, Middle East, and Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030
... By Application (Optical communications, Sensing, Biophotonics and Optical signal processing), By Region (North America, Europe, Asia Pacific, Latin America, Middle East, and Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030 Photonics integrated ... Read More
-
Research Report on Southeast Asia Printed Circuit Board Industry 2023-2032
... an important component of cell phone parts. At present, the development of printed circuit board industry in Southeast Asian countries varies greatly. According to CRI analysis, Thailand and Malaysia's printed circuit board industry is more ... Read More
-
Research Report on Southeast Asia IC Design Industry 2023-2032
... in the whole process of IC manufacturing. IC can be used in new energy, information and communication, consumer electronics, smart grid and many other fields. Southeast Asia in this report includes 10 countries: Singapore, Thailand, ... Read More
-
Asia Pacific Data Converter Market Forecast to 2028 – COVID-19 Impact and Regional Analysis – by Type (DAC and ADC), Sampling Rates (High Speed Converters and General/Low Speed Converters), Application (Medical, Industrial, Communications, Consumer Electronics, Automotive, and Others), Resolution (10–14 bit, Above 14-20 bit, and Above 20 bit), and Rate of Converter (Below 100Msps, 100-500Msps, Above 500Msps-1Gsps, and Above 1Gsps-3Gsps)
... Automotive, and Others), Resolution (10–14 bit, Above 14-20 bit, and Above 20 bit), and Rate of Converter (Below 100Msps, 100-500Msps, Above 500Msps-1Gsps, and Above 1Gsps-3Gsps) The data converter in Asia Pacific is expected to grow ... Read More
-
Global Multilayer Printed Circuits Market Size, Segments, Outlook, and Revenue Forecast 2022-2028 by Product Type (Layer 3-6, Layer 8-10, Layer 10+), Application (Consumer Electronics, Automotive, Communications, Healthcare, Industrial, Aerospace), and Region (North America, Europe, Asia Pacific, Latin America, Middle East and Africa)
... Pacific, Latin America, Middle East and Africa) Market Overview: A printed circuit board (PCB) is a foundation for most electronic products, providing physical support and wiring area for different socketed and surface-mounted components, including integrated ... Read More
-
Global Automotive LiDAR Market Size, Segments, Outlook, and Revenue Forecast 2022-2028 by Application (Semi-Autonomous Vehicles, Autonomous Vehicles), Technology (Solid State, Mechanical/Scanning), Location (Roof & Upper Pillars, Headlight & Taillight, Bumper & Grill ), Range (Short & Mid-Range, Long Range), Vehicle Type (IC Engine Vehicle, Hybrid Electric Vehicle, Plug-in Hybrid Electric Vehicle, Battery Electric Vehicle) and Region (North America, Europe, Asia Pacific, Latin America Middle East and Africa)
... & Mid-Range, Long Range), Vehicle Type (IC Engine Vehicle, Hybrid Electric Vehicle, Plug-in Hybrid Electric Vehicle, Battery Electric Vehicle) and Region (North America, Europe, Asia Pacific, Latin America Middle East and Africa) Market Overview: LIDAR ... Read More
-
5G Chipset Market, By Chipset (Application-specific Integrated Circuits (ASIC), Radio Frequency Integrated Circuit (RFIC), Millimeter Wave Technology Chips, Field-programmable, Gate Array (FPGA)), By Operational Frequency (Sub-6 GHz, Between 26 and 39 GHz, Above 39 GHz), By the End-user (Consumer Electronics, Industrial Automation, Automotive and Transportation, Energy and Utilities, Healthcare, Retail, Other End-user Industries), By Geography (North America, Latin America, Europe, Asia Pacific, Middle East & Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030
... By the End-user (Consumer Electronics, Industrial Automation, Automotive and Transportation, Energy and Utilities, Healthcare, Retail, Other End-user Industries), By Geography (North America, Latin America, Europe, Asia Pacific, Middle East & Africa) - Size, Share, Outlook, ... Read More
-
Semiconductor Equipment Market, By Product Type (Semiconductor Front-end Equipment and Semiconductor Back-end Equipment), By Application (Discrete Semiconductor, Optoelectronic Device, Sensors, and Integrated Circuits), By Equipment (Wafer Processing, Assembly & Packaging, and Testing Equipment), By End Use (PCs, Mobile Handsets, and Televisions Assembly & Packaging), and By Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030
... Use (PCs, Mobile Handsets, and Televisions Assembly & Packaging), and By Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030 Semiconductor ... Read More
-
China Electronic Component and Board Market Outlook (2019-2027)
... includes historic data from 2019 to 2021 and forecasts until 2027 which makes the report an invaluable resource for industry executives, marketing, sales and product managers, consultants, analysts, and other people looking for key industry ... Read More
Research Assistance
