Category: Integrated Circuits
Integrated Circuits market research reports by Stratistics Market Research Consulting
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Field Programmable Gate Array (FPGA) Market Forecasts to 2030 – Global Analysis By Product Type (Flash-Based, Antifuse-Based, Static RAM-Based and Other Product Types), Configuration Type, Node Size, Technology, Application, End User and By Geography
Field Programmable Gate Array (FPGA) Market Forecasts to 2030 – Global Analysis By Product Type (Flash-Based, Antifuse-Based, Static RAM-Based and Other Product Types), Configuration Type, Node Size, Technology, Application, End User and By Geography According to Stratistics MRC, the Global Field Pr ... Read More
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Automotive Semiconductor Market Forecasts to 2030 – Global Analysis By Component (Processor, Microcontrollers, Analog IC, Discrete Power Device, Sensors, Memory Devices, Lighting Device and Other Components), Vehicle Type (Passenger Car, Light Commercial Vehicle (LCV), Heavy Commercial (HCV) and Other Vehicle Types), Fuel Type, Application and by Geography
Automotive Semiconductor Market Forecasts to 2030 – Global Analysis By Component (Processor, Microcontrollers, Analog IC, Discrete Power Device, Sensors, Memory Devices, Lighting Device and Other Components), Vehicle Type (Passenger Car, Light Commercial Vehicle (LCV), Heavy Commercial (HCV) and Oth ... Read More
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Aviation Connectors Market Forecasts to 2030 - Global Analysis By Platform (Fixed Wing and Rotary Wing), Type (Printed Circuit Board (PCB), Fiber Optic and Other Types), Material, Shape, Application, End User and By Geography
Aviation Connectors Market Forecasts to 2030 - Global Analysis By Platform (Fixed Wing and Rotary Wing), Type (Printed Circuit Board (PCB), Fiber Optic and Other Types), Material, Shape, Application, End User and By Geography According to Stratistics MRC, the Aviation Connectors Market is accounted ... Read More
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Printed Circuit Board (PCB) Market Forecasts to 2030 – Global Analysis By Type (Single Sided, Double Sided, Multi-Layer, High Density Interconnect (HDI) and Other Types), Substrate (Rigid, Flexible and Rigid-Flex), Laminate Material (Flame Retardant (FR-4), Flexible (PI,PET), Paper, Composites and Other Laminate Materials), Raw Material, End User and by Geography
Printed Circuit Board (PCB) Market Forecasts to 2030 – Global Analysis By Type (Single Sided, Double Sided, Multi-Layer, High Density Interconnect (HDI) and Other Types), Substrate (Rigid, Flexible and Rigid-Flex), Laminate Material (Flame Retardant (FR-4), Flexible (PI,PET), Paper, Composites and O ... Read More
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Printed and Chipless RFID Market Forecasts to 2030 – Global Analysis By Product Type (Tags, Readers and Middleware), Technology, Application, End User and By Geography
Printed and Chipless RFID Market Forecasts to 2030 – Global Analysis By Product Type (Tags, Readers and Middleware), Technology, Application, End User and By Geography According to Stratistics MRC, the Global Printed and Chipless RFID Market is accounted for $20.0 billion in 2023 and is expected to ... Read More
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Colorless Polyimide Films Market Forecasts to 2030 – Global Analysis By Type (20 m, 21-30 m, 31-50 m and >50 m), Application (Flexible Solar Cells, Flexible Displays, Flexible Printed Circuit Boards, Lighting Equipment and Other Applications), End User and By Geography
Colorless Polyimide Films Market Forecasts to 2030 – Global Analysis By Type (20 m, 21-30 m, 31-50 m and >50 m), Application (Flexible Solar Cells, Flexible Displays, Flexible Printed Circuit Boards, Lighting Equipment and Other Applications), End User and By Geography According to Stratistics MRC, ... Read More
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Graphene Electronics Market Forecasts to 2030 – Global Analysis By Product (Batteries, Solar Cell, Display, Integrated Circuits and Chips, Memories and Other Products), Material, Technology, End User and By Geography
Graphene Electronics Market Forecasts to 2030 – Global Analysis By Product (Batteries, Solar Cell, Display, Integrated Circuits and Chips, Memories and Other Products), Material, Technology, End User and By Geography According to Stratistics MRC, the Global Graphene Electronics Market is accounted f ... Read More
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Aviation Connector Market Forecasts to 2030 – Global Analysis By Type (PCB (Printed Circuit Board), High Power and Other Types), Aircraft Type (General Aviation, Very Large Aircraft and Other Aircraft Types), Shape, Platform, Application, End User and By Geography
Aviation Connector Market Forecasts to 2030 – Global Analysis By Type (PCB (Printed Circuit Board), High Power and Other Types), Aircraft Type (General Aviation, Very Large Aircraft and Other Aircraft Types), Shape, Platform, Application, End User and By Geography According to Stratistics MRC, the G ... Read More
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Optical Film Exposure Equipment Market Forecasts to 2030 – Global Analysis By Type (Laser Direct Imaging (LDI) Systems, Mask Aligners, Direct Imaging (DI) Systems and Projection Systems), Application (Flat Panel Displays (FPDs), Semiconductor Wafers, Printed Circuit Boards (PCBs) and Other Applications), End User and By Geography
Optical Film Exposure Equipment Market Forecasts to 2030 – Global Analysis By Type (Laser Direct Imaging (LDI) Systems, Mask Aligners, Direct Imaging (DI) Systems and Projection Systems), Application (Flat Panel Displays (FPDs), Semiconductor Wafers, Printed Circuit Boards (PCBs) and Other Applicati ... Read More
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Astable Multivibrator Market Forecasts to 2030 – Global Analysis By Type (Transistor-Based Astable Multivibrators, Operational Amplifier (Op-Amp) Astable Multivibrators, Resistor-Capacitor (RC) Phase Shift Oscillators, Emitter-Coupled Astable Multivibrators, Flip-Flop Astable Multivibrators, Digital Astable Multivibrators, Integrated Circuit (IC) Astable Multivibrators, Crystal Oscillator-Based Astable Multivibrators, Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs) Astable Multivibrators and Other Types), Application, End User and By Geography
Astable Multivibrator Market Forecasts to 2030 – Global Analysis By Type (Transistor-Based Astable Multivibrators, Operational Amplifier (Op-Amp) Astable Multivibrators, Resistor-Capacitor (RC) Phase Shift Oscillators, Emitter-Coupled Astable Multivibrators, Flip-Flop Astable Multivibrators, Digital ... Read More
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Nibbler Depaneling Machine Market Forecasts to 2030 – Global Analysis By Type (Mechanical Nibbler Depaneling Machines, Laser Nibbler Depaneling Machines and Other Types), Application (Consumer Electronics, Automotive Electronics, Industrial Equipment, Communications, Medical Devices, Military and Aerospace and Other Applications) and by Geography
Nibbler Depaneling Machine Market Forecasts to 2030 – Global Analysis By Type (Mechanical Nibbler Depaneling Machines, Laser Nibbler Depaneling Machines and Other Types), Application (Consumer Electronics, Automotive Electronics, Industrial Equipment, Communications, Medical Devices, Military and Ae ... Read More
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High Speed Exposure Machine Market Forecasts to 2030 – Global Analysis By Type (Fully Automatic and Semi-Automatic), By Application (3D Printing, Medical Imaging, Printed Circuit Board (PCB) Manufacturing and Other Applications) and By Geography
High Speed Exposure Machine Market Forecasts to 2030 – Global Analysis By Type (Fully Automatic and Semi-Automatic), By Application (3D Printing, Medical Imaging, Printed Circuit Board (PCB) Manufacturing and Other Applications) and By Geography According to Stratistics MRC, the Global High Speed Ex ... Read More
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5G Chipset Market Forecasts to 2028 – Global Analysis By Product (Customer Premises Equipment, Network Infrastructure Equipment and Other Products), Type (MODEMs, RFICs and Other Types), IC Type, Node Type, Operational Frequency, Application, End User and By Geography
5G Chipset Market Forecasts to 2028 – Global Analysis By Product (Customer Premises Equipment, Network Infrastructure Equipment and Other Products), Type (MODEMs, RFICs and Other Types), IC Type, Node Type, Operational Frequency, Application, End User and By Geography According to Stratistics MRC, t ... Read More
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Patterning Material Market Forecasts to 2028 – Global Analysis By Product (Positive 248 nm, Positive 193 nm Dry Resist, I-line and g-line, TARC, 193 NM dry immersion resist and Other Products), By Application (MEMS and NEMS Devices, Integrated Circuits and PCBs, Dynamic Random Access Memory, Automotive Sensors, Glass Printed Circuit Board, Lab on-chip and Organ on-chip devices and Other Applications) and By Geography
Patterning Material Market Forecasts to 2028 – Global Analysis By Product (Positive 248 nm, Positive 193 nm Dry Resist, I-line and g-line, TARC, 193 NM dry immersion resist and Other Products), By Application (MEMS and NEMS Devices, Integrated Circuits and PCBs, Dynamic Random Access Memory, Automot ... Read More
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3D IC and 2.5D IC Packaging Market Forecasts to 2028 – Global Analysis By Packaging Technology (3D Through-Silicon Via (TSV), 3D Wafer-Level Chip-Scale Packaging (WLCSP) and 2.5D), Application (Imaging & Optoelectronics, Memory, Logic, MEMS/Sensors, LED and Other Applications), End User and By Geography
3D IC and 2.5D IC Packaging Market Forecasts to 2028 – Global Analysis By Packaging Technology (3D Through-Silicon Via (TSV), 3D Wafer-Level Chip-Scale Packaging (WLCSP) and 2.5D), Application (Imaging & Optoelectronics, Memory, Logic, MEMS/Sensors, LED and Other Applications), End User and By Geogr ... Read More
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IoT Node and Gateway Market Forecasts to 2028 – Global Analysis By Hardware (Connectivity IC, Logic Device, Memory Device, Processor and Sensor), Connectivity (Bluetooth, Ethernet, Wi-Fi, ZigBee, Z-Waves and Other Connectivity), End user (Aerospace & Defense, Automotive & Transportation, Banking, Financial Service & Insurance (BFSI), Building & Automation and Other Applications) and By Geography
IoT Node and Gateway Market Forecasts to 2028 – Global Analysis By Hardware (Connectivity IC, Logic Device, Memory Device, Processor and Sensor), Connectivity (Bluetooth, Ethernet, Wi-Fi, ZigBee, Z-Waves and Other Connectivity), End user (Aerospace & Defense, Automotive & Transportation, Banking, Fi ... Read More
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Radiation Hardened Electronics Market Forecasts to 2028 – Global Analysis By Component (Logic, Field-Programmable Gate Array and Other Components), Technique (Radiation Hardening by Process and Radiation Hardening by Design and Other Techniques), Material Type (Gallium Nitride, Silicon and Silicon Carbide), Product Type, Application and By Geography
Radiation Hardened Electronics Market Forecasts to 2028 – Global Analysis By Component (Logic, Field-Programmable Gate Array and Other Components), Technique (Radiation Hardening by Process and Radiation Hardening by Design and Other Techniques), Material Type (Gallium Nitride, Silicon and Silicon C ... Read More
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Automotive Transmission Market Forecasts to 2028 – Global Analysis By Transmission Type (Automatic Transmission, Manual Transmission and others), Vehicle Type (Passenger Cars, Light Commercial Vehicles and other Vehicle Types), Fuel Type (Diesel, Gasoline and Hybrid), Engine (Electric and IC Engine), Gear Type (Spur Gear, Planetary, Helical Gear and Other Gear Types), Gear Material and By Geography
Automotive Transmission Market Forecasts to 2028 – Global Analysis By Transmission Type (Automatic Transmission, Manual Transmission and others), Vehicle Type (Passenger Cars, Light Commercial Vehicles and other Vehicle Types), Fuel Type (Diesel, Gasoline and Hybrid), Engine (Electric and IC Engine) ... Read More
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Automated Test Equipment Market Forecasts to 2028 – Global Analysis By Product (Memory ATE, Discrete ATE and Other Products), Type (Printed Circuit Board (PCB) Testing, Hard Disk Drive Testing and Other Types), Component (Handlers/Probers, Industrial PCs and Other Components), End User (Consumer Electronics, Aerospace & Defence and Other End Users), and Geography
Automated Test Equipment Market Forecasts to 2028 – Global Analysis By Product (Memory ATE, Discrete ATE and Other Products), Type (Printed Circuit Board (PCB) Testing, Hard Disk Drive Testing and Other Types), Component (Handlers/Probers, Industrial PCs and Other Components), End User (Consumer Ele ... Read More
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Edge AI Hardware Market Forecasts to 2028 – Global Analysis By Device (Smartphones, Surveillance Cameras, Wearables and Other Devices), Power Consumption (Less than 1 W, 1-3 W, 3-5 W, 5-10 W and More Than 10 W), Processor (Central Processing Unit (CPU), Graphics Processing Unit (GPU), Application Specific Integrated Circuit (ASIC) and Other Processors), Function (Inference and Training), Component (Memory, Sensor and Other Components), End User (Consumer Electronics, Smart Home, Automotive & Transportation, Healthcare, Industrial, Aerospace & Defense and Construction) and Geography
Edge AI Hardware Market Forecasts to 2028 – Global Analysis By Device (Smartphones, Surveillance Cameras, Wearables and Other Devices), Power Consumption (Less than 1 W, 1-3 W, 3-5 W, 5-10 W and More Than 10 W), Processor (Central Processing Unit (CPU), Graphics Processing Unit (GPU), Application Sp ... Read More
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Data Center Chip Market Forecasts to 2028 – Global Analysis By Data Center Size (Large Size, Small & Medium Size), Chip Type (Field Programmable Gate Arrays (FPGA), Application Specific Integrated Circuit (ASIC), Graphics Processing Unit (GPU), Central Processing Unit (CPU)), Industry (Manufacturing, Retail, Banking, Financial Services & Insurance (BFSI), Government, IT & Telecom, Energy & Utilities, Transportation), and Geography
Data Center Chip Market Forecasts to 2028 – Global Analysis By Data Center Size (Large Size, Small & Medium Size), Chip Type (Field Programmable Gate Arrays (FPGA), Application Specific Integrated Circuit (ASIC), Graphics Processing Unit (GPU), Central Processing Unit (CPU)), Industry (Manufacturing ... Read More
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Automotive Thermal System Market Forecasts to 2028 – Global Analysis By Vehicle Type (Off-road Vehicle, Passenger Vehicle and other Vehicle Type), Component (Fluid Transport, Powertrain Cooling, Compressor and Heating, ventilation, and air conditioning (HVAC)), Propulsion Type (Electric & Hybrid Vehicles, IC Engine Vehicles), Application and Geography
Automotive Thermal System Market Forecasts to 2028 – Global Analysis By Vehicle Type (Off-road Vehicle, Passenger Vehicle and other Vehicle Type), Component (Fluid Transport, Powertrain Cooling, Compressor and Heating, ventilation, and air conditioning (HVAC)), Propulsion Type (Electric & Hybrid Veh ... Read More
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Automotive Battery Market Forecasts to 2028 - Global Analysis By Battery Type (Lithium-Ion, Lead Acid and Other Battery Types), Vehicle Type (Commercial Vehicles and Passenger Cars), Engine Type (Electric Vehicle and Internal Combustion (IC) Engine), Function (Electric Propulsion, Ignition and Lighting), Sales Channel (Aftermarket and OEM (Original Equipment Manufacturer)) and Geography
Automotive Battery Market Forecasts to 2028 - Global Analysis By Battery Type (Lithium-Ion, Lead Acid and Other Battery Types), Vehicle Type (Commercial Vehicles and Passenger Cars), Engine Type (Electric Vehicle and Internal Combustion (IC) Engine), Function (Electric Propulsion, Ignition and Light ... Read More
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Data Center Accelerator Market Forecasts to 2028 – Global Analysis By Processor (Graphical Processing Unit (GPU), Application Specific Integrated Circuit (ASIC), Central Processing Unit (CPU), Field Programmable Gate Array (FPGA) and Other Processors), Type (Cloud Accelerator, High Performance Computing Accelerator and Other Types), Application, End User and By Geography
Data Center Accelerator Market Forecasts to 2028 – Global Analysis By Processor (Graphical Processing Unit (GPU), Application Specific Integrated Circuit (ASIC), Central Processing Unit (CPU), Field Programmable Gate Array (FPGA) and Other Processors), Type (Cloud Accelerator, High Performance Compu ... Read More
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Microprocessor Market Forecasts to 2028 – Global Analysis By Technology (Superscalar, Digital Signal Processor (DSP), Complex Instruction Set Computer (CISC), Application Specific Integrated Circuit (ASIC), Reduced Instruction Set Computer (RISC), Other Technologies), Application (Tablets, Smartphones, Servers, Embedded Devices, Personal Computers, Other Applications), and Geography
Microprocessor Market Forecasts to 2028 – Global Analysis By Technology (Superscalar, Digital Signal Processor (DSP), Complex Instruction Set Computer (CISC), Application Specific Integrated Circuit (ASIC), Reduced Instruction Set Computer (RISC), Other Technologies), Application (Tablets, Smartphon ... Read More
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