Category: Integrated Circuits
Integrated Circuits market research reports by MarketsandMarkets
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High-performance Polyamides Market by Type (PA 11, PA 12, PA 9T, PA 46, PARA, PPA, Other Types), Manufacturing Process (Injection & Blow Molding), End-Use Industry (Automotive, Electrical & Electronics, Medical, Industrial) - Global Forecast to 2029
The high-performance polyamides market is estimated at USD 2.08 Billion in 2024 and is projected to reach USD 2.72 Billion by 2029, at a CAGR of 5.5% from 2024 to 2029. Growing automotive and transportation industry, boosted by the revolution towards electric cars (EVs) and more stringent environmen ... Read More
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Energy Harvesting System Market by Light Energy Harvesting, Vibration Energy Harvesting, RF Energy Harvesting, Thermal Energy Harvesting, Transducers, Power Management Integrated Circuits, Building & Home Automation - Global Forecast to 2030
The energy harvesting system market is expected to grow from USD 0.61 billion in 2025 to USD 0.94 billion in 2030, at a CAGR of 9.1% during the forecast period. The major drivers contributing to the market growth are the adoption of sensors in wearable electronics and the expansion of smart cities a ... Read More
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System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029
The System-on-Chip (SoC) market is expected to be worth USD 138.46 billion in 2024 and is estimated to reach USD 205.97 billion by 2029, growing at a CAGR of 8.3% between 2024 and 2029. Advanced driver-assistance systems form an important contributor to the growth of SoC in autonomous vehicles. The ... Read More
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Monolithic Microwave IC Market by Component (Power Amplifiers, Low Noise Amplifiers, Switches), Material Type (GaAs, InP, GaN), Frequency Band (L, S, C, X, Ku, K, Ka, V, W), Technology (MESFET, HEMT, pHEMT, mHEMT, E- pHEMT) - Global Forecast to 2030
The global monolithic microwave IC market is expected to grow from USD 14.53 billion in 2025 to USD 23.91 billion by 2030 at a CAGR of 10.5% during the forecast period 2025–2030 growing adoption of MMICs in the automotive sector. The automotive sector is growing at a rapidly driven by the increasing ... Read More
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Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029
The semiconductor manufacturing equipment market is projected to reach USD 155.09 billion by 2029 from USD 109.24 billion in 2024 at a CAGR of 7.3% during the forecast period. The major factors driving the growth of the market are expansion of semiconductor fabrication facilities, surge in automotiv ... Read More
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Power Electronic Testing Market by Power Discrete (Diode, Transistor, Thyristor), Power Module, Power Integrated Circuit (IC); Electromagnetic Compatibility (EMC) Testing, Radio Frequency (RF) Testing, Energy Efficiency Testing - Global Forecast to 2029
The global power electronics testing was valued at USD 5.7 billion in 2024 and is projected to reach USD 9.3 billion by 2029; it is expected to register a CAGR of 10.2% during the forecast period. Due to the development of electric vehicles and the potential for renewable energy, power electronics w ... Read More
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Extreme Ultraviolet (EUV) Lithography Market by Component (Light Sources, Optics, Masks, EUV Metrology, EUV Sensors, EUV Subassembly) and End User (Integrated Device Manufacturers (IDMs), Foundries) - Global Forecast to 2029
Extreme Ultraviolet (EUV) Lithography Market by Component (Light Sources, Optics, Masks, EUV Metrology, EUV Sensors, EUV Subassembly) and End User (Integrated Device Manufacturers (IDMs), Foundries) - Global Forecast to 2029 The EUV lithography market is expected to reach USD 22.69 billion by 2029 f ... Read More
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Data Center Chip Market by Offerings (GPU, CPU, FPGA, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory (DRAM (HBM, DDR)), Network (NIC/Network Adapters, Interconnects)) – Global Forecast to 2030
Data Center Chip Market by Offerings (GPU, CPU, FPGA, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory (DRAM (HBM, DDR)), Network (NIC/Network Adapters, Interconnects)) – Global Forecast to 2030 The global data center chip market is expected to grow from USD 206.96 billion in 2025 to USD ... Read More
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NFC Market by Offering (NFC ICs, NFC Antennas, NFC Tags, NFC Readers), Operating Mode (Reader Emulation, Peer-to-Peer, Card Emulation), Use Cases (Payment and Transactions, Product Identification, Ticketing, Access Control) - Global Forecast to 2029
NFC Market by Offering (NFC ICs, NFC Antennas, NFC Tags, NFC Readers), Operating Mode (Reader Emulation, Peer-to-Peer, Card Emulation), Use Cases (Payment and Transactions, Product Identification, Ticketing, Access Control) - Global Forecast to 2029 The global NFC market was valued at USD 21.69 bill ... Read More
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System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029
System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029 The System-on-Chip (SoC) market is expected t ... Read More
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AI Chip Market by Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory (DRAM (HBM, DDR)), Network (NIC/Network Adapters, Interconnects)), Function (Training, Inference) & Region – Global Forecast to 2029
AI Chip Market by Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory (DRAM (HBM, DDR)), Network (NIC/Network Adapters, Interconnects)), Function (Training, Inference) & Region – Global Forecast to 2029 The AI Chip market is projected to grow from USD 12 ... Read More
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IoT Node and Gateway Market by Hardware (Processor, Connectivity IC, Sensor, Memory, Logic Devices), End-use Application (Consumer Electronics, Building Automation, Automotive & Transportation, Wearable Devices, Retail) and Region - Global Forecast to 2029
IoT Node and Gateway Market by Hardware (Processor, Connectivity IC, Sensor, Memory, Logic Devices), End-use Application (Consumer Electronics, Building Automation, Automotive & Transportation, Wearable Devices, Retail) and Region - Global Forecast to 2029 The IoT Node and Gateway market is projecte ... Read More
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Digital Signal Processor Market by Core (Single Core, Multi-Core), Configuration (Low-end, Mid-range, High-end), Type (General-purpose, Application-specific), Category, IC Design, Application, End-User Industry and Region - Global Forecast to 2029
Digital Signal Processor Market by Core (Single Core, Multi-Core), Configuration (Low-end, Mid-range, High-end), Type (General-purpose, Application-specific), Category, IC Design, Application, End-User Industry and Region - Global Forecast to 2029 The Digital Signal Processor market is projected to ... Read More
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Micro Combined Heat and Power Market by Technology (IC Engine, PEMFC, Rankine Cycle Engine, Stirling Engine, SOFC), Type (Engine, Fuel Cell), Application (Residential, Commercial), Capacity (<5kW, 5–10kW, 10–50kW) and Region - Global Forecast to 2029
Micro Combined Heat and Power Market by Technology (IC Engine, PEMFC, Rankine Cycle Engine, Stirling Engine, SOFC), Type (Engine, Fuel Cell), Application (Residential, Commercial), Capacity (<5kW, 5–10kW, 10–50kW) and Region - Global Forecast to 2029 The global Micro combined heat and power market i ... Read More
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IoT Technology Market by Node Component (Sensor, Memory Device, Connectivity IC, Processor, Logic Devices), Software Solution (Remote Monitoring, Data Management), Platform, Service, End-use Application, Geography - Global Forecast to 2029
IoT Technology Market by Node Component (Sensor, Memory Device, Connectivity IC, Processor, Logic Devices), Software Solution (Remote Monitoring, Data Management), Platform, Service, End-use Application, Geography - Global Forecast to 2029 The IoT technology market is projected to grow from USD 945. ... Read More
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eFuse Market Type (Auto Retry, Latched), Package Type (Small Outline No Lead, Dual Flat No Leads, Quad Flat No Leads, Think Shrink Small Outline Package), Application, End User, & Region - Forecast to 2035
eFuse Market Type (Auto Retry, Latched), Package Type (Small Outline No Lead, Dual Flat No Leads, Quad Flat No Leads, Think Shrink Small Outline Package), Application, End User, & Region - Forecast to 2035 The eFuse market is estimated to grow from USD 881 million by 2035 from an estimated USD 703 m ... Read More
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029 The Semiconductor & IC packaging materials Ma ... Read More
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LED Packaging Market by Package Type (SMD, COB, CSP), Power Range (Low-&Mid-Power LED Packages, High-Power LED Packages), Wavelength (Visible & Infrared, Deep UV), Packaging Component (Equipment, Material), Application & Region - Global Forecast to 2029
LED Packaging Market by Package Type (SMD, COB, CSP), Power Range (Low-&Mid-Power LED Packages, High-Power LED Packages), Wavelength (Visible & Infrared, Deep UV), Packaging Component (Equipment, Material), Application & Region - Global Forecast to 2029 The LED packaging market is projected to reach ... Read More
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Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029
Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029 The global interposer and FOWLP market is expect ... Read More
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Commercial Vehicle Telematics Market by Offering (Software (Fleet Management, Telematics Productivity), Services), Vehicle Type (LCV, MHCV), Propulsion Type (IC Engine, Electric, Hybrid), Sales Channel, End-user and Region - Global Forecast to 2028
Commercial Vehicle Telematics Market by Offering (Software (Fleet Management, Telematics Productivity), Services), Vehicle Type (LCV, MHCV), Propulsion Type (IC Engine, Electric, Hybrid), Sales Channel, End-user and Region - Global Forecast to 2028 The commercial vehicle telematics market is project ... Read More
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Electronic Wet Chemicals Market by Type (Acetic Acid, Isopropyl Alcohol, Phosphoric Acid) Form (Liquid Form, Solid Form, Gas Form) Application (Semiconductor, IC Packaging, PCB), End-use Industry, And Region - Global Forecast to 2028
Electronic Wet Chemicals Market by Type (Acetic Acid, Isopropyl Alcohol, Phosphoric Acid) Form (Liquid Form, Solid Form, Gas Form) Application (Semiconductor, IC Packaging, PCB), End-use Industry, And Region - Global Forecast to 2028 The Electronic wet chemicals Market is projected to reach USD 5.4 ... Read More
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Power Electronics Market by Device Type (Power Discrete, Power Module, Power IC), Material (Si, SiC, GaN), Voltage (Low, Medium, High), Vertical (ICT, Consumer Electronics, Industrial, Automotive, Aerospace) and Geography - Global Forecast to 2028
Power Electronics Market by Device Type (Power Discrete, Power Module, Power IC), Material (Si, SiC, GaN), Voltage (Low, Medium, High), Vertical (ICT, Consumer Electronics, Industrial, Automotive, Aerospace) and Geography - Global Forecast to 2028 The global power electronics market was valued at US ... Read More
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Polyimide Films & Tapes Market by Application (Flexible Printed Circuits, Specialty Fabricated Products, Pressure-Sensitive Tapes, Motors/Generators, Wires & Cables), End-Use Industry (Electronics, Automotive), and Region - Global Forecast to 2028
Polyimide Films & Tapes Market by Application (Flexible Printed Circuits, Specialty Fabricated Products, Pressure-Sensitive Tapes, Motors/Generators, Wires & Cables), End-Use Industry (Electronics, Automotive), and Region - Global Forecast to 2028 The polyimide films & tapes market is estimated to b ... Read More
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Semiconductor Chemical Market Type( High Performance Polymers, Acid & Base Chemicals, Adhesives, Solvents), Application(Photoresist, Etching, Deposition, Cleaning), End-Use (Integrated Circuits, Discrete Semiconductor), & Region - Global Forecast to 2028
Semiconductor Chemical Market Type( High Performance Polymers, Acid & Base Chemicals, Adhesives, Solvents), Application(Photoresist, Etching, Deposition, Cleaning), End-Use (Integrated Circuits, Discrete Semiconductor), & Region - Global Forecast to 2028 The Semiconductor chemical market size is pro ... Read More
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Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) – Global Forecast to 2028
Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) – Global Forecast to 2028 The chiplet market is projected to grow from USD 6 ... Read More
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