Category: Integrated Circuits
Integrated Circuits market research reports by MarketsandMarkets
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NFC Market by Offering (NFC ICs, NFC Antennas, NFC Tags, NFC Readers), Operating Mode (Reader Emulation, Peer-to-Peer, Card Emulation), Use Cases (Payment and Transactions, Product Identification, Ticketing, Access Control) - Global Forecast to 2029
NFC Market by Offering (NFC ICs, NFC Antennas, NFC Tags, NFC Readers), Operating Mode (Reader Emulation, Peer-to-Peer, Card Emulation), Use Cases (Payment and Transactions, Product Identification, Ticketing, Access Control) - Global Forecast to 2029 The global NFC market was valued at USD 21.69 bill ... Read More
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Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029
Semiconductor Manufacturing Equipment Market by Lithography, Wafer Surface Conditioning, Etching, CMP, Deposition, Wafer Cleaning, Assembly & Packaging, Dicing, Bonding, Metrology, Wafer/IC Testing, Logic, Memory, MPU, Discrete - Global Forecast to 2029 The semiconductor manufacturing equipment mark ... Read More
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Power Electronic Testing Market by Power Discrete (Diode, Transistor, Thyristor), Power Module, Power Integrated Circuit (IC); Electromagnetic Compatibility (EMC) Testing, Radio Frequency (RF) Testing, Energy Efficiency Testing - Global Forecast to 2029
Power Electronic Testing Market by Power Discrete (Diode, Transistor, Thyristor), Power Module, Power Integrated Circuit (IC); Electromagnetic Compatibility (EMC) Testing, Radio Frequency (RF) Testing, Energy Efficiency Testing - Global Forecast to 2029 The global power electronics testing was value ... Read More
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System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029
System-on-Chip (SoC) Market by Core Count (Single-core, Dual-core, Quad-core, Hexa-core, Octa-core), Core Architecture (ARM, X86, RISC-V), Device (Smartphone, Tablet, Laptop, Smart TV & STB, Infotainment System, Router, Gateway) - Global Forecast to 2029 The System-on-Chip (SoC) market is expected t ... Read More
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AI Chip Market by Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory (DRAM (HBM, DDR)), Network (NIC/Network Adapters, Interconnects)), Function (Training, Inference) & Region – Global Forecast to 2029
AI Chip Market by Offerings (GPU, CPU, FPGA, NPU, TPU, Trainium, Inferentia, T-head, Athena ASIC, MTIA, LPU, Memory (DRAM (HBM, DDR)), Network (NIC/Network Adapters, Interconnects)), Function (Training, Inference) & Region – Global Forecast to 2029 The AI Chip market is projected to grow from USD 12 ... Read More
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IoT Node and Gateway Market by Hardware (Processor, Connectivity IC, Sensor, Memory, Logic Devices), End-use Application (Consumer Electronics, Building Automation, Automotive & Transportation, Wearable Devices, Retail) and Region - Global Forecast to 2029
IoT Node and Gateway Market by Hardware (Processor, Connectivity IC, Sensor, Memory, Logic Devices), End-use Application (Consumer Electronics, Building Automation, Automotive & Transportation, Wearable Devices, Retail) and Region - Global Forecast to 2029 The IoT Node and Gateway market is projecte ... Read More
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Digital Signal Processor Market by Core (Single Core, Multi-Core), Configuration (Low-end, Mid-range, High-end), Type (General-purpose, Application-specific), Category, IC Design, Application, End-User Industry and Region - Global Forecast to 2029
Digital Signal Processor Market by Core (Single Core, Multi-Core), Configuration (Low-end, Mid-range, High-end), Type (General-purpose, Application-specific), Category, IC Design, Application, End-User Industry and Region - Global Forecast to 2029 The Digital Signal Processor market is projected to ... Read More
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Micro Combined Heat and Power Market by Technology (IC Engine, PEMFC, Rankine Cycle Engine, Stirling Engine, SOFC), Type (Engine, Fuel Cell), Application (Residential, Commercial), Capacity (<5kW, 5–10kW, 10–50kW) and Region - Global Forecast to 2029
Micro Combined Heat and Power Market by Technology (IC Engine, PEMFC, Rankine Cycle Engine, Stirling Engine, SOFC), Type (Engine, Fuel Cell), Application (Residential, Commercial), Capacity (<5kW, 5–10kW, 10–50kW) and Region - Global Forecast to 2029 The global Micro combined heat and power market i ... Read More
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IoT Technology Market by Node Component (Sensor, Memory Device, Connectivity IC, Processor, Logic Devices), Software Solution (Remote Monitoring, Data Management), Platform, Service, End-use Application, Geography - Global Forecast to 2029
IoT Technology Market by Node Component (Sensor, Memory Device, Connectivity IC, Processor, Logic Devices), Software Solution (Remote Monitoring, Data Management), Platform, Service, End-use Application, Geography - Global Forecast to 2029 The IoT technology market is projected to grow from USD 945. ... Read More
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eFuse Market Type (Auto Retry, Latched), Package Type (Small Outline No Lead, Dual Flat No Leads, Quad Flat No Leads, Think Shrink Small Outline Package), Application, End User, & Region - Forecast to 2035
eFuse Market Type (Auto Retry, Latched), Package Type (Small Outline No Lead, Dual Flat No Leads, Quad Flat No Leads, Think Shrink Small Outline Package), Application, End User, & Region - Forecast to 2035 The eFuse market is estimated to grow from USD 881 million by 2035 from an estimated USD 703 m ... Read More
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Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029
Semiconductor & IC Packaging Materials Market by Type (Organic substrate, Bonding wires, Leadframes, Encapsulation resins, Ceramic packages, Die attach materials, Solder balls), Packaging Technology, End-use industry, and Region - Global Forecast to 2029 The Semiconductor & IC packaging materials Ma ... Read More
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LED Packaging Market by Package Type (SMD, COB, CSP), Power Range (Low-&Mid-Power LED Packages, High-Power LED Packages), Wavelength (Visible & Infrared, Deep UV), Packaging Component (Equipment, Material), Application & Region - Global Forecast to 2029
LED Packaging Market by Package Type (SMD, COB, CSP), Power Range (Low-&Mid-Power LED Packages, High-Power LED Packages), Wavelength (Visible & Infrared, Deep UV), Packaging Component (Equipment, Material), Application & Region - Global Forecast to 2029 The LED packaging market is projected to reach ... Read More
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Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029
Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029 The global interposer and FOWLP market is expect ... Read More
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Commercial Vehicle Telematics Market by Offering (Software (Fleet Management, Telematics Productivity), Services), Vehicle Type (LCV, MHCV), Propulsion Type (IC Engine, Electric, Hybrid), Sales Channel, End-user and Region - Global Forecast to 2028
Commercial Vehicle Telematics Market by Offering (Software (Fleet Management, Telematics Productivity), Services), Vehicle Type (LCV, MHCV), Propulsion Type (IC Engine, Electric, Hybrid), Sales Channel, End-user and Region - Global Forecast to 2028 The commercial vehicle telematics market is project ... Read More
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Electronic Wet Chemicals Market by Type (Acetic Acid, Isopropyl Alcohol, Phosphoric Acid) Form (Liquid Form, Solid Form, Gas Form) Application (Semiconductor, IC Packaging, PCB), End-use Industry, And Region - Global Forecast to 2028
Electronic Wet Chemicals Market by Type (Acetic Acid, Isopropyl Alcohol, Phosphoric Acid) Form (Liquid Form, Solid Form, Gas Form) Application (Semiconductor, IC Packaging, PCB), End-use Industry, And Region - Global Forecast to 2028 The Electronic wet chemicals Market is projected to reach USD 5.4 ... Read More
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Power Electronics Market by Device Type (Power Discrete, Power Module, Power IC), Material (Si, SiC, GaN), Voltage (Low, Medium, High), Vertical (ICT, Consumer Electronics, Industrial, Automotive, Aerospace) and Geography - Global Forecast to 2028
Power Electronics Market by Device Type (Power Discrete, Power Module, Power IC), Material (Si, SiC, GaN), Voltage (Low, Medium, High), Vertical (ICT, Consumer Electronics, Industrial, Automotive, Aerospace) and Geography - Global Forecast to 2028 The global power electronics market was valued at US ... Read More
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Polyimide Films & Tapes Market by Application (Flexible Printed Circuits, Specialty Fabricated Products, Pressure-Sensitive Tapes, Motors/Generators, Wires & Cables), End-Use Industry (Electronics, Automotive), and Region - Global Forecast to 2028
Polyimide Films & Tapes Market by Application (Flexible Printed Circuits, Specialty Fabricated Products, Pressure-Sensitive Tapes, Motors/Generators, Wires & Cables), End-Use Industry (Electronics, Automotive), and Region - Global Forecast to 2028 The polyimide films & tapes market is estimated to b ... Read More
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Semiconductor Chemical Market Type( High Performance Polymers, Acid & Base Chemicals, Adhesives, Solvents), Application(Photoresist, Etching, Deposition, Cleaning), End-Use (Integrated Circuits, Discrete Semiconductor), & Region - Global Forecast to 2028
Semiconductor Chemical Market Type( High Performance Polymers, Acid & Base Chemicals, Adhesives, Solvents), Application(Photoresist, Etching, Deposition, Cleaning), End-Use (Integrated Circuits, Discrete Semiconductor), & Region - Global Forecast to 2028 The Semiconductor chemical market size is pro ... Read More
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Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) – Global Forecast to 2028
Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) – Global Forecast to 2028 The chiplet market is projected to grow from USD 6 ... Read More
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Fault Detection and Classification (FDC) Market by offering type (Software, hardware, services), Application (Manufacturing, Packaging), end use (Automotive, Electronics & Semiconductor, Metal & Machinery) and Region - Global Forecast to 2028
Fault Detection and Classification (FDC) Market by offering type (Software, hardware, services), Application (Manufacturing, Packaging), end use (Automotive, Electronics & Semiconductor, Metal & Machinery) and Region - Global Forecast to 2028 The global fault detection and classification market was ... Read More
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Conformal Coating Market by Type (Acrylic, Silicone, Epoxy, Urethane, and Parylene), End-Use (Consumer Electronics, Automotive, Aerospace & Defense, Industrial and Telecommunication), and Region - Global Forecast to 2028
Conformal Coating Market by Type (Acrylic, Silicone, Epoxy, Urethane, and Parylene), End-Use (Consumer Electronics, Automotive, Aerospace & Defense, Industrial and Telecommunication), and Region - Global Forecast to 2028 The Conformal coatings market size is estimated to be USD 1.4 billion in 2023, ... Read More
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Photoresist & Photoresist Ancillaries Market by Photoresist Type (ArF Immersion, ArF Dry Film, KrF, G-line & I-line), Ancillary Type (Anti-reflective Coating, Remover, Developer), Application (Semiconductor & IC, LCD, ), Region - Global Forecast to 2028
Photoresist & Photoresist Ancillaries Market by Photoresist Type (ArF Immersion, ArF Dry Film, KrF, G-line & I-line), Ancillary Type (Anti-reflective Coating, Remover, Developer), Application (Semiconductor & IC, LCD, ), Region - Global Forecast to 2028 The photoresist and photoresist ancillaries ma ... Read More
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In-Circuit Test Market by Type (Analog, Mixed), Portability (Compact, Benchtop), Application (Consumer Electronics, Aerospace, Defence & Government Services, Medical Equipment, Wireless Communication, Automotive, Energy), Region - Global Forecast to 2028
In-Circuit Test Market by Type (Analog, Mixed), Portability (Compact, Benchtop), Application (Consumer Electronics, Aerospace, Defence & Government Services, Medical Equipment, Wireless Communication, Automotive, Energy), Region - Global Forecast to 2028 The global in-circuit test market is estimate ... Read More
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3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028 The 3D IC and 2.5D IC packaging market is projected to reach USD ... Read More
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Remote Power Panel Market by Type (Wall-mounted, Floor-standing), Application (Network Cabinets, Server Rooms, Data Centers (Cloud, Enterprise)) & Region (North America, Europe, Asia Pacific, South America, Middle East & Africa) - Global Forecast to 2028
Remote Power Panel Market by Type (Wall-mounted, Floor-standing), Application (Network Cabinets, Server Rooms, Data Centers (Cloud, Enterprise)) & Region (North America, Europe, Asia Pacific, South America, Middle East & Africa) - Global Forecast to 2028 The global remote power panel market is estim ... Read More
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