Next Generation Memory Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
Market Overview:
The global next generation memory market size reached US$ 4.8 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 21.4 Billion by 2028, exhibiting a growth rate (CAGR) of 26.9% during 2023-2028.
Next generation memory refers to a fast, efficient and cost-effective storage solution that can store more data than silicon chips. It consequently finds extensive applications in the telecommunications, information technology (IT), and banking, financial services and insurance (BFSI) industries across the globe. At present, there is a surge in the requirement for high bandwidth, low power consumption, and highly scalable memory devices that rely on artificial intelligence (AI), the Internet of things (IoT), big data and other technologies. This, in turn, is catalyzing the demand for next generation memory.
Non-Volatile
Magneto-Resistive Random-Access Memory (MRAM)
Ferroelectric RAM (FRAM)
Resistive Random-Access Memory (ReRAM)
3D Xpoint
Nano RAM
Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
Volatile
Hybrid Memory Cube (HMC)
High-Bandwidth Memory (HBM)
Breakup by Wafer Size:
200 mm
300 mm
450 mm
Breakup by Storage Type:
Mass Storage
Embedded Storage
Others
Breakup by Application:
BFSI
Consumer Electronics
Government
Telecommunications
Information Technology
Others
Breakup by Region:
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Avalanche Technology, Crossbar Inc., Fujitsu Limited, Honeywell International Inc., Infineon Technologies AG, Intel Corporation, Micron Technology Inc., Nantero Inc., Samsung Electronics Co. Ltd., SK hynix Inc., Spin Memory Inc. and Taiwan Semiconductor Manufacturing Co. Ltd.
Key Questions Answered in This Report:
How has the global next generation memory market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global next generation memory market?
What are the key regional markets?
What is the breakup of the market based on the technology?
What is the breakup of the market based on the wafer size?
What is the breakup of the market based on the storage type?
What is the breakup of the market based on the application?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global next generation memory market and who are the key players?
What is the degree of competition in the industry?
- 1 Preface
- 2 Scope and Methodology
- 2.1Objectives of the Study
- 2.2Stakeholders
- 2.3Data Sources
- 2.3.1Primary Sources
- 2.3.2Secondary Sources
- 2.4Market Estimation
- 2.4.1Bottom-Up Approach
- 2.4.2Top-Down Approach
- 2.5Forecasting Methodology
- 3Executive Summary
- 4Introduction
- 4.1Overview
- 4.2Key Industry Trends
- 5Global Next Generation Memory Market
- 5.1Market Overview
- 5.2Market Performance
- 5.3Impact of COVID-19
- 5.4Market Forecast
- 6Market Breakup by Technology
- 6.1Non-Volatile
- 6.1.1 Market Trends
- 6.1.2 Key Segments
- 6.1.2.1 Magneto-Resistive Random-Access Memory (MRAM)
- 6.1.2.2 Ferroelectric RAM (FRAM)
- 6.1.2.3 Resistive Random-Access Memory (ReRAM)
- 6.1.2.4 3D Xpoint
- 6.1.2.5 Nano RAM
- 6.1.2.6 Other Non-Volatile Technologies (Phase change RAM, STT-RAM, and SRAM)
- 6.1.3 Market Forecast
- 6.2Volatile
- 6.2.1 Market Trends
- 6.2.2 Key Segments
- 6.2.2.1 Hybrid Memory Cube (HMC)
- 6.2.2.2 High-Bandwidth Memory (HBM)
- 6.2.3 Market Forecast
- 7Market Breakup by Wafer Size
- 7.1200 mm
- 7.1.1 Market Trends
- 7.1.2 Market Forecast
- 7.2300 mm
- 7.2.1 Market Trends
- 7.2.2 Market Forecast
- 7.3450 mm
- 7.3.1 Market Trends
- 7.3.2 Market Forecast
- 8Market Breakup by Storage Type
- 8.1Mass Storage
- 8.1.1 Market Trends
- 8.1.2 Market Forecast
- 8.2Embedded Storage
- 8.2.1 Market Trends
- 8.2.2 Market Forecast
- 8.3Others
- 8.3.1 Market Trends
- 8.3.2 Market Forecast
- 9Market Breakup by Application
- 9.1BFSI
- 9.1.1 Market Trends
- 9.1.2 Market Forecast
- 9.2Consumer Electronics
- 9.2.1 Market Trends
- 9.2.2 Market Forecast
- 9.3Government
- 9.3.1 Market Trends
- 9.3.2 Market Forecast
- 9.4Telecommunications
- 9.4.1 Market Trends
- 9.4.2 Market Forecast
- 9.5Information Technology
- 9.5.1 Market Trends
- 9.5.2 Market Forecast
- 9.6Others
- 9.6.1 Market Trends
- 9.6.2 Market Forecast
- 10Market Breakup by Region
- 10.1North America
- 10.1.1 United States
- 10.1.1.1 Market Trends
- 10.1.1.2 Market Forecast
- 10.1.2 Canada
- 10.1.2.1 Market Trends
- 10.1.2.2 Market Forecast
- 10.2Asia-Pacific
- 10.2.1 China
- 10.2.1.1 Market Trends
- 10.2.1.2 Market Forecast
- 10.2.2 Japan
- 10.2.2.1 Market Trends
- 10.2.2.2 Market Forecast
- 10.2.3 India
- 10.2.3.1 Market Trends
- 10.2.3.2 Market Forecast
- 10.2.4 South Korea
- 10.2.4.1 Market Trends
- 10.2.4.2 Market Forecast
- 10.2.5 Australia
- 10.2.5.1 Market Trends
- 10.2.5.2 Market Forecast
- 10.2.6 Indonesia
- 10.2.6.1 Market Trends
- 10.2.6.2 Market Forecast
- 10.2.7 Others
- 10.2.7.1 Market Trends
- 10.2.7.2 Market Forecast
- 10.3Europe
- 10.3.1 Germany
- 10.3.1.1 Market Trends
- 10.3.1.2 Market Forecast
- 10.3.2 France
- 10.3.2.1 Market Trends
- 10.3.2.2 Market Forecast
- 10.3.3 United Kingdom
- 10.3.3.1 Market Trends
- 10.3.3.2 Market Forecast
- 10.3.4 Italy
- 10.3.4.1 Market Trends
- 10.3.4.2 Market Forecast
- 10.3.5 Spain
- 10.3.5.1 Market Trends
- 10.3.5.2 Market Forecast
- 10.3.6 Russia
- 10.3.6.1 Market Trends
- 10.3.6.2 Market Forecast
- 10.3.7 Others
- 10.3.7.1 Market Trends
- 10.3.7.2 Market Forecast
- 10.4Latin America
- 10.4.1 Brazil
- 10.4.1.1 Market Trends
- 10.4.1.2 Market Forecast
- 10.4.2 Mexico
- 10.4.2.1 Market Trends
- 10.4.2.2 Market Forecast
- 10.4.3 Others
- 10.4.3.1 Market Trends
- 10.4.3.2 Market Forecast
- 10.5Middle East and Africa
- 10.5.1 Market Trends
- 10.5.2 Market Breakup by Country
- 10.5.3 Market Forecast
- 11SWOT Analysis
- 11.1Overview
- 11.2Strengths
- 11.3Weaknesses
- 11.4Opportunities
- 11.5Threats
- 12Value Chain Analysis
- 13Porters Five Forces Analysis
- 13.1Overview
- 13.2Bargaining Power of Buyers
- 13.3Bargaining Power of Suppliers
- 13.4Degree of Competition
- 13.5Threat of New Entrants
- 13.6Threat of Substitutes
- 14Price Analysis
- 15Competitive Landscape
- 15.1Market Structure
- 15.2Key Players
- 15.3Profiles of Key Players
- 15.3.1Avalanche Technology
- 15.3.1.1 Company Overview
- 15.3.1.2 Product Portfolio
- 15.3.2Crossbar Inc.
- 15.3.2.1 Company Overview
- 15.3.2.2 Product Portfolio
- 15.3.3Fujitsu Limited
- 15.3.3.1 Company Overview
- 15.3.3.2 Product Portfolio
- 15.3.3.3 Financials
- 15.3.3.4 SWOT Analysis
- 15.3.4Honeywell International Inc.
- 15.3.4.1 Company Overview
- 15.3.4.2 Product Portfolio
- 15.3.4.3 Financials
- 15.3.4.4 SWOT Analysis
- 15.3.5Infineon Technologies AG
- 15.3.5.1 Company Overview
- 15.3.5.2 Product Portfolio
- 15.3.5.3 Financials
- 15.3.5.4 SWOT Analysis
- 15.3.6Intel Corporation
- 15.3.6.1 Company Overview
- 15.3.6.2 Product Portfolio
- 15.3.6.3 Financials
- 15.3.6.4 SWOT Analysis
- 15.3.7Micron Technology Inc.
- 15.3.7.1 Company Overview
- 15.3.7.2 Product Portfolio
- 15.3.7.3 Financials
- 15.3.7.4 SWOT Analysis
- 15.3.8Nantero Inc.
- 15.3.8.1 Company Overview
- 15.3.8.2 Product Portfolio
- 15.3.9Samsung Electronics Co. Ltd.
- 15.3.9.1 Company Overview
- 15.3.9.2 Product Portfolio
- 15.3.9.3 Financials
- 15.3.10SK hynix Inc.
- 15.3.10.1 Company Overview
- 15.3.10.2 Product Portfolio
- 15.3.10.3 Financials
- 15.3.10.4 SWOT Analysis
- 15.3.11Spin Memory Inc.
- 15.3.11.1 Company Overview
- 15.3.11.2 Product Portfolio
- 15.3.12Taiwan Semiconductor Manufacturing Co. Ltd.
- 15.3.12.1 Company Overview
- 15.3.12.2 Product Portfolio
- 15.3.12.3 Financials
- 15.3.12.4 SWOT Analysis
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