Envelope Tracking Chips Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028

Envelope Tracking Chips Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028


The global envelope tracking chips market size reached US$ 2,019.6 Million in 2022. Looking forward, IMARC Group expects the market to reach US$ 3,498.5 Million by 2028, exhibiting a growth rate (CAGR) of 9.59% during 2022-2028.

An envelope tracking (ET) chip is a power management device that is utilized to enhance energy efficiency and reduce heat dissipation in radio frequency (RF) devices. It is widely used in tablets, tactical radios, wearables, smartphones and global positioning system (GPS) tracking devices. It is also utilized in AM broadcast transmitters and other electronic devices and cellular communication systems to ensure enhanced efficiency at instantaneous power levels. In comparison to the traditionally used power management systems, ET chips offer improved cost-effectiveness, battery life and operational efficiency of signal amplifiers. As a result, they find extensive applications across various industries, such as automotive, healthcare, electronics, aerospace and telecommunication.

Envelope tracking chips Market Trends:
Significant growth in the electronics industry across the globe is creating a positive outlook for the market. Envelope tracking chips are widely used in electronic devices to adjust the power amplifier voltage for ensuring optimal performance. Additionally, the increasing demand for wireless communication platforms is providing a thrust to the market growth. These chips are widely used in feature phones, Wi-Fi and wireless network enable surveillance systems (WNESS). Moreover, the integration of connected devices with the Internet of Things (IoT) and the increasing demand for 4G services are favoring the market growth. These chips aid in reducing the power consumption in 4G LTE multi-mode systems used in smartphones and tablets. In line with this, the increasing product adoption in the automotive and aerospace industries is positively impacting the market growth. ET chips aid in controlling power steering, trigger airbags and monitor brake functioning. Other factors, including the rising penetration of high-speed internet, along with the widespread utilization of advanced technologies, such as Zigbee, in light and compact application devices, are anticipated to drive the market toward growth.

Key Market Segmentation:
IMARC Group provides an analysis of the key trends in each segment of the global envelope tracking chips market report, along with forecasts at the global, regional and country levels from 2023-2028. Our report has categorized the market based on technology, application and end user.

Breakup by Technology:

Cellular Communications
Wireless Communications
Satellite Communications

Breakup by Application:

Smart Phones
Wearable Devices
Others

Breakup by End User:

Consumer Electronics
Space and Aviation
Automotive
Telecommunications
Others

Breakup by Region:

North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa

Competitive Landscape:
The competitive landscape of the industry has also been examined along with the profiles of the key players being Analog Devices Inc., Broadcom Inc., Efficient Power Conversion Corporation, Keysight Technologies Inc., MediaTek Inc., Qorvo Inc., Qualcomm Incorporated, R2 Semiconductor Inc., Rohde & Schwarz GmbH & Co KG, Samsung Electronics Co. Ltd., Skyworks Solutions Inc. and Texas Instruments Incorporated.

Key Questions Answer ed in This Report:
How has the global envelope tracking chips market performed so far and how will it perform in the coming years?
What has been the impact of COVID-19 on the global envelope tracking chips market?
What are the key regional markets?
What is the breakup of the market based on the technology?
What is the breakup of the market based on the application?
What is the breakup of the market based on the end user?
What are the various stages in the value chain of the industry?
What are the key driving factors and challenges in the industry?
What is the structure of the global envelope tracking chips market and who are the key players?
What is the degree of competition in the industry?


1 Preface
2 Scope and Methodology
2.1 Objectives of the Study
2.2 Stakeholders
2.3 Data Sources
2.3.1 Primary Sources
2.3.2 Secondary Sources
2.4 Market Estimation
2.4.1 Bottom-Up Approach
2.4.2 Top-Down Approach
2.5 Forecasting Methodology
3 Executive Summary
4 Introduction
4.1 Overview
4.2 Key Industry Trends
5 Global Envelope Tracking Chips Market
5.1 Market Overview
5.2 Market Performance
5.3 Impact of COVID-19
5.4 Market Forecast
6 Market Breakup by Technology
6.1 Cellular Communications
6.1.1 Market Trends
6.1.2 Market Forecast
6.2 Wireless Communications
6.2.1 Market Trends
6.2.2 Market Forecast
6.3 Satellite Communications
6.3.1 Market Trends
6.3.2 Market Forecast
7 Market Breakup by Application
7.1 Smart Phones
7.1.1 Market Trends
7.1.2 Market Forecast
7.2 Wearable Devices
7.2.1 Market Trends
7.2.2 Market Forecast
7.3 Others
7.3.1 Market Trends
7.3.2 Market Forecast
8 Market Breakup by End User
8.1 Consumer Electronics
8.1.1 Market Trends
8.1.2 Market Forecast
8.2 Space and Aviation
8.2.1 Market Trends
8.2.2 Market Forecast
8.3 Automotive
8.3.1 Market Trends
8.3.2 Market Forecast
8.4 Telecommunications
8.4.1 Market Trends
8.4.2 Market Forecast
8.5 Others
8.5.1 Market Trends
8.5.2 Market Forecast
9 Market Breakup by Region
9.1 North America
9.1.1 United States
9.1.1.1 Market Trends
9.1.1.2 Market Forecast
9.1.2 Canada
9.1.2.1 Market Trends
9.1.2.2 Market Forecast
9.2 Asia-Pacific
9.2.1 China
9.2.1.1 Market Trends
9.2.1.2 Market Forecast
9.2.2 Japan
9.2.2.1 Market Trends
9.2.2.2 Market Forecast
9.2.3 India
9.2.3.1 Market Trends
9.2.3.2 Market Forecast
9.2.4 South Korea
9.2.4.1 Market Trends
9.2.4.2 Market Forecast
9.2.5 Australia
9.2.5.1 Market Trends
9.2.5.2 Market Forecast
9.2.6 Indonesia
9.2.6.1 Market Trends
9.2.6.2 Market Forecast
9.2.7 Others
9.2.7.1 Market Trends
9.2.7.2 Market Forecast
9.3 Europe
9.3.1 Germany
9.3.1.1 Market Trends
9.3.1.2 Market Forecast
9.3.2 France
9.3.2.1 Market Trends
9.3.2.2 Market Forecast
9.3.3 United Kingdom
9.3.3.1 Market Trends
9.3.3.2 Market Forecast
9.3.4 Italy
9.3.4.1 Market Trends
9.3.4.2 Market Forecast
9.3.5 Spain
9.3.5.1 Market Trends
9.3.5.2 Market Forecast
9.3.6 Russia
9.3.6.1 Market Trends
9.3.6.2 Market Forecast
9.3.7 Others
9.3.7.1 Market Trends
9.3.7.2 Market Forecast
9.4 Latin America
9.4.1 Brazil
9.4.1.1 Market Trends
9.4.1.2 Market Forecast
9.4.2 Mexico
9.4.2.1 Market Trends
9.4.2.2 Market Forecast
9.4.3 Others
9.4.3.1 Market Trends
9.4.3.2 Market Forecast
9.5 Middle East and Africa
9.5.1 Market Trends
9.5.2 Market Breakup by Country
9.5.3 Market Forecast
10 SWOT Analysis
10.1 Overview
10.2 Strengths
10.3 Weaknesses
10.4 Opportunities
10.5 Threats
11 Value Chain Analysis
12 Porters Five Forces Analysis
12.1 Overview
12.2 Bargaining Power of Buyers
12.3 Bargaining Power of Suppliers
12.4 Degree of Competition
12.5 Threat of New Entrants
12.6 Threat of Substitutes
13 Price Analysis
14 Competitive Landscape
14.1 Market Structure
14.2 Key Players
14.3 Profiles of Key Players
14.3.1 Analog Devices Inc.
14.3.1.1 Company Overview
14.3.1.2 Product Portfolio
14.3.1.3 Financials
14.3.1.4 SWOT Analysis
14.3.2 Broadcom Inc.
14.3.2.1 Company Overview
14.3.2.2 Product Portfolio
14.3.2.3 Financials
14.3.2.4 SWOT Analysis
14.3.3 Efficient Power Conversion Corporation
14.3.3.1 Company Overview
14.3.3.2 Product Portfolio
14.3.4 Keysight Technologies Inc.
14.3.4.1 Company Overview
14.3.4.2 Product Portfolio
14.3.4.3 Financials
14.3.4.4 SWOT Analysis
14.3.5 MediaTek Inc.
14.3.5.1 Company Overview
14.3.5.2 Product Portfolio
14.3.5.3 Financials
14.3.5.4 SWOT Analysis
14.3.6 Qorvo Inc.
14.3.6.1 Company Overview
14.3.6.2 Product Portfolio
14.3.6.3 Financials
14.3.6.4 SWOT Analysis
14.3.7 Qualcomm Incorporated
14.3.7.1 Company Overview
14.3.7.2 Product Portfolio
14.3.7.3 Financials
14.3.7.4 SWOT Analysis
14.3.8 R2 Semiconductor Inc.
14.3.8.1 Company Overview
14.3.8.2 Product Portfolio
14.3.9 Rohde & Schwarz GmbH & Co KG
14.3.9.1 Company Overview
14.3.9.2 Product Portfolio
14.3.10 Samsung Electronics Co. Ltd.
14.3.10.1 Company Overview
14.3.10.2 Product Portfolio
14.3.10.3 Financials
14.3.10.4 SWOT Analysis
14.3.11 Skyworks Solutions Inc.
14.3.11.1 Company Overview
14.3.11.2 Product Portfolio
14.3.11.3 Financials
14.3.11.4 SWOT Analysis
14.3.12 Texas Instruments Incorporated
14.3.12.1 Company Overview
14.3.12.2 Product Portfolio
14.3.12.3 Financials
14.3.12.4 SWOT Analysis

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