Category: Integrated Circuits
Integrated Circuits market research reports by 360iResearch
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5G Infrastructure Market by Chip Set (Application-Specific Integrated Circuit, Cellular Integrated Circuits, Millimeter Wave Technology Chips), Component (Hardware, Services), Technology, Communication Infrastructure, Network Architecture, Operational Frequency, Application - Global Forecast 2024-2030
5G Infrastructure Market by Chip Set (Application-Specific Integrated Circuit, Cellular Integrated Circuits, Millimeter Wave Technology Chips), Component (Hardware, Services), Technology, Communication Infrastructure, Network Architecture, Operational Frequency, Application - Global Forecast 2024-20 ... Read More
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Semiconductor Advanced Packaging Market by Packaging Platform (2.5D & 3D IC Packaging, Embedded Die, Fan-In Wafer Level Packaging), Application (DCDC, IGBT, MOSFET) - Global Forecast 2024-2030
Semiconductor Advanced Packaging Market by Packaging Platform (2.5D & 3D IC Packaging, Embedded Die, Fan-In Wafer Level Packaging), Application (DCDC, IGBT, MOSFET) - Global Forecast 2024-2030 The Semiconductor Advanced Packaging Market size was estimated at USD 36.89 billion in 2023 and expected to ... Read More
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Data Center Accelerator Market by Processor Type (Application-Specific Integrated Circuit, Central Processing Unit, Field-Programmable Gate Array), Data Center Type (Cloud Data Centers, Colocation Data Centers, Enterprise Data Centers), Application - Global Forecast 2024-2030
Data Center Accelerator Market by Processor Type (Application-Specific Integrated Circuit, Central Processing Unit, Field-Programmable Gate Array), Data Center Type (Cloud Data Centers, Colocation Data Centers, Enterprise Data Centers), Application - Global Forecast 2024-2030 The Data Center Acceler ... Read More
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Chiplet Market by Processor (Application Processing Unit, Artificial Intelligence Application-Specific Integrated Circuit Compressor, Central Processing Unit), Packaging Technology (2.5 or 3D, Flip Chip Ball Grid Array, Flip Chip Scale Package), End-use - Global Forecast 2024-2030
Chiplet Market by Processor (Application Processing Unit, Artificial Intelligence Application-Specific Integrated Circuit Compressor, Central Processing Unit), Packaging Technology (2.5 or 3D, Flip Chip Ball Grid Array, Flip Chip Scale Package), End-use - Global Forecast 2024-2030 The Chiplet Market ... Read More
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Polyimide Films & Tapes Market by Polyimide Type (Aliphatic, Aromatic, Semi-aromatic), Application (Flexible Printed Circuits, Motors or Generators, Pressure Sensitive Tapes), End-Use industry - Global Forecast 2024-2030
Polyimide Films & Tapes Market by Polyimide Type (Aliphatic, Aromatic, Semi-aromatic), Application (Flexible Printed Circuits, Motors or Generators, Pressure Sensitive Tapes), End-Use industry - Global Forecast 2024-2030 The Polyimide Films & Tapes Market size was estimated at USD 1.60 billion in 20 ... Read More
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Colorless Polyimide Films Market by Type (Alicyclic CPI, Fluorinated CPI, Noncoplanar CPI), Application (Drug Delivery Tubes, Flexible Displays, Flexible Printed Circuit Boards), End-User - Global Forecast 2024-2030
Colorless Polyimide Films Market by Type (Alicyclic CPI, Fluorinated CPI, Noncoplanar CPI), Application (Drug Delivery Tubes, Flexible Displays, Flexible Printed Circuit Boards), End-User - Global Forecast 2024-2030 The Colorless Polyimide Films Market size was estimated at USD 7.65 billion in 2023 ... Read More
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Co-Packaged Optics Market by Data Rate (3.2 T to 6.4 T, Less than 1.6 T & 3.2 T, More than 6.4 T), Material (Galium Arsenide, Indium Phosphide, Silicon Photonics), Application - Global Forecast 2024-2030
Co-Packaged Optics Market by Data Rate (3.2 T to 6.4 T, Less than 1.6 T & 3.2 T, More than 6.4 T), Material (Galium Arsenide, Indium Phosphide, Silicon Photonics), Application - Global Forecast 2024-2030 The Co-Packaged Optics Market size was estimated at USD 1.92 billion in 2023 and expected to rea ... Read More
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Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Dual Flat No-leads, Dual-in-line, Grid Array), End-use - Global Forecast 2024-2030
Semiconductor & IC Packaging Materials Market by Type (Bonding wires, Ceramic Packages, Die Attach Materials), Technology (Dual Flat No-leads, Dual-in-line, Grid Array), End-use - Global Forecast 2024-2030 The Semiconductor & IC Packaging Materials Market size was estimated at USD 38.44 billion in 2 ... Read More
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Flexible Printed Circuit Board Market by Type (Double-sided Flexible Circuits, Multilayer Flexible Circuits, Rigid-flex Circuits), End User (Automotive Electronics, Consumer Electronics & Wearables, Defense & Aerospace) - Global Forecast 2024-2030
Flexible Printed Circuit Board Market by Type (Double-sided Flexible Circuits, Multilayer Flexible Circuits, Rigid-flex Circuits), End User (Automotive Electronics, Consumer Electronics & Wearables, Defense & Aerospace) - Global Forecast 2024-2030 The Flexible Printed Circuit Board Market size was e ... Read More
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5G Infrastructure Market by Chip Set (Application-Specific Integrated Circuit, Cellular Integrated Circuits, Millimeter Wave Technology Chips), Component (Hardware, Services), Technology, Communication Infrastructure, Network Architecture, Operational Fre
5G Infrastructure Market by Chip Set (Application-Specific Integrated Circuit, Cellular Integrated Circuits, Millimeter Wave Technology Chips), Component (Hardware, Services), Technology, Communication Infrastructure, Network Architecture, Operational Frequency, Application - Global Forecast 2024-20 ... Read More
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Semiconductor Advanced Packaging Market by Packaging Platform (2.5D & 3D IC Packaging, Embedded Die, Fan-In Wafer Level Packaging), Application (DCDC, IGBT, MOSFET) - Global Forecast 2024-2030
Semiconductor Advanced Packaging Market by Packaging Platform (2.5D & 3D IC Packaging, Embedded Die, Fan-In Wafer Level Packaging), Application (DCDC, IGBT, MOSFET) - Global Forecast 2024-2030 The Semiconductor Advanced Packaging Market size was estimated at USD 33.38 billion in 2023 and expected to ... Read More
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Sapphire Substrates Market by Wafer Diameter (2 Inches, 4 Inches, 6 Inches), Application (Laser Diode, LED, Radio-Frequency Integrated Circuit) - Global Forecast 2024-2030
Sapphire Substrates Market by Wafer Diameter (2 Inches, 4 Inches, 6 Inches), Application (Laser Diode, LED, Radio-Frequency Integrated Circuit) - Global Forecast 2024-2030 The Sapphire Substrates Market size was estimated at USD 669.11 million in 2023 and expected to reach USD 695.88 million in 2024 ... Read More
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IoT Node & Gateway Market by Hardware (Connectivity Integrated Circuits, Logic Devices, Memory Devices), End-Use Application (Consumer, Industrial) - Global Forecast 2024-2030
IoT Node & Gateway Market by Hardware (Connectivity Integrated Circuits, Logic Devices, Memory Devices), End-Use Application (Consumer, Industrial) - Global Forecast 2024-2030 The IoT Node & Gateway Market size was estimated at USD 403.41 billion in 2023 and expected to reach USD 438.92 billion in 2 ... Read More
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Automotive Semiconductor Market by Component (Analog IC's, Application Processors, Discreet Power Devices), Vehicle (Compact, Hybrid, Luxury), Application - Global Forecast 2024-2030
Automotive Semiconductor Market by Component (Analog IC's, Application Processors, Discreet Power Devices), Vehicle (Compact, Hybrid, Luxury), Application - Global Forecast 2024-2030 The Automotive Semiconductor Market size was estimated at USD 47.70 billion in 2023 and expected to reach USD 50.41 b ... Read More
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Internet of Things Chip Market by Hardware (Connectivity Integrated Circuits (Ics), Logic Devices, Memory Devices), Power Consumption (1-3 W, 3-5 W, 5-10 W), End-Use - Global Forecast 2024-2030
Internet of Things Chip Market by Hardware (Connectivity Integrated Circuits (Ics), Logic Devices, Memory Devices), Power Consumption (1-3 W, 3-5 W, 5-10 W), End-Use - Global Forecast 2024-2030 The Internet of Things Chip Market size was estimated at USD 653.90 billion in 2023 and expected to reach ... Read More
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IoT Chip Market by Product (Connectivity Integrated Circuits, Logic Devices, Memory Devices), End-Use Application (Aerospace & Defense, Agriculture, Automotive & Transportation) - Global Forecast 2024-2030
IoT Chip Market by Product (Connectivity Integrated Circuits, Logic Devices, Memory Devices), End-Use Application (Aerospace & Defense, Agriculture, Automotive & Transportation) - Global Forecast 2024-2030 The IoT Chip Market size was estimated at USD 91.43 billion in 2023 and expected to reach USD ... Read More
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Thick Film Devices Market by Type (Capacitors, Heaters, Hybrid Integrated Circuits (ICs)), End-user Industry (Automotive, Consumer Electronics, Healthcare) - Global Forecast 2024-2030
Thick Film Devices Market by Type (Capacitors, Heaters, Hybrid Integrated Circuits (ICs)), End-user Industry (Automotive, Consumer Electronics, Healthcare) - Global Forecast 2024-2030 The Thick Film Devices Market size was estimated at USD 83.07 billion in 2023 and expected to reach USD 88.08 billio ... Read More
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Printed Circuit Board Market by Type (Double-Sided PCBs, Multi-Layer PCBs, Single-Sided PCBs), Substrate (Flexible, Rigid, Rigid-Flex), End-User - Global Forecast 2024-2030
Printed Circuit Board Market by Type (Double-Sided PCBs, Multi-Layer PCBs, Single-Sided PCBs), Substrate (Flexible, Rigid, Rigid-Flex), End-User - Global Forecast 2024-2030 The Printed Circuit Board Market size was estimated at USD 90.00 billion in 2023 and expected to reach USD 94.67 billion in 202 ... Read More
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3D IC & 2.5D IC Packaging Market by Technology (2.5D, 3D TSV, 3D Wafer-Level Chip-Scale Packaging), End User (Automotive, Consumer Electronics, Industrial Sector), Application - Global Forecast 2024-2030
3D IC & 2.5D IC Packaging Market by Technology (2.5D, 3D TSV, 3D Wafer-Level Chip-Scale Packaging), End User (Automotive, Consumer Electronics, Industrial Sector), Application - Global Forecast 2024-2030 The 3D IC & 2.5D IC Packaging Market size was estimated at USD 92.36 billion in 2023 and expecte ... Read More
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Polyimide Films & Tapes Market by Polyimide Type (Aliphatic, Aromatic, Semi-aromatic), Application (Flexible Printed Circuits, Motors or Generators, Pressure Sensitive Tapes), End-Use industry - Global Forecast 2024-2030
Polyimide Films & Tapes Market by Polyimide Type (Aliphatic, Aromatic, Semi-aromatic), Application (Flexible Printed Circuits, Motors or Generators, Pressure Sensitive Tapes), End-Use industry - Global Forecast 2024-2030 The Polyimide Films & Tapes Market size was estimated at USD 1.61 billion in 20 ... Read More
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Chip Mounters Market by Technology (Fine Pitch Technology, Hole Technology, Surface Mount Technology), Application (Automotive, Consumer Electronics, Medical) - Global Forecast 2024-2030
Chip Mounters Market by Technology (Fine Pitch Technology, Hole Technology, Surface Mount Technology), Application (Automotive, Consumer Electronics, Medical) - Global Forecast 2024-2030 The Chip Mounters Market size was estimated at USD 3.36 billion in 2023 and expected to reach USD 3.52 billion in ... Read More
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Embedded Antenna Systems Market by Antenna Type (Chip Antenna, Flexible Printed Circuit Antenna, Patch Antenna), Connectivity (5G millimeter Wave, Cellular, Global Navigation Satellite System & Global Positioning System), End-User - Global Forecast 2024-2030
Embedded Antenna Systems Market by Antenna Type (Chip Antenna, Flexible Printed Circuit Antenna, Patch Antenna), Connectivity (5G millimeter Wave, Cellular, Global Navigation Satellite System & Global Positioning System), End-User - Global Forecast 2024-2030 The Embedded Antenna Systems Market size ... Read More
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In-Cabin Automotive AI Market by Offering (Hardware, Software), Component (Biometric Scanners, Field Programmable Gate Array (FPGA), Graphics Processing Unit (GPU)), Technology, Process, Application - Global Forecast 2024-2030
In-Cabin Automotive AI Market by Offering (Hardware, Software), Component (Biometric Scanners, Field Programmable Gate Array (FPGA), Graphics Processing Unit (GPU)), Technology, Process, Application - Global Forecast 2024-2030 The In-Cabin Automotive AI Market size was estimated at USD 286.22 millio ... Read More
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Electronic Design Automation Software Market by Type (Computer-Aided Engineering, IC Physical Design & Verification, Printed Circuit Board & Multi-Chip Module), Application (Aerospace & Defense, Automotive, Communication) - Global Forecast 2024-2030
Electronic Design Automation Software Market by Type (Computer-Aided Engineering, IC Physical Design & Verification, Printed Circuit Board & Multi-Chip Module), Application (Aerospace & Defense, Automotive, Communication) - Global Forecast 2024-2030 The Electronic Design Automation Software Market s ... Read More
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Semiconductor Automated Test Equipment Market by Type (Discrete ATE, Memory ATE), Product (Interconnection & Verification Testing, Logic Testing, Printed Circuit Board Testing), Component, Application - Global Forecast 2024-2030
Semiconductor Automated Test Equipment Market by Type (Discrete ATE, Memory ATE), Product (Interconnection & Verification Testing, Logic Testing, Printed Circuit Board Testing), Component, Application - Global Forecast 2024-2030 The Semiconductor Automated Test Equipment Market size was estimated at ... Read More
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