Category: Integrated Circuits
Oceania Integrated Circuits
-
2024 Asia-Pacific Advanced Ic Substrate Forecast (2025-2030 Outlook)-High Tech Outlook Report
... Plastics and Rubber Mfg. industry. The global market is expected to increase from USD xx billion in 2025 to USD xx billion by 2030, at a CAGR of xx% from 2025 to 2030. Estimates on ... Read More
-
5G Chipset Market, By Chipset Type (Application-specific Integrated Circuits (ASIC), Radio Frequency Integrated Circuit (RFIC), Millimeter Wave Technology Chips, Field-programmable, and Gate Array (FPGA)), By Operational Frequency (Sub-6 GHz, Between 26 and 39 GHz, and Above 39 GHz), By Vertical (Manufacturing, Energy & Utilities, Media & Entertainment, IT & Telecom, Transportation & Logistics, Healthcare, and Others), By Geography (North America, Latin America, Asia Pacific, Europe, Middle East, and Africa)
... Above 39 GHz), By Vertical (Manufacturing, Energy & Utilities, Media & Entertainment, IT & Telecom, Transportation & Logistics, Healthcare, and Others), By Geography (North America, Latin America, Asia Pacific, Europe, Middle East, and Africa) 5G ... Read More
-
Asia Pacific Memristors Market Size study, by Application (Non-volatile Memory, Neuromorphic and Biological System, Programmable Logic and Signal Processing) by End-user Industry (Consumer Electronics, IT and Telecom, Automotive, Healthcare, Other End-use
... 2022-2032 Asia Pacific Memristors Market is valued approximately at USD 70 million in 2023 and is anticipated to grow with a healthy growth rate of more than 52.70% over the forecast period 2024-2032. A memristor ... Read More
-
3D ICs Market, By End-Use Sectors (Consumer electronics, Information and communication technology, Transport (automotive and aerospace), Military, Others (Biomedical applications and R&D)), by Substrate Type (Silicon on insulator(SOI), Bulk silicon), by Fabrication Process ( Beam re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization), by Product (MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED) and by Region (North America, Europe, Asia Pacific, RoW) - Size, Share, Outlook, and Opportunity Analysis, 2020 - 2027
... re-crystallization, Wafer bonding, Silicon epitaxial growth, Solid phase crystallization), by Product (MEMS and Sensor, RF SiP, Optoelectronics and imaging, Memories (3D Stacks), Logic (3D Sip/Soc), HB LED) and by Region (North America, Europe, Asia Pacific, ... Read More
-
Asia Pacific Memristor Market Size, Share & Trends Analysis Report By Type (Molecular & Ionic Thin Film Memristors and Spin & Magnetic Memristors), By Industry Vertical, By Country and Growth Forecast, 2024 - 2031
... Asia Pacific Memristor Market would witness market growth of 48.5% CAGR during the forecast period (2024-2031). The China market dominated the Asia Pacific Memristor Market by Country in 2023, and would continue to be a ... Read More
-
Asia Pacific Inboard Engines Market Size study, by Power Source (Diesel, Electric, Gasoline, Others), by Power (Low, Medium, High), by Ignition (Electric, Manual), by Engine (IC engine, Electric engine), by Application (Commercial, Boating, Others) and Country Forecasts 2022-2032
... Country Forecasts 2022-2032 Asia Pacific Inboard Engines Market is valued at approximately USD xx million in 2023 and is anticipated to grow with a healthy growth rate of more than xx % over the forecast ... Read More
-
Smartphone System on Chip (SoC) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region: (North America, Europe, Asia Pacific, Latin America and Middle East and Africa)
... and Africa) global smartphone system on chip (SoC) market is forecasted to experience remarkable growth over the next decade, expanding at a robust CAGR of 21.0% from 2024 to 2031. According to market analysis, the ... Read More
-
System Basic Chip Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region: (North America, Europe, Asia Pacific, Latin America and Middle East and Africa)
... According to the latest projections from Fairfield Market Research, the global system basis chip (SBC) market is poised for substantial growth in the coming decade. In 2024, the market reached a value of US$ 30 ... Read More
-
Electronic Design Automation (EDA) Tools Market - Global Size, Share, Trend Analysis, Opportunity and Forecast Report, 2019–2030, Segmented By Product (Computer-aided Engineering (CAE), IC Physical Design & Verification, Printed Circuit Board & Multi-chip Module (PCB & MCM), Semiconductor Intellectual Property (SIP)); By Application (Communication, Consumer Electronics, Automotive, Industrial); By Region (North America, Europe, Asia Pacific (APAC), Latin America (LATAM), Middle East and Africa (MEA))
... of electronic devices, spurring demand for efficient chip designs, and growing semiconductor industry. BlueWeave Consulting, a leading strategic consulting and market research firm, in its recent study, estimated the Global Electronic Design Automation (EDA) Tools ... Read More
-
Alloy Strips Market, By Alloy Type (Aluminum Alloys, Stainless Steel Alloys, Copper Alloys, Nickel Alloys, Titanium Alloys, Others), By End-Use Industry (Automotive, Aerospace and Defense, Electronics and Electrical, Construction and Architecture, Manufacturing, Energy and Utilities, Consumer Goods, Others), By Form (Flat Alloy Strips, Coiled Alloy Strips), By Thickness Range (Thin Alloy Strips ( 2 mm)), By Width Range (Narrow Alloy Strips ( 500 mm)), By Surface Finish (Mill Finish, Polished Finish, Brushed Finish, Others), By Alloy Formulation (Binary Alloys, Ternary Alloys, Quaternary Alloys, Others), By Application (Heat Exchangers and Radiators, Electrical Connectors and Switches, Roofing and Cladding, Automotive Structural Components, Printed Circuit Boards (PCBs), Electronic Enclosures, Semiconductor Packaging, Consumer Electronics Components, Oil and Gas Pipelines, Marine Components, Architectural Trim, Others), By Geography (North America, Latin America, Europe, Asia Pacific, M
... Consumer Goods, Others), By Form (Flat Alloy Strips, Coiled Alloy Strips), By Thickness Range (Thin Alloy Strips ( 2 mm)), By Width Range (Narrow Alloy Strips ( 500 mm)), By Surface Finish (Mill Finish, Polished ... Read More
-
Remote Power Panel Market by Type (Wall-mounted, Floor-standing), Application (Network Cabinets, Server Rooms, Data Centers (Cloud, Enterprise)) & Region (North America, Europe, Asia Pacific, South America, Middle East & Africa) - Global Forecast to 2028
... The global remote power panel market is estimated to grow from USD 1.1 Billion in 2023 to USD 1.4 Billion by 2028; it is expected to record a CAGR of 4.8% during the forecast period. ... Read More
-
Asia Pacific Data Converter Market Forecast to 2028 – COVID-19 Impact and Regional Analysis – by Type (DAC and ADC), Sampling Rates (High Speed Converters and General/Low Speed Converters), Application (Medical, Industrial, Communications, Consumer Electronics, Automotive, and Others), Resolution (10–14 bit, Above 14-20 bit, and Above 20 bit), and Rate of Converter (Below 100Msps, 100-500Msps, Above 500Msps-1Gsps, and Above 1Gsps-3Gsps)
... Automotive, and Others), Resolution (10–14 bit, Above 14-20 bit, and Above 20 bit), and Rate of Converter (Below 100Msps, 100-500Msps, Above 500Msps-1Gsps, and Above 1Gsps-3Gsps) The data converter in Asia Pacific is expected to grow ... Read More
-
Global Multilayer Printed Circuits Market Size, Segments, Outlook, and Revenue Forecast 2022-2028 by Product Type (Layer 3-6, Layer 8-10, Layer 10+), Application (Consumer Electronics, Automotive, Communications, Healthcare, Industrial, Aerospace), and Region (North America, Europe, Asia Pacific, Latin America, Middle East and Africa)
... Pacific, Latin America, Middle East and Africa) Market Overview: A printed circuit board (PCB) is a foundation for most electronic products, providing physical support and wiring area for different socketed and surface-mounted components, including integrated ... Read More
-
Global Automotive LiDAR Market Size, Segments, Outlook, and Revenue Forecast 2022-2028 by Application (Semi-Autonomous Vehicles, Autonomous Vehicles), Technology (Solid State, Mechanical/Scanning), Location (Roof & Upper Pillars, Headlight & Taillight, Bumper & Grill ), Range (Short & Mid-Range, Long Range), Vehicle Type (IC Engine Vehicle, Hybrid Electric Vehicle, Plug-in Hybrid Electric Vehicle, Battery Electric Vehicle) and Region (North America, Europe, Asia Pacific, Latin America Middle East and Africa)
... & Mid-Range, Long Range), Vehicle Type (IC Engine Vehicle, Hybrid Electric Vehicle, Plug-in Hybrid Electric Vehicle, Battery Electric Vehicle) and Region (North America, Europe, Asia Pacific, Latin America Middle East and Africa) Market Overview: LIDAR ... Read More
-
5G Chipset Market, By Chipset (Application-specific Integrated Circuits (ASIC), Radio Frequency Integrated Circuit (RFIC), Millimeter Wave Technology Chips, Field-programmable, Gate Array (FPGA)), By Operational Frequency (Sub-6 GHz, Between 26 and 39 GHz, Above 39 GHz), By the End-user (Consumer Electronics, Industrial Automation, Automotive and Transportation, Energy and Utilities, Healthcare, Retail, Other End-user Industries), By Geography (North America, Latin America, Europe, Asia Pacific, Middle East & Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030
... By the End-user (Consumer Electronics, Industrial Automation, Automotive and Transportation, Energy and Utilities, Healthcare, Retail, Other End-user Industries), By Geography (North America, Latin America, Europe, Asia Pacific, Middle East & Africa) - Size, Share, Outlook, ... Read More
-
Semiconductor Equipment Market, By Product Type (Semiconductor Front-end Equipment and Semiconductor Back-end Equipment), By Application (Discrete Semiconductor, Optoelectronic Device, Sensors, and Integrated Circuits), By Equipment (Wafer Processing, Assembly & Packaging, and Testing Equipment), By End Use (PCs, Mobile Handsets, and Televisions Assembly & Packaging), and By Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030
... Use (PCs, Mobile Handsets, and Televisions Assembly & Packaging), and By Region (North America, Europe, Asia Pacific, Latin America, and Middle East & Africa) - Size, Share, Outlook, and Opportunity Analysis, 2022 - 2030 Semiconductor ... Read More
Research Assistance
