EUV Lithography market is a secondary market segment of the semiconductor industry that is required for producing chips at advanced nodes like 5nm, 3nm, and beyond. EUV lithography, with a wavelength of 13.5 nm, is used for high-resolution patterning of semiconductor wafers and is required for the development of smaller faster more efficient chips. This is key to unleashing innovations in AI, 5G, the IoT, autonomous vehicles, and consumer electronics. Mainly driven by the rising market need for high-performance chips, significant investment by industry giants such as TSMC, Samsung, and Intel, and rapid advancements in semiconductor fabrication technology. The adoption of EUV lithography worldwide is also assisted by government funding and the establishment of semiconductor supply chains by government initiatives.
The Extreme Ultraviolet Lithography Market is expected to grow at a robust CAGR of 12.8% during the forecast period, owing to the rising demand for advanced semiconductor nodes, significant investments in R&D and manufacturing, and the rapid adoption of AI, 5G, and IoT technologies. Recent mergers, acquisitions, and investments reflect the strategic importance of EUV lithography in the semiconductor market. For instance, ASML's acquisition of Berliner Glas Group in November 2020 enhanced its supply chain for optical components critical to EUV systems. Similarly, Intel’s $20-billion project to build Fab 52 and Fab 62, with general contractor Hoffman Construction Co.—which has previously built other fabs at the campus—started in 2021. Fab 52 is expected to come online in 2024, followed by Fab 62 next year. This highlights the industry's commitment to increasing domestic semiconductor production. The market has also seen the emergence of innovative startups like LithoVision and Mapper Lithography, focusing on complementary technologies for lithography systems.
The US, South Korea, and Taiwan are the fastest-growing countries in the EUV lithography market, fuelled by their strong semiconductor ecosystems and massive investments in the most advanced manufacturing technologies. With huge CHIPS Act investments and new fabs by Intel and TSMC, the U.S. is growing rapidly. Samsung and SK Hynix of South Korea have a bet on themselves expanding foundry capacity to ride global demand for advanced chips. TSMC, headquartered in Taiwan, is still leading the world in chip production because it has the most advanced abilities and the capacity of high volume make. Also, China is increasingly taking a more active role, with deep government investments to reduce reliance on foreign semiconductor technology and achieve technological self-reliance. The future of the EUV lithography market is being driven by these countries, in both fostering and scaling up innovation.
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