Europe Semiconductor Bonding Market Forecast to 2028 – COVID-19 Impact and Regional Analysis – by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Application (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND)

Europe Semiconductor Bonding Market Forecast to 2028 – COVID-19 Impact and Regional Analysis – by Type (Die Bonder, Wafer Bonder, and Flip Chip Bonder) and Application (RF Devices, MEMS and Sensors, LED, CMOS Image Sensors, and 3D NAND)

The semiconductor bonding market in Europe is expected to grow from US$ 215.77 million in 2022 to US$ 349.17 million by 2028. It is estimated to grow at a CAGR of 8.4% from 2022 to 2028.

Rising Adoption of Stacked Die Technology in IoT Devices

Due to the OEM’s increased need for enhanced capabilities and performance in smaller printed circuit boards (PCBs), the adoption of stacked die technology has grown in various electronic applications such as IoT and mobile devices. Stacked die refers to the placement of one chip on top of another or a spacer instead of the chip, followed by another chip. Sets of many rows of wire bonding loops are arranged, with each set connecting to a different die or spacer. Hence, remaining space after stacked die is used to fit many functionalities into a small die placement area. Thus, using stacked die technology to place the circuitry helps preserve valuable PCB space. Due to the limited workspace that PCB assembly and manufacturing companies witnessed with such extremely rigid and rigid-flex circuits, the demand for stacked die technology in IoT device is increasing. Moreover, the usage of stacked die significantly enhances design processes of semiconductor. The stacked die technology is used to produce a small-sized final design. One of the main factors causing the stacked die technique to advance is handheld electronic devices. Also, live tracking IoT gadget cannot be huge either. By reducing the amount of design effort and raising the likelihood of first-time success, time to market is reduced. Thus, the increasing adoption of stacked die technology in IoT devices is raising the demand for semiconductor bonding solutions in the market. In addition, OEMs in the semiconductor sector are utilizing the benefits of IoT beyond connectivity. Sensors, RFID tags, smart beacons, smart meters, and distribution control systems are IoT devices and technologies that are increasingly being used in various applications such as building and home automation, connected logistics, smart manufacturing, smart retail, smart mobility, and smart transportation. In Internet of Things (IoT) devices, semiconductor bonding techniques are utilized to compactly attach several stacked dies to substrates which will lead to the growth of the Europe semiconductor bonding market.

Market Overview

Germany, France, Italy, Russia, the UK, and rest of Europe are the key contributors to the semiconductor bonding market in the Europe. A stacked die is an assembly technique where two or more die is stacked and bonded in a single semiconductor package. It is used on a substrate having numerous functionalities around the same placement area. The performance of electrical devices is enhanced due to die piling. Thus, the utilization of stacked die is one of the major drivers accelerating the market growth. EV Group, HUTEM are a few of the prominent companies operating in the Europe semiconductor bonding market. These companies are majorly focusing on the market for MEMS sensors, CMOS image sensors, and RF devices. For instance, in March 2022, Merck KGaA, a Germany-based pharmaceutical company, announced a total investment of US$ 82 million to build a new semiconductor facility in Zhangjiagang, China. The growth of wafer bonding is fueled by the growing demand for various thermal imaging applications, including night vision systems for military and security use, imaging systems to improve building construction, thermal cameras for pedestrian protection systems in automobiles, and process monitoring systems for several commercial and industrial applications. MEMS manufacturers need advanced process equipment and expertise that will enable them to produce microbolometers at high throughput and yield for achieving the unit cost reductions required to meet the demand. The usage of EV Group’s (EVG) fully automated GEMINI wafer bonder provides cost-effective production of microbolometers. Similarly, in October 2020, in Austria, EVG established a complete process flow for combined die-to-wafer (D2W) hybrid and fusion bonding with sub-2μm placement accuracy for 3D semiconductor packaging.

Europe Semiconductor Bonding Market Revenue and Forecast to 2028 (US$ Million)

Europe Semiconductor Bonding Market Segmentation

The Europe semiconductor bonding market is segmented into type, application, and country.

Based on type, the market is segmented into die bonder, wafer bonder, and flip chip bonder. The wafer bonder segment registered the largest market share in 2022.

Based on application, the market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment held a largest market share in 2022.

Based on country, the market is segmented into Germany, France, Italy, Russia, the UK, and rest of Europe. Germany dominated the market share in 2022. ASMPT; DIAS Automation (HK) Ltd.; EV Group; HUTEM; Kulicke & Soffa Industries, Inc.; Palomar Technologies; Panasonic Corporation; Toray Industries Inc; WestBond, Inc.; and Yamaha Motor Corporation are the leading companies operating in the semiconductor bonding market in the Europe region.

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