Global IoT Node and Gateway Market Analysis 2022

Global IoT Node and Gateway Market Analysis 2022

The Global IoT Node and Gateway Market is expected to reach $607.18 billion by 2028 growing at a CAGR of 7.2% from 2021 to 2028. An IoT node and gateway device and software accomplish significant tasks in areas such as connecting devices, protocol conversion, security and filtering of data and processing, and others. As many peripheral systems include sensors, cloud, devices, and controllers, it acts as junction for them. It utilizes Trusted Platform Module (TPM) and Trusted Execution Environment (TEE) for IoT gateway device hardware security. Therefore, additional security, storage, and processing services to the end nodes is provided at power efficient and cost-effective level by the usage of IoT node and gateway.

Factors such as rising inclination for data centers due to increasing adoption of cloud platforms, increasing use of wireless smart sensors, and growing market for connected devices are driving the growth of the market. However, data privacy concerns and lack of communication standards and common protocols, and connectivity issues & lack of IoT-related skills and are restraining the growth of the market.

Based on hardware, the memory device segment is going to have a lucrative growth during the forecast period which can be attributed to the rising demand for memory devices from the end user applications. Memory devices are further divided into on-chip memory and off-chip memory. There are different types of on-chip memories, such as eMMC, Cache, and SRAM. On-chip memories are in-built in the SoC. SRAM is mostly used in automotive, industrial, and defense applications, which require high end performance. SRAM allows high-speed display with lowered power consumption.

The key vendors mentioned are Aaeon Components Inc, Adlink Components Inc, Advantech Co. Ltd, Cisco Systems, Inc, Dell Technologies, Estimote Inc, Helium Systems Inc, Hewlett Packard Enterprise, Huawei Technologies Co., Ltd, Intel Corporation, Microchip Technologies Inc, Nexcom International, NXP Semiconductor N.V, StMicroelectronics N.V, TE Connectivity Ltd, and Texas Instruments Incorporated.

Hardwares Covered:

• Sensor
• Processor
• Memory Device
• Logic Device
• Connectivity Integrated Circuit (IC)

Connectivities Covered:

• Wi-fi
• Ethernet
• Bluetooth
• Z-Wave
• ZigBee

End Users Covered:

• Aerospace & Defense
• Agriculture
• Automotive
• Banking, Financial Services and Insurance (BFSI)
• Building Automation
• Consumer Electronics
• Education
• Government
• Healthcare
• Oil & Gas
• Retail
• Telecommunication and IT
• Transportation
• Utilities
• Wearable Devices

Regions Covered:

• North America
• Europe
• Asia Pacific
• South America
• Middle East & Africa

Key Questions Answered in this Report:

• How this market evolved since the year 2020
• Market size estimations, forecasts and CAGR for all the segments presented in the scope
• Key Market Developments and financials of the key players
• Opportunity Analysis for the new entrants
• SWOT Analysis of the key players
• Fastest growing markets analyzed during the forecast period