Underfill Dispenser Market Forecasts to 2028 – Global Analysis By Product Type (Molded, Capillary Flow), Application (Consumer Electronics, Semiconductor Packaging), and By Geography

Underfill Dispenser Market Forecasts to 2028 – Global Analysis By Product Type (Molded, Capillary Flow), Application (Consumer Electronics, Semiconductor Packaging), and By Geography

According to Stratistics MRC, the Global Underfill Dispenser Market is accounted for $65.11 billion in 2021 and is expected to reach $134.32 billion by 2028 growing at a CAGR of 10.9% during the forecast period. Underfill material is used in semiconductor wrapping to offer strength, improve the overall consistency and thermo-mechanical recital, and augment the impact resistance. It is used to fill space beneath a die and adhere to its carrier. Underfill creates a strong mechanical link between the chip and the PCB connector, preventing mechanical stress on the soldered parts. It also aids in the transmission of heat.

Semiconductors are important technology enablers that power many cutting-edge digital devices. The growing trend of adopting connected devices in the residential and industrial sectors is augmenting the demand for the semiconductors market. According to Cisco Systems, the number of connected wearable devices is expected to increase from 593 million in 2018 to 1,105 million in 2022. Thus, the rapid development in the technology and size of consumer electronics is also boosting the demand for advanced semiconductor technology.

Market Dynamics:

Driver:

Advances in dispensing systems set tone of technological progress

Underfills serve the primary function of recuperating the service life of die packages in semiconductor industry. They aid decrease stress from mismatch caused by coefficient of thermal growth in interconnect devices. A range of dispenser valves are used in underfill dispensing market. New jetting systems have come to the fore for improving precision of dispensing among other performance characteristics. More importantly, the demand dynamics in the market comes from the interplay of factors such as cost of ownership, ease of applications, and evolving demands in the PCB industry. Rise in demand for smart consumer electronics industries has also opened new, challenging demands for dispensing systems. These devices are growing in production on the back of the increasing trend of electronic devices with functionality and performance in both consumer and enterprise applications.

Restraint:

High initial investment

The high initial investment required for research and development might limit the market’s growth in certain regions. Several smaller businesses are struggling under the weight of excessive high research and development investment, which could have adverse impact on the overall market. Also several market players are finding it difficult to cope with the high investment required for research and development. This makes companies reluctant to fund R&D activities, which could act against the overall market prospect.

Opportunity:

Growing demand for handheld devices

The underfill dispensers market is basically gaining popularity from the increasing demand for handheld devices. Asia Pacific particularly features profitable market opportunities as it the home to a booming consumer electronics industry. The demand for handheld devices such as tablets and mobile phones is considerably high across nations such as India, Australia, China, and Japan. This in turn creates an environment conducive to growth of the underfill dispenser market in Asia Pacific, subsequently propelling the market’s overall growth. Also, with the growing inclination towards miniaturizing gadgets, in future the demand for underfull dispenser is poised to rise exponentially. These factors are indicative of the growing willingness of consumers towards spending on advanced consumer electronics.

Threat:

Pandemic had a negative impact on global underfill dispensers market

Most industries across the world have been negatively impacted over the last few months. This can be attributed to significant disruptions experienced by their respective manufacturing and supply-chain operations as a result of various precautionary lockdowns, as well as other restrictions that were enforced by governing authorities across the globe. The same applies to the global underfill dispenser market. Moreover, consumer demand has also subsequently reduced as individuals are now keener on eliminating non-essential expenses from their respective budgets as the general economic status of most individuals have been severely affected by this outbreak.

The capillary flow underfill segment is expected to be the largest during the forecast period

The capillary flow underfill segment is estimated to have a lucrative growth due to the micro-electromechanical systems (MEMS) applications in various industries that require PCB connectors. Capillary underfill offers important advantages for high-performance computing devices, including CPU, GPU, and AI processors in datacenter, autonomous driving, and mobile devices with AI capability. With so much field data, it's easier for engineers to manage and control the capillary underfill process to prevent potential reliability issues such as voids.

The ball grid array segment is expected to have the highest CAGR during the forecast period

The ball grid array segment is anticipated to witness the fastest CAGR growth during the forecast period owing to the increase in R&D investments in the miniaturization of IC packages over the years. Ball grid array has evolved as one of the technologies that enable the miniaturization of IC packages in the MEMS sector. It is a type of surface-mount packaging used for circuit board assemblies. It is used to permanently mount microprocessors and other devices. BGA underfill is used to protect the circuit board assembly by creating sounder thermal and mechanical properties.

Region with highest share:

Asia Pacific is projected to hold the largest market share during the forecast period, as it is a home to booming consumer electronics and automotive sectors, and also boost a strong defense sector. Countries such as India, China, and Japan allocated increasing funds in the modernization of defense equipment. This provides lucrative growth opportunities for the underfill dispenser market in Asia Pacific.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, owing to the rising demand for miniaturization of smart devices and sophisticated industrial infrastructure within the region. These regions are characterized by the presence of multinational dispensing equipment suppliers. Furthermore, these regions are, in the context of equipment, technologically advanced compared to other regions.

Key players in the market

Some of the key players profiled in the Underfill Dispenser Market include Zymet Inc., MKS Instruments, Inc., Sulzer Ltd., Nordson Corporation, Shenzhen STIHOM Machine Electronics Co., Ltd, Master Bond Inc., Illinois Tool Works, Henkel AG & Co. KGaA , Essemtec AG and Zmation Inc.

Key Developments:

In Aug 2019: Nordson Corporation launched its Forte™ Series fluid dispensing system. The Forte Series combines high accuracy fluid dispensing with increased throughput and productivity in a narrow footprint to handle applications such as flex circuit and printed circuit board assembly, electro-mechanical assembly, MEMS, underfill, precise coating, and encapsulation.

Product Types Covered:
• No Flow Underfill
• Molded Underfill
• Capillary Flow Underfill

Applications Covered:
• Consumer Electronics
• Semiconductor Packaging

End Users Covered:
• Flip-Chips
• Chip Scale Packaging
• Ball Grid Array

Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements

Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
• Company Profiling
Comprehensive profiling of additional market players (up to 3)
SWOT Analysis of key players (up to 3)
• Regional Segmentation
Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances