Semiconductor Fabrication Material - Global Market Outlook (2021 - 2028)

Semiconductor Fabrication Material - Global Market Outlook (2021 - 2028)

According to Stratistics MRC, the Global Semiconductor Fabrication Material Market is accounted for $56.31 billion in 2021 and is expected to reach $90.42 billion by 2028 growing at a CAGR of 7.0% during the forecast period. Semiconductor fabrication refers to the process of manufacturing semiconductor products. It is a multiple-step sequence of photolithographic and chemical processing steps to develop electronic circuits on a wafer made of pure semiconducting material. Materials such as silicon wafers, wet chemicals, industrial gases, chemical mechanical polishing (CMP) slurry and pads, photomasks, sputter targets, photoresists for semiconductors, photoresists for EUV, electrostatic chucks, IC lead frame, and others, are generally used as the semiconductor fabrication materials. It can be defined as the materials that are used to pattern semiconductor wafers.

Market Dynamics:

Driver:

Rising government initiative for new semiconductor production units

The investment by the government helps to boost the demand and market share. The government initiation plays a vital role in the development of any sector. The U.S. government has taken the initiation to fortify America's semiconductor supply chains through robust investments in U.S. chip production and innovation. For instance, in June 2021, the U.S government passed the fund to United States Innovation and Competition Act (USICA), broad competitiveness legislation that includes US$ 52 billion to bolster domestic chip manufacturing, research, and design. The semiconductor industry has urged the U.S. House of Representatives to follow suit and send legislation to the President's desk to be signed into law. In addition, leading Chinese foundries and several foundry start-ups have accelerated their pace of building trailing-edge fabs. As semiconductor innovation and global chip demand continue their inextricable rise, government and industry must work together for the production of semiconductor. Hence, the increasing total cost of ownership will help in the development of semiconductor in the and helping to increase the demand for semiconductor fabrication material.

Restraint:

Huge investments involved

Semiconductor fabrication facility requires many expensive devices to function. The central part of a fab is the clean room, an area where the environment is controlled to eliminate all dust, since even a single speck can ruin a microcircuit, which has features much smaller than dust. The clean room must also be dampened against vibration and kept within narrow bands of temperature and humidity. Controlling temperature and humidity is critical for minimizing static electricity. The clean room contains the steppers for photolithography, etching, and cleaning, doping and dicing machines. All these devices are extremely precise and thus extremely expensive. A typical fab will have several hundred equipment items. Complex tools and equipment are required to test quality and move silicon from location to location within the ultra-clean confines of the plant.

Opportunity:

Increasing demand from end use industries

Rising use of semiconductors in various end-use industries such as telecommunication, consumer appliances, and others are expected to boost the demand for the semiconductor fabrication material market. The modern period of telecommunication commenced with the use of semiconductor devices in telecommunication technology. The transistors technology helped develop existing technology from narrow broadband to private packet-switched networks. 5G network is another technology achieved with the help of semiconductor technology and can transfer large amounts of data 100-200X faster than 4G LTE. However, various components of the internet of things infrastructures like processors, modems, and logic chips helped increase memory output and performance. Power semiconductors consist of power sensors, SiC devices, power control integrated circuits, rectifier diodes. These devices are widely used in consumer appliances produced by semiconductor fabrication materials like chips, logic, wafer, memory, etc. Hence, the use of semiconductor devices in telecommunication is boosting the demand for semiconductor fabrication material during the forecast period.

Threat:

High cost of raw material

There has been an increase in the prices of raw materials that are used for semiconductor fabrication material manufacturing such as wafers, industrial gases, silicon chips, and others owing to which there is an increase in the price of Semiconductor Fabrication Material as well. A silicone is made from the second-most abundant element on Earth which has become scarce, is increasing concern to car parts to computer chips. The shortage in silicon metal had cut the production in China, and prices have grown up. Also, the costs of semiconductor are proportional to its function and performance in order to meet building code requirements. Semiconductors undergo extensive research and testing to ensure that quality and performance standards are met, and as a result, it is more highly priced. Hence, all the aforementioned factors significantly contribute towards the high cost of semiconductors, thereby posing as a significant challenge for the market.

The n-type segment is expected to be the largest during the forecast period

The n-type segment is estimated to have a lucrative growth. N-type semiconductors are key materials in the formation of p-n junctions, where a p-type and an n-type semiconductor are brought in close contact to create a depletion region. An n-type semiconductor is an intrinsic semiconductor doped with phosphorus (P), arsenic (As), or antimony (Sb) as an impurity. Silicon of Group IV has four valence electrons and phosphorus of Group V has five valence electrons. An N-type semiconductor material has an excess of electrons. In this way, free electrons are available within the lattices and their overall movement in one direction under the influence of a potential difference results in an electric current flow. This in an N-type semiconductor, the charge carriers are electrons.

The electrical and electronics segment is expected to have the highest CAGR during the forecast period

The electrical and electronics segment is anticipated to witness the fastest CAGR growth during the forecast period. Electrical and electronic appliances make life easier with smart technology and the internet of things is an advantage. As a result, semiconductor chips help to work with multi-functionality feature to respond to rising demand & maintain standards, and highly durable services. The semiconductors fabrication materials are used in the manufacture of different kinds of electronic devices, including transistors, diodes, chips control temperatures, timers, automated features and integrated circuits. According to IPC Economic outlook December 2021, the electronics industry, which includes categories such as components, loaded boards, computers, communications equipment, and consumer electronics, is being increased by 2.6% in November 2021. Hence, the rising electronic manufacturing will increase the demand for semiconductor fabrication material market.

Region with highest share:

Europe is projected to hold the largest market share during the forecast period. Germany dominated the semiconductor fabrication material market and is anticipated to lead the market across the European region through the forecast period. Germany stands in the fourth position for the largest manufacturer of electronics products across the globe and is also a 6th largest export market of semiconductor fabrication material for the US. Germany is also the most significant European market for semiconductor fabrication material. Despite a reduction in the semiconductor industry in recent time, Germany is recognized as a leading production location for semiconductors. As one in three chips are manufactured in Germany, it holds a strong position in the entire semiconductor fabrication material market.

Region with highest CAGR:

Asia Pacific is projected to have the highest CAGR over the forecast period. China’s semiconductor sector has expanded to become one of the largest in the world and also is the biggest consumer of chips. On the other hand, the increasing investments in the semiconductor industry, with the rising installation of new plants will drive the market growth of Japan’s semiconductor fabrication material. For instance, the Japanese government invested US$6.8 billion for domestic production of semiconductors to make the nation a major global provider of essential computer chips. Furthermore, India’s semiconductor sector has expanded with the increasing government investment and rise in the end use industries such as energy and telecommunication, is driving the market growth of semiconductor fabrication material market over the forecast period.

Key players in the market

Some of the key players profiled in the Semiconductor Fabrication Material Market include BASF SE, Air Liquide SA, Air Products and Chemicals Inc, Alent Plc, CMC Materials, Dow Chemical Company, Hitachi Chemical Company Limited, JSR Corporation, Kanto Chemical Co., Inc, Linde AG, Merck KgaA, Mitsubishi Gas Chemical Company, Praxair, Inc., Showa Denko Materials, Co., Ltd, and Taiyo Nippon Sanso.

Key Developments:

In April 2021, CMC Materials acquired the International Test Solutions which will enable them to help solve their customers’ most demanding challenges and maximize their yield & throughput in the semiconductor manufacturing process.

In November 2020, Showa Denko Materials, Co., Ltd., in collaboration with Chengdu Kemeite Special Gas Co., Ltd., established a new subsidiary, Chengdu Kemeite Showa Electronic Materials Co., Ltd., which aims to strengthen SDK’s business to produce and sell high-purity gases for electronics.

Semiconductor Types Covered:
N-Type
P-Type

Material Types Covered:
Chemical Mechanical Polishing (CMP) Slurry & Pads
Industrial Gases
Photomasks
Photoresist Ancillaries
Photoresists
Silicon Wafers
Sputter Targets
Wet Chemicals
Electrostatic Chucks
Integrated Circuits (IC) Lead Frame
Wire Bonding

Types Covered:
Gallium Arsenide (GaAs)
Indium Gallium Zinc Oxide
Silicon Material

Packaging Materials Covered:
Bonding Wire
Ceramic Packages
Die Attach
Encapsulants
Leadframes
Mold Compounds
Substrates

End Users Covered:
Architecture
Automotive
Telecommunication
Computers
Consumer Goods
Defense & Aerospace
Electrical and Electronics
Industrial
Medical and Healthcare
Power Generation
Transportation
Energy
Manufacturing

Regions Covered:
North America
US
Canada
Mexico
Europe
Germany
UK
Italy
France
Spain
Rest of Europe
Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
South America
Argentina
Brazil
Chile
Rest of South America
Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements

Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
Company Profiling
Comprehensive profiling of additional market players (up to 3)
SWOT Analysis of key players (up to 3)
Regional Segmentation
Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
Competitive Benchmarking
Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances