Molded Interconnect Devices (MID) Market Forecasts to 2030 – Global Analysis By Product Type (Antenna & Connectivity Modules, Connectors & Switches and Other Product Types), By Process (Laser Direct Structuring (LDS), Film Techniques and Two-Shot Molding)

Molded Interconnect Devices (MID) Market Forecasts to 2030 – Global Analysis By Product Type (Antenna & Connectivity Modules, Connectors & Switches and Other Product Types), By Process (Laser Direct Structuring (LDS), Film Techniques and Two-Shot Molding), End User and By Geography

According to Stratistics MRC, the Global Molded Interconnect Devices (MID) Market is accounted for $1.3 billion in 2023 and is expected to reach $3.5 billion by 2030 growing at a CAGR of 14.4% during the forecast period. Molded Interconnect Devices (MID) are three-dimensional circuit structures formed by integrating electronics directly into injection-molded plastic components. This technology enables compact and lightweight designs, combining mechanical and electrical functions in a single part. MID is utilized in various industries, such as automotive and consumer electronics, to create efficient and space-saving electronic devices.

Market Dynamics:

Driver:

Growing demand for connected devices

The increasing demand for connected devices, driven by trends like the Internet of Things (IoT), is a key driver in the molded interconnect devices (MID) market. MID technology allows the seamless integration of electronic components into three-dimensional structures, enabling compact and multifunctional devices. As the demand for smart and interconnected products rises across industries such as automotive, healthcare and consumer electronics, MID's ability to efficiently combine mechanical and electrical functions positions it as a crucial solution for meeting these evolving market needs.

Restraint:

High initial investment costs

Establishing the infrastructure for MID production, including specialized machinery and technology, requires substantial financial resources. Companies face challenges in allocating funds for research, development and production setup, hindering widespread adoption. The financial barriers limit market entry for potential competitors and may slow down the overall growth of the MID market.

Opportunity:

Advancements in manufacturing technologies

Advancements in manufacturing technologies present a significant opportunity in the molded interconnect device (MID) market by enhancing production efficiency and expanding design possibilities. Innovations like additive manufacturing, laser direct structuring, and 3D printing enable more intricate and customized MID designs. This streamlines the manufacturing process and allows for the integration of complex electronic functionalities. As a result, the MID market can capitalize on these advancements to offer more sophisticated, compact and cost-effective solutions, fostering industry growth.

Threat:

Fluctuations in raw material prices

Fluctuations in raw material prices pose a significant threat to the molded interconnect device (MID) market. As MID relies on specialized materials for both electronic and structural components, any volatility in the prices of these raw materials can impact production costs and overall profitability. Manufacturers may face challenges in maintaining competitive pricing and the uncertainty in material costs can disrupt supply chains, affecting the stability and growth of the MID market.

Covid-19 Impact:

The COVID-19 pandemic has impacted the molded interconnect devices (MID) market by disrupting global supply chains, causing production delays and affecting consumer demand. Lockdowns, social distancing measures and economic uncertainties have led to challenges in manufacturing and distribution. Additionally, shifts in priorities and reduced consumer spending have influenced the adoption of MID in various industries. Adaptation to remote work and changes in consumer behavior have also influenced market dynamics, requiring strategic adjustments from industry players.

The laser direct structuring (LDS) segment is expected to be the largest during the forecast period

The laser direct structuring (LDS) segment is projected to be the largest in the forecast period due to its advanced capabilities in molded interconnect device (MID) manufacturing. LDS technology enables precise and intricate circuit patterns by selectively activating additives in the molded substrate using laser beams. This method offers high flexibility and design complexity, making it increasingly favored in diverse applications. The demand for sophisticated electronic devices and the growing trend towards miniaturization contribute to the dominance of the LDS segment in the market.

The sensors segment is expected to have the highest CAGR during the forecast period

The sensors segment is anticipated to exhibit the highest growth rate during the forecast period in the molded interconnect devices (MID) market. This surge is attributed to the escalating demand for compact and integrated sensor solutions across industries. MID technology's ability to seamlessly embed sensors within three-dimensional structures enhances design efficiency and functionality, driving the growing adoption of MID in sensor applications and contributing to the segment's robust growth.

Region with largest share:

North America is poised to lead the molded interconnect devices (MID) market, boasting the largest share during the forecast period. This dominance is attributed to a robust electronics industry, technological innovation and widespread adoption across sectors like automotive, healthcare and telecommunications. Favorable economic conditions, a well-established manufacturing infrastructure and a proactive approach towards advanced technologies contribute to the region's prominence. The continuous demand for compact and multifunctional electronic solutions further propels the growth of the MID market in North America.

Region with highest CAGR:

The Asia-Pacific region is poised for rapid growth in the molded interconnect devices (MID) market due to its burgeoning electronics manufacturing sector, increasing adoption of advanced technologies and expanding consumer electronics markets. The region benefits from a robust supply chain, cost-effective manufacturing capabilities and a rising demand for compact and integrated electronic solutions. With supportive government initiatives and a flourishing innovation ecosystem, Asia-Pacific is becoming a focal point for MID applications, contributing to the anticipated swift expansion of the market.

Key players in the market

Some of the key players in Molded Interconnect Devices (MID) market include Amphenol Corporation, Cicor Group, Galtronics USA Inc. (Baylin Technologies), Harting Technology Group, Kübler Group, LP Technologies, Inc., LPKF Laser & Electronics AG, MacDermid Alpha Electronics Solutions, MID Solutions, Inc., Molex LLC, Multiple Dimensions AG, RTP Company, Taoglas, TE Connectivity Ltd., T-Ink Inc. and Yomura Technologies Inc.

Key Developments:

In November 2023, Molex has built a new medical device campus in Poland in a $110m project that adds high power busbar and battery interconnect for its electrification business. The new Molex facility Katowice, Poland, has an initial 23,000 square-meter manufacturing space for advanced medical devices for Phillips-Medisize as well as electric vehicle and electrification interconnect for Molex customers. The site will have advanced medical device assembly, packaging and injection molding and also manufacture interconnect battery solutions for electric vehicles and high-power busbar solutions for Molex’s electrification business.

In May 2022, Taoglas has signed a partnership agreement with Dejerao. The company will help Dejerao’s customers by providing best-in-class RF antennas for cellular bonding devices used in mobile applications.

In March 2022, Amphenol Corporation has expanded its SURLOK Plus Series to include 8 mm and 10.3 mm right-angle connectors, with a voltage range of 1500 VDC to meet energy storage and high-power connection and transfer requirements.

Product Types Covered:
• Antenna & Connectivity Modules
• Connectors & Switches
• Lighting Systems
• Sensors
• Other Product Types

Processes Covered:
• Laser Direct Structuring (LDS)
• Film Techniques
• Two-Shot Molding

End Users Covered:
• Telecommunications
• Automotive
• Consumer Electronics
• Industrial
• Medical
• Military & Aerospace
• Other End Users

Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements