LTCC Market and HTCC - Global Market Outlook (2021 - 2028)

LTCC Market and HTCC - Global Market Outlook (2021 - 2028)

According to Stratistics MRC, the Global LTCC Market and HTCC Market is accounted for $2.63 billion in 2021 and is expected to reach $3.82 billion by 2028 growing at a CAGR of 5.5% during the forecast period. Low-temperature Co-Fired Ceramics (LTCC) and are made at a temperature below 1,000°C which is achieved by adding in a glassy phase to the ceramic, which lowers its melting point whereas, HTCC is manufactured at a temperature above 1,600°C. They are used in various fields such as aerospace & defence, automotive, telecommunication, industrial, and medical. They have several advantages over the traditional printed circuit boards as due to their nature of chemical inactivity and high thermal stability.

Market Dynamics:

Driver:

Rising research spending for developing wireless technologies

Rising research spending for developing next-generation wireless technologies and ongoing collaborations among different research institutes are projected to further fuel market growth. For instance, LTCC offers superior performance in advanced automotive sensing, and HTCC technology can be utilized for next-generation automotive components such as the packaging of LED headlights, LD headlights, and DCB circuit substrates.

Restraint:

High cost of raw material

Fluctuations have been witnessed in raw material pricing owing to an imbalance in the demand-supply scenario during the COVID-19 pandemic in 2020. Since the beginning of 2021, production has been affected too owing to an increase in energy and freight costs.

Opportunity:

Growing trend of adopting online channels

Growing trend of adopting online channels in daily life has fueled the demand for telecommunication products over the forecast period. Furthermore, growing investments in the aerospace and defense industry are proving to be fruitful for the growth of the market as LTCC substrates are extensively used in various aircraft and fighter jets.

Threat:

Issues related to reparability

LTCC is an attractive solution for the packaging of microelectronic devices; however, numerous studies are underway to overcome challenges encountered during the production, processing, and application of LTCC. These challenges include chemical issues, which arise due to the interaction of thick films and glass phases in tapes, whereas physical issues arise due to the mismatch of screen-printed paste and tape.

The automotive segment is expected to have the highest CAGR during the forecast period

The automotive segment is growing at the highest CAGR during the forecast period. LTCC and HTCC are used in automotive electronics for a safer and enhanced driving experience. The inclination of consumers toward the safety of vehicles, adoption of telematics, and government-defined safety norms are the prominent factors driving the demand for automotive electronics. Key applications of automotive electronics include Advanced Driver Assistance Systems (ADAS), safety, powertrain, and infotainment. These applications have created a need for microcontrollers, actuators, processors, and sensors, which, in turn, are expected to augment market growth.

The telecommunications segment is expected to be the largest during the forecast period

The telecommunications segment is expected to be the largest share during the forecast period. Radio, microwaves, and millimeter waves are used for wireless communication. The penetration of LTCC technology is rapidly increasing for applications in microwave and millimeter-wave frequency band in areas including Bluetooth module, front end module of mobile phones, and WLAN. Moreover, new opportunities lie ahead as various companies are developing advanced LTCC products, which are projected to benefit these companies to expand their footprint in 5G communication.

Region with highest share:

North America is projected to hold the largest share in the market. The growth of the market in this region can be attributed to the rising demand for LTCC based PCBs and the flourishing wireless communication industry in the region.

Region with highest CAGR:

The Asia Pacific is projected to have the highest CAGR in the market owing to the rapidly flourishing automotive, consumer, and industrial electronics sectors in countries such as India, China, South Korea, and Japan. The ongoing incentive schemes for EVs by governments of different countries are anticipated to attract auto-electronic product manufacturers to the region. Furthermore, with the advent of 5G technology, China is witnessing investments in its power electronics industry, which is anticipated to benefit market growth.

Key players in the market:

Some of the key players profiled in the LTCC Market and HTCC Market include ACX Corp., API Technologies Corp, DowDuPont Inc., Hitachi Metals, Ltd., KOA Corporation, Kyocera Corporation, Maruwa Co., Ltd, Micro Systems Technologies, Murata Manufacturing Co., Ltd., NGK Spark Plug Co., Ltd., Nikko Company, Schenzhen Sunlord Electronics Co., Ltd., SOAR Technology Co., Ltd., TDK Corporation, and Yokowo Co., Ltd.

Key developments:

In June 2018: KYOCERA Corporation developed a new ultra-small robust ceramic UHF RFID Tag for tracing surgical instruments for the medical market. The product is made up of LTCC with an embedded antenna which helps in withstanding high temperatures up to 5432-degree Fahrenheit. The product helps in faster checkup in an operation theater that helps in saving time and cost.

In May 2017: KYOCERA Corporation developed an ultra-small ceramic package, utilizing a proprietary multilayer structure with a built-in RFID antenna. These RFID packages consist of Low-Temperature Co-Fired Ceramic (LTCC), which helps in giving low-loss and high-frequency benefits.

In July 2017: KYOCERA Corporation acquired VIA Electronic GmbH which helped the KOA Corporation to extend its LTCC market and HTCC market. This acquisition made KOA Corporation efficient in providing customized LTCC multilayer substrates. Thus, this acquisition helped the company to get market recognition due to the production of high product quality and process stability.

Process Types Covered:
High-Temperature Co-Fired Ceramic (HTCC)
Low-Temperature Co-Fired Ceramic (LTCC)

Material Types Covered:
Glass-Ceramic Material
Ceramic Material

Applications Covered:
Airbag Control Modules
Antilock Brake Systems
Control Units
Electronic Power Steering
Engine Management System
Entertainment & Navigation Systems
Light-Emitting Diode (LEDs)
Transmission Control Units
Other Applications

End Users Covered:
Aerospace & Defense
Automotive
Consumer Electronics
Industrial
Medical
Telecommunications
Other End Users

Regions Covered:
North America
US
Canada
Mexico
Europe
Germany
UK
Italy
France
Spain
Rest of Europe
Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
South America
Argentina
Brazil
Chile
Rest of South America
Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements

Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options:
Company Profiling
Comprehensive profiling of additional market players (up to 3)
SWOT Analysis of key players (up to 3)
Regional Segmentation
Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
Competitive Benchmarking
Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances