Embedded Die Packaging Technology Market Forecasts to 2028 – Global Analysis By Product (Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board), Application (Medical Wearable Devices, Smartphone & Tablets, Sp

Embedded Die Packaging Technology Market Forecasts to 2028 – Global Analysis By Product (Embedded Die in IC Package Substrate, Embedded Die in Rigid Board and Embedded Die in Flexible Board), Application (Medical Wearable Devices, Smartphone & Tablets, Sports/Fitness Devices, Industrial Controlling Devices and Other Applications), End User and By Geography

According to Stratistics MRC, the Global Embedded Die Packaging Technology Market is accounted for $75.81 billion in 2022 and is expected to reach $230.94 billion by 2028 growing at a CAGR of 20.4% during the forecast period. Embedded die packaging technique is a native 3D-compatible packaging method that reduces system in package (SiP) size by 70%. Miniaturization, improves electrical and thermal performance, heterogeneous integration, cost reduction potential, and successful OEM logistics are just a few of the many advantages of this technology. It is highly durable and stable, and it can be integrated into a variety of systems with minimal to no downtime. Because of its better I/O density, smaller size, and multi-die capability on a single platform, embedded die is a desired alternative.

According to the Indian Institute of Packaging (IIP), packaging consumption in India has surged by 200% over the last decade, from 4.3 kilograms per person per annum (pppa) in FY10 to 8.6 kg pppa in FY20.

Market Dynamics

Driver

Increasing demand for smaller electronic devices

Customers are increasingly interested in electronic, portable, and lightweight electrical items. As a result, fewer electric components are being used by more individuals. Electrical components with small form factors are being employed in the development of electronic devices to increase available space and improve final product design. When most components, including sensors and processors, are integrated into a single chip, customers benefit from enhanced functionality, which will boost market expansion throughout the forecast period.

Restraint

Associated high costs

The embedded die packaging technique is expensive, so it might be a barrier to market expansion. Die packing entails complex methods, costly equipment, and high prices. Despite the fact that silicon is the second most abundant material on the planet, wafer packaging is expensive. Silicon must be purified before it can be utilized to make semiconductor wafers and chips, which is a expensive process.

Opportunity

A rise in consumer electronics consumption and the use of 5g networks

Consumer electronics are electronic devices used for non-commercial purposes. Because of the increased adoption of a broader range of consumer electronics by the household sector, the consumer electronics industry has developed considerably. Manufacturers are investing heavily in integrating various digital technologies into consumer electronics gadgets, and they are also emphasizing the need to provide customers with high-quality experiences. Furthermore, as major market organizations increase their R&D and innovation expenditures, new goods with cutting-edge characteristics are being offered.

Threat

Difficulty to Inspect, Test, and Rework

It is projected that ED packaging technology will evolve from a single embedded die to several embedded dies. As a result, the complexity and size of IC substrates and boards will only increase. To achieve lower L/S values, current investments are focused on adopting cutting-edge approaches such as mSAP (modified semi-additive processing) rather than subtractive processes. As a result, higher integration is being recognized, particularly for complicated active dies with higher I/O counts. It is also critical to be able to put the boards together in order to achieve satisfactory results on the board fabrication end, which is not a feasible option.

Covid-19 Impact

The COVID-19 epidemic has had a mixed influence on the embedded die packaging technology market. With various governments enforcing and prolonging lockdowns, industrial and manufacturing facilities around the world have been locked down, resulting in a crisis and a lack of a workforce. Furthermore, the pandemic's onset has affected the worldwide supply chain, resulting in a huge gap in the supply chain. The pandemic's economic impact has been significant.

The Embedded die in flexible board segment is expected to be the largest during the forecast period

The Embedded die in flexible board segment is projected to witness the largest share as compared to other segments over the forecast period. With the increased advancement in technology, the product sale value of the printed circuit board is increasing and with the increased adoption of the flexible board in various wearable and IoT devices. Additionally, Stretchable Electronics (SC) is so far commercial and comes in many shapes and forms, components and as many as conductive interconnects are possible to be printed onto a flexible substrate, whereas the IC is produced using photolithography and then mounted, as a bare die, thereby boosting market growth.

The Consumer electronics segment is expected to have the highest CAGR during the forecast period

One of the main reasons anticipated to propel the implementation of embedded packaging throughout the forecast period is the growing functionality of consumer electrical items and the rising acceptance of smart devices and smart wearable’s. The need for platforms like the rigid board is fuelled by the increasing uptake of high-performance mobile devices and the rising penetration of cutting-edge technologies like AI and HPC. The increasing popularity and usefulness of smart wearable’s like fitness bands and smart watches are contributing to the expansion of the mobile and consumer markets.

Region with largest share

Asia-Pacific holds a significant share of the global embedded die packaging technology market size, owing to the presence of prime players in this region during the forecast period. Asia-Pacific embedded die packaging technology market forecast owing to the rise in investment by prime players and government agencies to develop next generation embedded die packaging technology-based semiconductor solutions to improve electrical thermal performance, reliability, and mechanical stability, which is expected to lead to the growth of embedded die packaging technology in this region.

Region with highest CAGR

During the forecast period, North America is expected to grow at the highest CAGR. The most significant contributors to semiconductor consumption in the Americas, particularly North America, are growing consumer electronics, including smart phones, smart watches, smart speakers, digital cameras, smart TVs, etc. The IoT Association reports that the United States has the highest ratio of smart home devices per household and the highest proportion of consumers who tend to possess gadgets with two or three different uses (security, energy, and appliances). The American automotive industry constantly looks for ways to lower costs and increase performance. As a result, there has been tremendous progress in many electrical and electronic components used in automobiles.

Key players in the market

Some of the key players in Embedded Die Packaging Technology Market include Amkor Technology Inc., ASE Group, AT&S Group, Fujikura Ltd., Fujitsu Limited, Infenion Technologies AG, Intel Corporation, Microsemi Corporation, Schweizer Electronic AG, Shinko Electric Industries Co. Ltd, STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited, TDK Corporation, Texas Instruments Incorporation and Toshiba Corporation.

Key Developments

In October 2022, Amkor Technology, Inc. introduced 5G RF module design, characterization, and packaging technology.

In May 2022, Fujikura, Ltd. announced it is collaborating with GlobalFoundries (GF) in enabling the commercial availability of Future Access, the industry's most integrated 28GHz 5G mm Wave module, for both mobile and fixed wireless infrastructure markets

In November 2021, Amkor announced the business expansion of advanced packaging technology capacity with a new factory setup in Bac Ninh, Vietnam.

In February 2021, Siemens and ASE, in collaboration for package design, developed and introduced enablement technologies for next-generation high-density advanced package designs.

Products Covered
• Embedded Die in IC Package Substrate
• Embedded Die in Rigid Board
• Embedded Die in Flexible Board

Applications Covered
• Medical Wearable Devices
• Smartphone & Tablets
• Sports/Fitness Devices
• Industrial Controlling Devices
• Industrial Metering Devices
• Military
• Industrial Sensing
• Other Applications

End Users Covered
• Consumer Electronics
• IT and Telecommunication
• Automotive
• Healthcare
• Aerospace & Defence
• Other End Users

Regions Covered
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa

What our report offers
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
- Market Trends (Drivers, Constraints, Opportunities,Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements