Electronic Packaging Market Forecasts to 2030 – Global Analysis By Material (Plastic, Metal, Glass and Other Materials), Type (Protective Packaging, Blister Packs And Clamshell, Bags And Pouches, Thermoformed Trays, Paperboard Boxes, Corrugated Boxes and

Electronic Packaging Market Forecasts to 2030 – Global Analysis By Material (Plastic, Metal, Glass and Other Materials), Type (Protective Packaging, Blister Packs And Clamshell, Bags And Pouches, Thermoformed Trays, Paperboard Boxes, Corrugated Boxes and Other Types), Packaging Technology (Chip Scale Packages (CSP), Surface Mount Technology and Through Hole Mounting), Technology, End User and By Geography

According to Stratistics MRC, the Global Electronic Packaging Market is accounted for $1.76 billion in 2023 and is expected to reach $6.49 billion by 2030 growing at a CAGR of 20.51% during the forecast period. Electronic packaging is the design and manufacture of enclosures for electronic components, such as mainframe computers or individual semiconductors, up to entire systems. This guards against mechanical harm, cooling, the emission of radio frequency noise, and electrostatic discharge. When making consumer electronics like smartphones, TVs, tablets, set-top boxes, and digital media adapters, efficient electrical and semiconductor packaging is used to shield the components from dust, corrosion, water, and electrostatic discharge.

According to IBEF, India's electric vehicle (EV) market is expected to reach INR 50,000 crores (USD 7.09 billion) by 2025. Further, a CEEW Centre for Energy Finance study shows India's USD 206 billion in opportunities for electric vehicles by 2030.

Market Dynamics:

Driver:

Innovation in technology

Consumer electronics products have a compelling case for business because of the technological advancement that is integrated into them and has the ability to lower costs and boost profits. Electronic packaging businesses are under pressure from technological advancements in the industry since the industry's package design is developing rapidly. Additionally, the requirements for electronic packaging increase and change as technology advances. The rapid advancement of silicon IC technology is one of the key characteristics of the electronics packaging market.

Restraint:

Considerations for the environment and potential reliability difficulties

There is a rising demand for environmentally friendly packaging materials and manufacturing techniques as environmental sustainability becomes more and more of a concern. However, it can be difficult to locate viable alternatives that satisfy performance objectives, budgetary restrictions, and environmental regulations. Also, potential reliability difficulties could limit market expansion because soldering components onto circuit boards exposes them to stress and requires complicated, challenging maintenance.

Opportunity:

Electronic packaging is in more demand as consumer electronics products become more prevalent

The commoditization of consumer electronics devices, evolving consumer purchasing trends, and shortening product life cycles are key drivers boosting the electronics packaging market's expansion. Additionally, the market is expanding due to the increasing use of consumer electronics devices like smartphones, wearable technology, televisions, digital cameras, and tablets that have innovative packaging products like air bubble wrap and air pillows to protect them from bad weather. Moreover, demand for all-weather protective packaging for delicate electronic products, including routers, network servers, and sensors, is also increasing. The market is expected to rise as a result of the increasing use of mobile phones and smart computing devices in various developing economies.

Threat:

Protection of intellectual property and high cost

The industry of electronic packaging involves the creation of cutting-edge packaging concepts, methods, and technology. It is essential to protect intellectual property (IP) rights to promote innovation and prevent unauthorized use or replication. Enforcing IP protection, can be challenging, especially in areas with lax IP laws and enforcement practices. However, electronic packaging can have expensive material costs, production procedures, and equipment requirements. This may make it more difficult for smaller businesses with limited resources to adopt cutting-edge packaging methods.

Covid-19 Impact:

Government limitations placed into effect in the wake of the COVID-19 epidemic have prompted the manufacturers of electronic packages to halt production, disrupting the supply chain for the whole semiconductor manufacturing and supply business. The demand for products powered by semiconductors has decreased as a result of the COVID-19 epidemic. Due to the lockdown situation, gadget production has stopped. The worldwide electronic packaging market's entire supply chain has been disrupted as a result.

The aerospace and defense segment is expected to be the largest during the forecast period

Due to the rising demand for military and aerospace devices, such as data processing units, data display devices, computers, and aircraft guidance-control assemblies, the aerospace and defense segment is anticipated to hold the largest market share over the projection period. Furthermore, boosting the market revenue for electronic packaging is the need for high-grade military-grade packaging in the aerospace and defense sectors for naval warships, satellite communication onboard channels, and weapon control systems.

The metal segment is expected to have the highest CAGR during the forecast period

Because metal is mechanically robust, offers electromagnetic shielding, and can be quickly fabricated for prototypes and small production runs with minimal special tooling expense, the metal category is predicted to have the highest CAGR throughout the projection period. Moreover, because of their superior mechanical qualities, electrical conductivity, thermal conductivity, and shielding characteristics, metals are frequently used in a variety of packaging applications.

Region with largest share:

Due to expanding automotive infrastructure and rising sales of electric vehicles, the Asia-Pacific region is anticipated to hold the largest share of the market over the projection period. A strong youth population and rising middle-class incomes could increase demand in the automotive sector. IBEF estimates that 2,081,148 units of passenger cars, three-wheelers, two-wheelers, and quadricycles were produced in total in June 2022, which will fuel market expansion in the region.

Region with highest CAGR:

Because of the demand from the electronics sector, technological advances, and substantial utilization areas in healthcare devices and packaging solutions, Asia-Pacific is predicted to have profitable growth. In the near future, market growth in the region is anticipated to be driven by an increase in the shrinking of electronic devices and goods across a wide range of electronic products. The National Investment Promotion and Facilitation Agency (NIPFA) reports that the demand for electronic products has significantly increased in India. Due to strong regulatory support, significant investments made by numerous stakeholders, and an increase in demand for electronic goods, it is predicted that the electronic manufacturing sector will reach US$220 billion by 2025.

Key players in the market

Some of the key players in Electronic Packaging market include AMETEK Inc., Blue Spark Technology, Dordan Manufacturing Company, E. I. du Pont de Nemours and Company, Excellatron Solid State, GY Packaging, Plastiform Inc., Infinite Power Solutions, Kiva Container Corporation, Primex Design & Fabrication, Quality Foam Packaging Inc., Sealed Air Corporation, The Box Co-Op and UFP Technologies, Inc.

Key Developments:

In June 2022, Digimarc Corporation announced a partnership with Sealed Air, a global leader in digital printing and packaging, to bring product digitization to markets such as eCommerce fulfillment, industrials, and consumer goods at scale via smart packaging.

In March 2022, Intel revealed the first phase of its efforts to invest up to EUR 80 billion (USD 84 billion) in the European Union over the following decade across the semiconductor value chain, from Research and Development to production to advanced packaging technologies.

Materials Covered:
• Plastic
• Metal
• Glass
• Other Materials

Types Covered:
• Protective Packaging
• Blister Packs And Clamshell
• Bags And Pouches
• Thermoformed Trays
• Paperboard Boxes
• Corrugated Boxes
• Other Types

Packaging Technologies Covered:
• Chip Scale Packages (CSP)
• Surface Mount Technology
• Through Hole Mounting

Technologies Covered:
• Radio-frequency Identification
• Electronic Article Surveillance

End Users Covered:
• Aerospace and Defense
• Healthcare
• Automotive
• Other End Users

Regions Covered:
• North America
US
Canada
Mexico
• Europe
Germany
UK
Italy
France
Spain
Rest of Europe
• Asia Pacific
Japan
China
India
Australia
New Zealand
South Korea
Rest of Asia Pacific
• South America
Argentina
Brazil
Chile
Rest of South America
• Middle East & Africa
Saudi Arabia
UAE
Qatar
South Africa
Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2021, 2022, 2023, 2026, and 2030
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements

Companies Mentioned
AMETEK Inc.
Blue Spark Technology
Dordan Manufacturing Company
E. I. du Pont de Nemours and Company
Excellatron Solid State
GY Packaging, Plastiform Inc.
Infinite Power Solutions
Kiva Container Corporation
Primex Design & Fabrication
Quality Foam Packaging Inc.
Sealed Air Corporation
The Box Co-Op
UFP Technologies, Inc