A 3D IC and 2.5D IC Packaging Market Forecasts to 2028 – Global Analysis By Packaging Technology (3D Through-Silicon Via (TSV), 3D Wafer-Level Chip-Scale Packaging (WLCSP) and 2.5D)

3D IC and 2.5D IC Packaging Market Forecasts to 2028 – Global Analysis By Packaging Technology (3D Through-Silicon Via (TSV), 3D Wafer-Level Chip-Scale Packaging (WLCSP) and 2.5D), Application (Imaging & Optoelectronics, Memory, Logic, MEMS/Sensors, LED and Other Applications), End User and By Geography

According to Stratistics MRC, the Global 3D IC and 2.5D IC Packaging Market is accounted for $49.3 billion in 2022 and is expected to reach $101.0 billion by 2028 growing at a CAGR of 12.7% during the forecast period. 2.5D / 3D packaging is a way of putting numerous integrated circuits (IC) into the same package. Two or more active semiconductor chips are put side by side atop a silicon interposer in a 2.5D arrangement to achieve extraordinarily high die-to-die connection density. Active chips in 3D structures are integrated via die stacking for the shortest connectivity and lowest package footprint. Because of their advantages in obtaining exceptionally high package density and great energy efficiency, 2.5D and 3D have gained traction as an appropriate chiplet integration platform in recent years.

According to WSTS, the IC market for semiconductors reached USD 463 billion in revenue in 2021 and is expected to grow by over 10% to USD 510.96 billion in 2022 due to the surging usage of advanced wafer-level packaging technologies in sensors and MEMS, is expected to provide growth prospects for the 3D IC packaging market during the forecast period.

Market Dynamics:

Driver:

Consumer gadgets and gaming devices are becoming increasingly popular

Many new gadgets are entering the market as a result of recent technological advancements, such as e-book readers, gaming devices, tablet computers, 3D smart glass, augmented reality, and virtual reality products, all of which require high-performance electronic components. By shortening the critical route and lowering latency, 3D IC packaging technology has helped overcome the processor memory performance gap. It also enables scaling to continue in an effective manner by shifting the emphasis from device-level scaling to circuit- and system-level scaling.

Restraint:

Thermal difficulties caused by a higher level of integration

3D integrated circuits provide extremely dense multi-level integration per unit footprint. Though this is appealing for many applications where miniaturisation is a concern, it also poses thermal management challenges; increased integration leads to high on-chip temperatures. A bigger form factor, the need for a larger silicon interposer, and lengthier design cycles are all difficulties that must be addressed with 3D ICs. During the production of 3D ICs with TSVs, overheating has been observed. Elevated temperatures cause a decrease in threshold voltage and mobility deterioration.

Opportunity:

A growing number of smart infrastructure and smart city initiatives are being developed

3D IC packaging has the potential to play an important role in the development and deployment of smart city technologies. Smart cities use a range of electronic devices, sensors, and systems to gather and analyse data in real time, allowing for better decision-making and resource management. These devices and systems can be made smaller, more powerful, and energy efficient by utilising 3D IC packaging. This contributes to lowering the total cost and size of smart city infrastructure while enhancing performance and dependability.

Threat:

3D IC packaging reliability challenges

Applications like as information centred, cloud, accessibility, and the Internet of Things (IoT) drive the semiconductor sector business. To meet the needs of modern information and communication technology (ICT) systems, packaging technology must improve in tandem with the scaling of integrated circuit (IC) technology. Package development and design must fulfil price, efficiency, form factor, and dependability goals all at the same time. When it comes to operating the layout, the power density for a given footprint is higher than for typical 2D chips. However, addressing issues of dependability will be critical which hampers the growth of the market.

Covid-19 Impact

The COVID-19 pandemic has had a huge influence on different businesses while also propelling the development of new medical equipment and gadgets throughout the world. Following the pandemic outbreak, several medical equipment manufacturing companies announced an increase in the production of several new equipment and devices. Because 3D IC packaging has numerous applications in the medical and healthcare industries, increased manufacturing initiatives are expected to increase demand for 3D IC and 2.5D IC packaging.

The 3D wafer-level chip-scale packaging (WLCSP) segment is expected to be the largest during the forecast period

The 3D wafer-level chip-scale packaging (WLCSP) segment is estimated to have a lucrative growth, due to its one of most tightly packaging type, offering enhanced capabilities and improved thermal stability in printed circuit boards. 3D WLCSP is a simpler process architecture for producing 3D ICs, which employs polymers that can withstand high temperatures, resolving the thermal stability issue, which is the market's biggest difficulty. Because it provides economical, small, lightweight, exceptional performance semiconductor solutions, 3D WLCSP has been gaining prominence in facility-constrained consumer’s electronic applications and other portable consumer devices, as well as industrial products.

The MEMS/Sensors segment is expected to have the highest CAGR during the forecast period

The MEMS/Sensors segment is anticipated to witness the highest CAGR growth during the forecast period, because MEMS functional components include micro sensors, micro actuators, and microelectronics. MEMS advanced elements include accelerometers, gyroscopes, digital compasses, inertial modules, pressure sensors, humidity sensors, microphones, and smart sensors, among others. The essential need in all of these parts and sensors is a miniaturised construction. As a result, many sensors are now using 3D IC and 2.5D IC packaging.

Region with highest share:

Asia Pacific is projected to hold the highest market share during the forecast period owing to its extensive reach in numerous consumer electronics applications, notably smartphone and tablets, the Asia Pacific area is one of the important markets for 3D IC and 2.5D IC packaging. This is mostly due to the region's high population density, which makes it the greatest potential market for 3D IC and 2.5D IC packaging among the four key areas.

Region with highest CAGR:

North America is projected to have the highest CAGR over the forecast period, owing to rising demand for electronics; growing patterns of remote work and remote operations, and boosting digitalization have all contributed to the need for cutting-edge semiconductor devices in the United States. As the demand for semiconductor devices rises, modern packaging techniques provide the processing power and form factor required for today's digital world. These factors are expected to drive 3D IC and 2.5D IC sales in the United States.

Key players in the market

Some of the key players profiled in the 3D IC and 2.5D IC Packaging Market include Samsung, ASE Technology Holding Co., Ltd., Amkor Technology, Broadcom, United Microelectronics Corporation, Texas Instruments Inc, Powertech Technology Inc., JCET Group Co., Ltd., Taiwan Semiconductor Manufacturing Company, Ltd., Intel Corporation, Toshiba Corporation, Invensas, GlobalFoundries, Siliconware Precision Industries Co. Ltd (SPIL) and Jiangsu Changjiang Electronics Technology Co., Ltd.

Key Developments:

In April 2023, Samsung Opens Free-to-Play Gaming Zones in Collaboration With Xbox at Microsoft Experience Centers in London, New York, with this partnership, Samsung Gaming Hub users are now able to stream over 100 high-quality games through the Xbox App by subscribing to Xbox Game Pass Ultimate.

In April 2023, Samsung and TOILETPAPER Collaborate to Introduce Edgy, Iconic Designs for Bespoke Appliances, together with creative partner TOILETPAPER, Samsung offers new, limited-edition Bespoke panels that maximize bold self-expression and personalization in the kitchen.

In March 2023, Amkor Expands Power Solutions for Automotive Electrification, as the demand for electrification, renewable energy, and efficient power delivery continues to grow, Amkor is focusing increased effort on silicon carbide

Packaging Technologies Covered:
• 3D Through-Silicon Via (TSV)
• 3D Wafer-Level Chip-Scale Packaging (WLCSP)
• 2.5D

Applications Covered:
• Imaging & Optoelectronics
• Memory
• Logic
• MEMS/Sensors
• LED
• Other Applications

End Users Covered:
• Industrial
• Telecommunications
• Consumer Electronics
• Military & Aerospace
• Medical Devices
• Automotive

Regions Covered:
• North America
o US
o Canada
o Mexico
• Europe
o Germany
o UK
o Italy
o France
o Spain
o Rest of Europe
• Asia Pacific
o Japan
o China
o India
o Australia
o New Zealand
o South Korea
o Rest of Asia Pacific
• South America
o Argentina
o Brazil
o Chile
o Rest of South America
• Middle East & Africa
o Saudi Arabia
o UAE
o Qatar
o South Africa
o Rest of Middle East & Africa

What our report offers:
- Market share assessments for the regional and country-level segments
- Strategic recommendations for the new entrants
- Covers Market data for the years 2020, 2021, 2022, 2025, and 2028
- Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
- Strategic recommendations in key business segments based on the market estimations
- Competitive landscaping mapping the key common trends
- Company profiling with detailed strategies, financials, and recent developments
- Supply chain trends mapping the latest technological advancements