Asia Pacific Wi-Fi Chipset Market Size- By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User- Regional Outlook, Competitive Strategies and Segment Forecast to 2033

Best Price Guarantee	Length	Publisher	Published Date	SKU
from $4,250	157 Pages	SPER Market Research Pvt. Ltd.	August, 2024	SPER19136525

Best Price Guarantee
Price	from $4,250
Length	157 Pages
Publisher	SPER Market Research Pvt. Ltd.
Published Date	August, 2024
SKU	SPER19136525

Asia Pacific Wi-Fi Chipset Market Introduction and Overview

According to SPER market research, ‘Asia Pacific Wi-Fi Chipset Market Size – By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User – Regional Outlook, Competitive Strategies and Segment Forecast to 2033’ state that the Asia Pacific Wi-Fi Chipset Market is predicted to reach USD 8919.14 million by 2033 with a CAGR of 3.45%.

Wi-Fi technology has gained in popularity as smartphones become more widely used around the world. Customers choose Voice-Over Mobile Broadband (VOMBB) over traditional telecom carriers because to its superior audio quality, low cost, and ability to conserve power, hence increasing demand for Wi-Fi services.

Furthermore, due to short-term production shutdowns, supply chain interruptions, and a lack of linked product availability, the IoT connection market is predicted to experience an 18% decrease in net device additions in 2020.

Scope of the Report:

Report Metric Details
Market size available for years 2020-2033
Base year considered 2023
Forecast period 2024-2033
Segments covered By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User
Regions covered China, Japan, India, South Korea, Australia, Indonesia, Others
Companies Covered Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO. LTD, Broadcom, Hitachi, Cisco Systems. Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics.

Asia Pacific Wi-Fi Chipset Market Segmentation:

By Device: Based on the Device, Asia Pacific Wi-Fi Chipset Market is segmented as; Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others.

By Wi-Fi Standard: Based on the Wi-Fi Standard, Asia Pacific Wi-Fi Chipset Market is segmented as; 802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others.

By MIMO Configuration: Based on the MIMO Configuration, Asia Pacific Wi-Fi Chipset Market is segmented as; MU-MIMO, 4×4 MU-MIMO, 8×8 MU-MIMO, SU-MIMO, 3×3 MU-MIMO, 2×2 MU-MIMO, 1×1 MU-MIMO.

By Region: This research includes data for China, Japan, India, South Korea, Australia, Indonesia, Others.

1. Introduction: 1.1. Scope of the report; 1.2. Market segment analysis
2. Research Methodology: 2.1. Research data source; 2.1.1. Secondary Data; 2.1.2. Primary Data; 2.1.3. SPER’s internal database; 2.1.4. Premium insight from KOL’s; 2.2. Market size estimation; 2.2.1. Top-down and Bottom-up approach; 2.3. Data triangulation
3. Executive Summary
4. Market Dynamics: 4.1. Driver, Restraint, Opportunity and Challenges analysis; 4.1.1. Drivers; 4.1.2. Restraints; 4.1.3. Opportunities; 4.1.4. Challenges; 4.2. COVID-19 Impacts of the Asia Pacific Wi-Fi Chipset Market
5. Market variable and outlook: 5.1. SWOT Analysis; 5.1.1. Strengths; 5.1.2. Weaknesses; 5.1.3. Opportunities; 5.1.4. Threats; 5.2. PESTEL Analysis; 5.2.1. Political Landscape; 5.2.2. Economic Landscape; 5.2.3. Social Landscape; 5.2.4. Technological Landscape; 5.2.5. Environmental Landscape; 5.2.6. Legal Landscape; 5.3. PORTER’s Five Forces; 5.3.1. Bargaining power of suppliers; 5.3.2. Bargaining power of buyers; 5.3.3. Threat of Substitute; 5.3.4. Threat of new entrant; 5.3.5. Competitive rivalry; 5.4. Heat Map Analysis
6. Competitive Landscape: 6.1. Asia Pacific Wi-Fi Chipset Market Manufacturing Base Distribution, Sales Area, Product Type; 6.2. Mergers & Acquisitions, Partnerships, Product Launch, and Collaboration in Asia Pacific Wi-Fi Chipset Market
7. Asia Pacific Wi-Fi Chipset Market, By Device (USD Million) 2020-2033: 7.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Device, 2020-2026; 7.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Device, 2027-2033; 7.3. Tablet; 7.4. Connected Home Devices; 7.5. Smartphones; 7.6. PCS; 7.7. Access Point Equipment; 7.8. Others
8. Asia Pacific Wi-Fi Chipset Market, By Band (USD Million) 2020-2033: 8.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Band, 2020-2026; 8.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Band, 2027-2033; 8.3. Single Band; 8.4. Dual Band; 8.5. Tri Band
9. Asia Pacific Wi-Fi Chipset Market, By Fabrication Technology (USD Million) 2020-2033: 9.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Fabrication Technology, 2020-2026; 9.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Fabrication Technology, 2027-2033; 9.3. Finfet; 9.4. FDSOI CMOS; 9.5. Silicon on Insulator; 9.6. Sige
10. Asia Pacific Wi-Fi Chipset Market, By Wifi Standard (USD Million) 2020-2033: 10.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Wifi Standard, 2020-2026; 10.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By Wifi Standard, 2027-2033; 10.3. 802.11AY; 10.4. 802.11AD; 10.5. 802.11AX; 10.6. 802.11AC; 10.7. WAVE 1; 10.8. 802.11AC; 10.9. WAVE 2; 10.10. 802.11B; 10.11. 802.11G; 10.12. 802.11N
11. Asia Pacific Wi-Fi Chipset Market, By MIMO Configuration (USD Million) 2020-2033: 11.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By MIMO Configuration, 2020-2026; 11.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By MIMO Configuration, 2027-2033; 11.3. SU-MIMO; 11.4. MU-MIMO; 11.5. 1X1 MU-MIMO; 11.6. 2X2 MU-MIMO; 11.7. 3X3 MU-MIMO; 11.8. 4X4 MU-MIMO; 11.9. 8X8 MU-MIMO
12. Asia Pacific Wi-Fi Chipset Market, By End User (USD Million) 2020-2033: 12.1. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By End User, 2020-2026; 12.2. Asia Pacific Wi-Fi Chipset Market Size, Share and Forecast, By End User, 2027-2033; 12.3. Consumer; 12.4. Automotive; 12.5. Transportation; 12.6. Healthcare; 12.7. Education; 12.8. BFSI; 12.9. Travel; 12.10. Hospitality; 12.11. Others
13. Asia Pacific Wi-Fi Chipset Market Forecast, 2020-2033 (USD Million): 13.1. Asia Pacific Wi-Fi Chipset Market Size and Market Share
14. Asia Pacific Wi-Fi Chipset Market, By Region, 2020-2033 (USD Million): 14.1. Asia Pacific Wi-Fi Chipset Market Size and Market Share By Region (2020-2026); 14.2. Asia Pacific Wi-Fi Chipset Market Size and Market Share By Region (2027-2033); 14.3. China; 14.4. Japan; 14.5. India; 14.6. South Korea; 14.7. Australia; 14.8. Indonesia; 14.9. Others
15. Company Profile: 15.1. Intel Corporation; 15.1.1. Company details; 15.1.2. Financial outlook; 15.1.3. Product summary; 15.1.4. Recent developments; 15.2. Qualcomm Technologies. Inc; 15.2.1. Company details; 15.2.2. Financial outlook; 15.2.3. Product summary; 15.2.4. Recent developments; 15.3. ESPRESSIF SYSTEMS (SHANGHAI) CO LTD; 15.3.1. Company details; 15.3.2. Financial outlook; 15.3.3. Product summary; 15.3.4. Recent developments; 15.4. Broadcom; 15.4.1. Company details; 15.4.2. Financial outlook; 15.4.3. Product summary; 15.4.4. Recent developments; 15.5. Hitachi; 15.5.1. Company details; 15.5.2. Financial outlook; 15.5.3. Product summary; 15.5.4. Recent developments; 15.6. Cisco Systems, Inc; 15.6.1. Company details; 15.6.2. Financial outlook; 15.6.3. Product summary; 15.6.4. Recent developments; 15.7. Microsoft; 15.7.1. Company details; 15.7.2. Financial outlook; 15.7.3. Product summary; 15.7.4. Recent developments; 15.8. Apple Inc; 15.8.1. Company details; 15.8.2. Financial outlook; 15.8.3. Product summary; 15.8.4. Recent developments; 15.9. Celeno Communications; 15.9.1. Company details; 15.9.2. Financial outlook; 15.9.3. Product summary; 15.9.4. Recent developments; 15.10. Taiwan Semiconductor Manufacturing Company Limited; 15.10.1. Company details; 15.10.2. Financial outlook; 15.10.3. Product summary; 15.10.4. Recent developments; 15.11. STMicroelectronics; 15.11.1. Company details; 15.11.2. Financial outlook; 15.11.3. Product summary; 15.11.4. Recent developments; 15.12. Others
16. Conclusion
17. List of Abbreviations
18. Reference Links

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Asia Pacific Wi-Fi Chipset Market Size- By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User- Regional Outlook, Competitive Strategies and Segment Forecast to 2033