Asia Pacific Wi-Fi Chipset Market Size- By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User- Regional Outlook, Competitive Strategies and Segment Forecast to 2033
Asia Pacific Wi-Fi Chipset Market Introduction and Overview
According to SPER market research, ‘Asia Pacific Wi-Fi Chipset Market Size – By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User – Regional Outlook, Competitive Strategies and Segment Forecast to 2033’ state that the Asia Pacific Wi-Fi Chipset Market is predicted to reach USD 8919.14 million by 2033 with a CAGR of 3.45%.
Wi-Fi technology has gained in popularity as smartphones become more widely used around the world. Customers choose Voice-Over Mobile Broadband (VOMBB) over traditional telecom carriers because to its superior audio quality, low cost, and ability to conserve power, hence increasing demand for Wi-Fi services.
Furthermore, due to short-term production shutdowns, supply chain interruptions, and a lack of linked product availability, the IoT connection market is predicted to experience an 18% decrease in net device additions in 2020.
Scope of the Report:Report Metric Details
Market size available for years 2020-2033
Base year considered 2023
Forecast period 2024-2033
Segments covered By Device, By Band, By Fabrication Technology, By Wi-Fi Standard, By MIMO Configuration, By End User
Regions covered China, Japan, India, South Korea, Australia, Indonesia, Others
Companies Covered Intel Corporation, Qualcomm Technologies Inc, ESPRESSIF SYSTEMS (SHANGHAI) CO. LTD, Broadcom, Hitachi, Cisco Systems. Inc, Microsoft, Apple Inc, Celeno Communications, Taiwan Semiconductor Manufacturing Company Limited, STMicroelectronics.
Asia Pacific Wi-Fi Chipset Market Segmentation:
By Device: Based on the Device, Asia Pacific Wi-Fi Chipset Market is segmented as; Smartphones, Connected Home Devices, Access Point Equipment, PCs, Tablets, Others.
By Wi-Fi Standard: Based on the Wi-Fi Standard, Asia Pacific Wi-Fi Chipset Market is segmented as; 802.11n, 802.11ac, Wave 2, 802.11ac, Wave 1, 802.11ax, 802.11ad, 802.11ay, 802.11b, 802.11g, Others.
By MIMO Configuration: Based on the MIMO Configuration, Asia Pacific Wi-Fi Chipset Market is segmented as; MU-MIMO, 4×4 MU-MIMO, 8×8 MU-MIMO, SU-MIMO, 3×3 MU-MIMO, 2×2 MU-MIMO, 1×1 MU-MIMO.
By Region: This research includes data for China, Japan, India, South Korea, Australia, Indonesia, Others.