Global Hermetic Packaging Market Report Size, Trends & Growth Opportunity, By Configuration (Pressed Ceramic Packages, Multilayer Ceramic Packages, Metal Can Packages), By Application (Transistors, Photodiodes, Lasers, Airbag Ignitors, Sensors, MEMS Switc

Global Hermetic Packaging Market Report Size, Trends & Growth Opportunity, By Configuration (Pressed Ceramic Packages, Multilayer Ceramic Packages, Metal Can Packages), By Application (Transistors, Photodiodes, Lasers, Airbag Ignitors, Sensors, MEMS Switches, Oscillating Crystals), By Industry (Automotive, Consumer Electronics, Medical, Military & Defense, Aeronautics and Space, Telecommunications, Energy and Nuclear Safety), By Type (Reed Glass, Passivation Glass, Glass–Metal Sealing (GTMS), Ceramic–Metal (CERTM) ealing), By Region (North America, Europe, Asia Pacific, Latin America, Middle East) And Forecast Till 2027.

Global Hermetic Packaging Market

Global Hermetic Packaging was valued at US$ 1,976.34 Million in 2021, estimated to reach US$ 5,380.80 Million in 2027, with a CAGR 13.03 % from 2022-2027.

An elevated packaging technique used in active and passive electronic equipment, as well as in the electronics and semiconductor industries is known as Hermetic packaging. hermetic packaging protects Ultrasensitive electronics, like laser diodes, sensors, and optoelectronic elements from moisture and rust. Environmental factors like fluctuations in air pressure, moisture, dirt, and other risks that could harm electrical contacts or critical electronic components are also protected by hermetic packaging.

Market Drivers

Hermetic products protect against various environmental conditions such as soil/grime, humidity/ moisture, changes in atmospheric pressure and other natural hazards that could otherwise damage delicate electronics or disrupt electrical connections within Hermetic products.

Owing to this, the rate of adoption of Hermetic packaging for protecting highly sensitive electronic components is significantly high and is expected to increase further during the forecast period.

The numerous benefits of hermetic packaging such as lightweight, excellent media resistance, autoclavability, high electric insulation, thermal shock stability and temperature stability, among others drive the demand for the hermetic packaging in medical sector.

Market Restraints

The development of the hermetic packaging market is anticipated to be hindered by the availability of alternative packaging technologies. Despite its growth, hermetic packaging runs the chance of getting surpassed by a number of alternatives that are viewed as more dependable and protective.

A choice among these is plastic packaging. Microelectronic components used in military, aerospace, and medical systems must adhere to the highest hermetic packaging regulations due to their harsh environments and crucial applications.

Older equipment lacks the sensitivity needed to test to the higher requirements, forcing companies to buy new leak test equipment as a result of tighter rules.

Manufacturers of hermetic packaging systems must adhere to these requirements in order to increase their market share at the expense of escalating costs. These strict requirements for hermetic packaging are expected to impede the market's growth. Plastic packaging becomes a good choice because of its resistance to outside forces.

Market Segmentation

Hermetic Packaging Market is segmented into major 4 categories. Based on Configuration, the market is segmented into Pressed Ceramic Packages, Multilayer Ceramic Packages, Metal Can Packages. Based on Application, the market is divided into Transistors, Photodiodes, Lasers, Airbag Ignitors, Sensors, MEMS Switches, Oscillating Crystals. Based on Industry, the market is segmented into Automotive, Consumer Electronics, Medical, Military & Defense, Aeronautics and Space, Telecommunications, Energy and Nuclear Safety. Based on Type, the market is segmented into (Reed Glass, Passivation Glass, Glass–Metal Sealing (GTMS), Ceramic–Metal (CERTM) ealing. Based on Region, the market is segmented into North America, Europe, Asia Pacific, Latin America, Middle East.

Regional Analysis

Asia-Pacific region dominates the Hermetic Packaging market across the world with CAGR 13.06% owing to the proliferation of numerous electronic devices and component manufacturers, coupled with the increased government budget for the aerospace and defense sector, particularly in China, Japan, and India, has led to high demand for the product in the region.

North America occupied the second-highest market portion after the Asia Pacific and is anticipated to grow at a significant CAGR throughout the forecast period owing to the aeronautics and space being one of the major applications of hermetic packaging in the region. The industry is expected to offer huge opportunities for the market growth on account of the presence of numerous aerospace companies in the U.S.

Market Key Players

Some of the key players operating in Global Hermetic Packaging Market are Ametek, Schott, Amkor, Kyocera, Teledyne Microelectronics, Materion, Legacy Technologies, Egide, Solid State plc, Renesas Electronics.

Industry development

In February 2017, Egide SA (Egide SA is a company engaged in the electrical components industry.) has announced that it has acquired Santier, Inc. Santier, Inc. designs and manufactures microelectronic housings and assemblies.

In July 2022, Materion Corporation, a world leader in high-performing advanced materials, has jointly commissioned a Molten Salt Purification Plant (MSPP) with Kairos Power at Materion’s location in Elmore, Ohio for the commercial production of Flibe, a molten salt coolant used in nuclear energy production. The two companies formed the strategic collaboration in 2020 to develop a reliable and cost-effective supply of salt coolant for high-temperature molten salt reactors – a clean, affordable and safe nuclear energy solution that has the potential to transform the global energy landscape.

In January 2017, Solid State Plc (AIM: SOLI), the specialist value added component supplier and design-in manufacturer of computing, power and communications products, announces that it has entered into a conditional agreement to acquire Custom Power LLC for a maximum consideration of $45.0m. Custom Power is a battery systems manufacturer and energy solutions provider based near Los Angeles in the United States of America.