Global Test & Burn-in Socket Market Research Report 2024

Global Test & Burn-in Socket Market Research Report 2024

The global Test & Burn-in Socket market was valued at US$ 1480.97 million in 2023 and is anticipated to reach US$ 2189.31 million by 2030, witnessing a CAGR of 5.78% during the forecast period 2024-2030.

The major global manufacturers of Test & Burn-in Socket include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths(Plastronics), LEENO, Sensata Technologies, Johnstech, and Yokowo, etc. In 2023, the world's top three vendors accounted for approximately 27.74 % of the revenue.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Test & Burn-in Socket, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Test & Burn-in Socket.

The Test & Burn-in Socket market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Test & Burn-in Socket market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Test & Burn-in Socket manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

Market Segmentation

By Company

Yamaichi Electronics

Cohu

Enplas

ISC

Smiths(Plastronics)

LEENO

Sensata Technologies

Johnstech

Yokowo

WinWay Technology

Loranger

OKins Electronics

Ironwood Electronics

3M

M Specialties

Aries Electronics

Emulation Technology

Qualmax

MJC

Essai

Rika Denshi

Robson Technologies

Translarity

Test Tooling

Exatron

Gold Technologies

JF Technology

Advanced

Ardent Concepts

by Type

Burn-in Socket

Test Socket

by Application

Memory

CMOS Image Sensor

High Voltage

RF

SOC, CPU, GPU, etc.

Other Non-Memory

Production by Region

North America

Europe

China

Japan

South Korea

Consumption by Region

North America

U.S.

Mexico

Canada

Asia-Pacific

China

Japan

South Korea

Southeast Asia

India

Europe

Germany

France

U.K.

Italy

Russia

Rest of Europe

Latin America, Middle East & Africa

Brazil

Middle East

Africa

Rest of Latin America

Chapter Outline:

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Test & Burn-in Socket manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Test & Burn-in Socket by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Test & Burn-in Socket in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.

Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 10: The main points and conclusions of the report.