Global Test & Burn-in Socket Market Insights, Forecast to 2028
Summary
Market Analysis and Insights: Global Test & Burn-in Socket Market
Due to the COVID-19 pandemic, the global Test & Burn-in Socket market size is estimated to be worth US$ 1337.24 million in 2022 and is forecast to a readjusted size of US$ 2069.54 million by 2028 with a CAGR of 7.55% during the review period. Fully considering the economic change by this health crisis, Test Socket accounting for 60.32% of the Test & Burn-in Socket global market in 2021, is projected to value US$ 1352.89 million by 2028, growing at a revised 8.78% CAGR in the post-COVID-19 period. While Memory segment is altered to an 8.65 % CAGR throughout this forecast period.
The global key manufacturers of Test & Burn-in Socket include Yamaichi Electronics, Cohu, Enplas, ISC, Smiths Interconnect, LEENO, Sensata Technologies, Johnstech, and Yokowo, etc. In 2021, the global top five players have a share approximately 47.06% in terms of revenue.
In terms of production side, this report researches the Test & Burn-in Socket production, growth rate, market share by manufacturers and by region (region level and country level), from 2017 to 2022, and forecast to 2028.
In terms of sales side, this report focuses on the sales of Test & Burn-in Socket by region (region level and country level), by company, by Type and by Application. from 2017 to 2022 and forecast to 2028.
Global Test & Burn-in Socket Scope and Segment
Test & Burn-in Socket market is segmented by Type, and by Application. Players, stakeholders, and other participants in the global Test & Burn-in Socket market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on production capacity, revenue and forecast by Type, and by Application for the period 2017-2028.
By Company
Yamaichi Electronics
Cohu
Enplas
ISC
Smiths Interconnect
LEENO
Sensata Technologies
Johnstech
Yokowo
WinWay Technology
Loranger
Plastronics
OKins Electronics
Ironwood Electronics
3M
M Specialties
Aries Electronics
Emulation Technology
Qualmax
MJC
Essai
Rika Denshi
Robson Technologies
Translarity
Test Tooling
Exatron
Gold Technologies
JF Technology
Advanced
Ardent Concepts
Segment by Type
Burn-in Socket
Test Socket
Segment by Application
Memory
CMOS Image Sensor
High Voltage
RF
SOC, CPU, GPU, etc.
Other Non-Memory
Production by Region
United States
Korea
China
Japan
Europe
Sales by Region
North America
U.S.
Mexico
Canada
Asia-Pacific
China
Japan
South Korea
India
Southeast Asia(EX Singapore)
Europe
Germany
France
U.K.
Italy
Russia
Latin America
Brazil
Argentina
Middle East & Africa
Middle East
Africa
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