Global Solder Paste Market Research Report 2022

Global Solder Paste Market Research Report 2022

The global Solder Paste market is projected to reach US$ 1.44 billion by 2028 from an estimated US$ 1.25 billion in 2022, at a CAGR of 2.31% during 2022 and 2028. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

North American market for Solder Paste is estimated to increase from $ 126.15 million in 2022 to reach $ 132.10 million by 2028, at a CAGR of 0.77% during the forecast period of 2023 through 2028.

Asia-Pacific market for Solder Paste is estimated to increase from $ 989.55 million in 2022 to reach $ 1,162.39 million by 2028, at a CAGR of 2.72% during the forecast period of 2022 through 2028.

The major global manufacturers of Solder Paste include MacDermid Alpha Electronics Solutions, Senju Metal Industry, Harima Chemicals, Heraeus, Tongfang Tech, AIM and Shenzhen Vital New Material, etc. In 2021, the world's top three vendors accounted for approximately 33.49of the revenue.

The global market for Solder Paste in SMT Assembly is estimated to increase from $ 928.23 million in 2022 to $ 1,057.41 million by 2028, at a CAGR of 2.20% during the forecast period of 2022 through 2028.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Solder Paste, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Solder Paste.

The Solder Paste market size, estimations, and forecasts are provided in terms of output/shipments (MT) and revenue ($ millions), considering 2021 as the base year, with history and forecast data for the period from 2017 to 2028. This report segments the global Solder Paste market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Solder Paste manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.

By Company

MacDermid Alpha Electronics Solutions

Senju Metal Industry

Harima Chemicals

Heraeus

Tongfang Tech

AIM

Shenzhen Vital New Material

Indium

Tamura

Shengmao

KOKI

Inventec Performance Chemicals

Nihon Superior

Shenzhen Chenri Technology

DS HiMetal

Yashida

Yong An

Segment by Type

Rosin Based Pastes

Water Soluble pastes

No-clean pastes

Segment by Application

SMT Assembly

Semiconductor Packaging

Production by Region

North America

Europe

China

Japan

Korea

Taiwan

Southeast Asia

Rest of World

Consumption by Region

North America

U.S.

Canada

Asia-Pacific

China

Japan

South Korea

China Taiwan

Southeast Asia

India

Australia

Rest of APAC

Europe

Germany

France

U.K.

Italy

Russia

Rest of Europe

Latin America

Mexico

Brazil

Rest of Latin America

Core Chapters

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Detailed analysis of Solder Paste manufacturers competitive landscape, price, output and revenue market share, latest development plan, merger, and acquisition information, etc.

Chapter 3: Production/output, value of Solder Paste by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.

Chapter 4: Consumption of Solder Paste in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.

Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, revenue, price, gross margin, product introduction, recent development, etc.

Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.

Chapter 9: Analysis of sales channel, distributors and customers

Chapter 10: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 11: Production and supply forecast, global and regional

Chapter 12: Consumption and demand forecast, global and regional

Chapter 13: Forecast by Type and by Application. It provides a quantitative analysis of the market size and development potential of each market segment in the next six years.

Chapter 14: The main points and conclusions of the report.