Global Silver Sintering Die-Attach Materials Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2024-2030

Global Silver Sintering Die-Attach Materials Market Size, Manufacturers, Supply Chain, Sales Channel and Clients, 2024-2030

The global Silver Sintering Die-Attach Materials market is projected to reach US$ 252.76 million by 2030 from an estimated US$ 186.41 million in 2024, at a CAGR of 5.21% during 2024 and 2030.

China Silver Sintering Die-Attach Materials market size was US$ 27.49 million in 2023, while the US and Europe Silver Sintering Die-Attach Materials were US$ 45.95 million and US$ 47.93 million, severally. The proportion (Based on revenue) of the US was 25.74% in 2023, while China and Europe were 15.40% and 26.85% respectively, and it is predicted that China proportion will reach 19.25% in 2030, trailing a CAGR of 8.45% through the analysis period. Japan, South Korea, and Southeast Asia are noteworthy markets in Asia, with CAGR 5.96%, 5.16% and 2.81% respectively for the next 6-year period. As for the Europe Silver Sintering Die-Attach Materials landscape, Germany is projected to reach US$ 22.40 million by 2030 trailing a CAGR of 3.97% over the forecast period.

The global key companies of Silver Sintering Die-Attach Materials include Heraeus Electronics, Kyocera, Indium, Alpha Assembly Solutions, Henkel, Namics, Advanced Joining Technology, Shenzhen Facemoore Technology and Beijing Nanotop Electronic Technology, etc. In 2023, the global five largest players hold a share approximately 82.35% in terms of revenue.

In 2023, Pressure Sintering segment accounted for a share of 56.03% (Based on revenue) in the global Silver Sintering Die-Attach Materials market. And this product segment is poised to reach US$ 138.76 million by 2030 from US$ 100.02 million in 2023.

In Silver Sintering Die-Attach Materials market, the Power Semiconductor Device segment holds an important share in terms of application, and it is expected to reach a revenue of US$ 136.37 million by 2030, at a CAGR of 4.49% during 2024 and 2030.

Report Scope

This report aims to provide a comprehensive presentation of the global market for Silver Sintering Die-Attach Materials, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Silver Sintering Die-Attach Materials.

The Silver Sintering Die-Attach Materials market size, estimations, and forecasts are provided in terms of sales volume (Kg) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Silver Sintering Die-Attach Materials market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.

For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.

The report will help the Silver Sintering Die-Attach Materials manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and regions.

By Company

Heraeus Electronics

Kyocera

Indium

Alpha Assembly Solutions

Henkel

Namics

Advanced Joining Technology

Shenzhen Facemoore Technology

Beijing Nanotop Electronic Technology

TANAKA Precious Metals

Nihon Superior

Nihon Handa

NBE Tech

Sumitomo Bakelite

Celanese

Solderwell Advanced Materials

Guangzhou Xianyi Electronic Technology

ShareX (Zhejiang) New Material Technology

Bando Chemical Industries

Shenzhen Jufeng Solder

Segment by Type

Pressure Sintering

Pressure-less Sintering

Segment by Application

Power Semiconductor Device

RF Power Device

High Performance LED

Others

By Region

North America

United States

Canada

Asia-Pacific

China

Japan

South Korea

India

Southeast Asia

Australia

Rest of Asia-Pacific

Europe

Germany

France

U.K.

Italy

Russia

Rest of Europe

Latin America

Mexico

Brazil

Argentina

Rest of Latin America

Middle East & Africa

Middle East

Africa

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Sales (consumption), revenue of Silver Sintering Die-Attach Materials in global and regional level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 3: Detailed analysis of Silver Sintering Die-Attach Materials manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 4: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Silver Sintering Die-Attach Materials sales, revenue, price, gross margin, sales by region, by Type, by Application, and recent development, etc.

Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: North America by Type, by Application and by country, sales, and revenue for each segment.

Chapter 8: APAC by Type, by Application and by country, sales, and revenue for each segment.

Chapter 9: Europe by Type, by Application and by country, sales, and revenue for each segment.

Chapter 10: Latin America by Type, by Application and by country, sales, and revenue for each segment.

Chapter 11: Middle East and Africa by Type, by Application and by country, sales, and revenue for each segment.

Chapter 12: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.

Chapter 13: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.

Chapter 14: Research Findings and Conclusion.