Global Plant Engineering Market Insights, Forecast to 2030
The global Semiconductor 3D Metrology Equipment market is projected to grow from US$ 2,683.29 million in 2023 to US$ 3,591.36 million by 2030, at a Compound Annual Growth Rate (CAGR) of 4.62% during the forecast period.
The US & Canada market for Semiconductor 3D Metrology Equipment is estimated to increase from US$ 221.91 million in 2023 to reach US$ 311.37 million by 2030, at a CAGR of 5.34% during the forecast period of 2024 through 2030.
The China market for Semiconductor 3D Metrology Equipment is estimated to increase from US$ 839.46 million in 2023 to reach US$ 1,119.36 million by 2030, at a CAGR of 4.18% during the forecast period of 2024 through 2030.
The Europe market for Semiconductor 3D Metrology Equipment is estimated to increase from US$ 151.34 million in 2023 to reach US$ 204.71 million by 2030, at a CAGR of 5.02% during the forecast period of 2024 through 2030.
The global key manufacturers of Semiconductor 3D Metrology Equipment include KLA Corporation, Applied Materials, Hitachi High-Tech, Lasertec, ASML, Onto Innovation, ZEISS, Camtek, and Skyverse Technology, etc. In 2023, the global top five players had a share approximately 74.62% in terms of revenue.
In terms of production side, this report researches the Semiconductor 3D Metrology Equipment production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of Semiconductor 3D Metrology Equipment by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
This report presents an overview of global market for Semiconductor 3D Metrology Equipment, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Semiconductor 3D Metrology Equipment, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Semiconductor 3D Metrology Equipment, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Semiconductor 3D Metrology Equipment sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Semiconductor 3D Metrology Equipment market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Semiconductor 3D Metrology Equipment sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including KLA Corporation, Applied Materials, Hitachi High-Tech, Lasertec, ASML, Onto Innovation, ZEISS, Camtek, and Skyverse Technology, etc.
Market Segmentation
By Company
KLA Corporation
Applied Materials
Hitachi High-Tech
Lasertec
ASML
Onto Innovation
ZEISS
Camtek
Skyverse Technology
Nordson Corporation
Wuhan Jingce Electronic Group
Unity Semiconductor SAS
Bruker
Nearfield Instruments (NFI)
RSIC
Confovis
Segment by Type
Optical Metrology Equipment
Electron Beam Metrology Equipment
X-Ray Metrology Equipment
Others
Segment by Application
Wafer Inspection
Mask/Film Inspection
Production by Region
North America
Europe
China
Japan
Sales by Region
North America
United States
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
Europe
Germany
UK
France
Italy
Benelux
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Semiconductor 3D Metrology Equipment production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Semiconductor 3D Metrology Equipment in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of Semiconductor 3D Metrology Equipment manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Semiconductor 3D Metrology Equipment sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
"
"The global Semiconductor Manufacturing X-ray Measurement and Inspection Equipment market is projected to grow from US$ 402.18 million in 2024 to US$ 574.69 million by 2030, at a Compound Annual Growth Rate (CAGR) of 6.13% during the forecast period.
The US & Canada market for Semiconductor Manufacturing X-ray Measurement and Inspection Equipment is estimated to increase from US$ 36.64 million in 2024 to reach US$ 51.61 million by 2030, at a CAGR of 5.88% during the forecast period of 2024 through 2030.
The China market for Semiconductor Manufacturing X-ray Measurement and Inspection Equipment is estimated to increase from US$ 130.41 million in 2024 to reach US$ 182.13 million by 2030, at a CAGR of 5.73% during the forecast period of 2024 through 2030.
The Europe market for Semiconductor Manufacturing X-ray Measurement and Inspection Equipment is estimated to increase from US$ 23.69 million in 2024 to reach US$ 34.08 million by 2030, at a CAGR of 6.25% during the forecast period of 2024 through 2030.
The global key manufacturers of Semiconductor Manufacturing X-ray Measurement and Inspection Equipment include Nordson Corporation, Shenzhen Unicomp Technology, ZEISS, Nikon, Comet Yxlon, Saki Corporation, Omron, KLA Corporation, and Viscom, etc. In 2023, the global top five players had a share approximately 43.70% in terms of revenue.
In terms of production side, this report researches the Semiconductor Manufacturing X-ray Measurement and Inspection Equipment production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of Semiconductor Manufacturing X-ray Measurement and Inspection Equipment by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
This report presents an overview of global market for Semiconductor Manufacturing X-ray Measurement and Inspection Equipment, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Semiconductor Manufacturing X-ray Measurement and Inspection Equipment, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Semiconductor Manufacturing X-ray Measurement and Inspection Equipment, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Semiconductor Manufacturing X-ray Measurement and Inspection Equipment sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Semiconductor Manufacturing X-ray Measurement and Inspection Equipment market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Semiconductor Manufacturing X-ray Measurement and Inspection Equipment sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including Nordson Corporation, Shenzhen Unicomp Technology, ZEISS, Nikon, Comet Yxlon, Saki Corporation, Omron, KLA Corporation, and Viscom, etc.
Market Segmentation
By Company
Nordson Corporation
Shenzhen Unicomp Technology
ZEISS
Nikon
Comet Yxlon
Saki Corporation
Omron
KLA Corporation
Viscom
ViTrox Corporation
Bruker
Sxray Raysolution (Shenzhen)
Test Research, Inc
Techvalley
SEC
Shenzhen Zhuomao Technology
Guangdong Zhengye Technology
Segment by Type
2D X-ray
3D X-ray
Segment by Application
Wafer Inspection
Post Packaging Inspection
Chip Inspection
Production by Region
North America
Europe
China
Japan
South Korea
Sales by Region
North America
United States
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
Europe
Germany
U.K.
France
Italy
Benelux
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Semiconductor Manufacturing X-ray Measurement and Inspection Equipment production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Semiconductor Manufacturing X-ray Measurement and Inspection Equipment in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of Semiconductor Manufacturing X-ray Measurement and Inspection Equipment manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Semiconductor Manufacturing X-ray Measurement and Inspection Equipment sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.