Global HTCC Package Market Report, History and Forecast 2017-2028
Market Analysis and Insights: Global HTCC Market
HTCC means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic with a metal pattern such as tungsten or molybdenum which as a high melting point property. Generally, the fired temperature of HTCC substrate is 1500 to 1600 C. HTCC substrate provides the properties of high strength, good heat dissipation, and high reliability. HTCC technology is also used for a multi-layer packaging for the electronics industry, such as Communication package, consumer electronics, industrial laser, and military electronics, MEMS, microprocessor, and RF applications.
This report studies HTCC Package, covers the HTCC Ceramic Substrates, HTCC Ceramic Shell/Housings, and HTCC SMD Ceramic Packages.
Due to the COVID-19 pandemic and Russo-Ukrainian war, the global HTCC market size was valued at US$ 2,781 million in 2021 and is forecast to a readjusted size of US$ 4,541 million by 2028 with a CAGR of 6.86% during the forecast period 2022-2028.
Japan is the largest producer of HTCC in the world, its HTCC market size was valued at US$ 1956 million in 2021, while China is the second producer of HTCC, and the Chinese market size was valued at US$ 674 million. The proportion of the Japan was 70% in 2021, while China percentage was 22.2%, and it is predicted that China market share will reach 32.9% in 2028, trailing a CAGR of 11.29 % through the analysis period.
The global major manufacturers of HTCC include Kyocera, Maruwa, NGK Spark Plug, Hebei Sinopack Electronic Tech & CETC 13, and Chaozhou Three-Circle, etc. In terms of revenue, the global four largest players hold an 84% market share of HTCC in 2021.
In terms of HTCC products segment, HTCC Ceramic Shell/Housings and HTCC SMD Ceramic Packages hold a share 77.2% and 17.7% in 2021, respectively.
For HTCC Ceramic Shell/Housings, Kyocera, NGK/NTK, and Hebei Sinopack Electronic Tech & CETC 13 are the key producers, these three players occupied for about 86%, while for HTCC SMD Ceramic Packages, Kyocera and Chaozhou Three-Circle (Group) the world’s two largest players, both holds a share about 85 percent in 2021. For HTCC Ceramic Substrates, key players are Kyocera, Maruwa, NGK/NTK, NEO Tech, CETC 43 (Shengda Electronics), and Hebei Sinopack Electronic Tech.
Global HTCC Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2017 to 2028. This section mentions the volume of production by region from 2017 to 2028. Pricing analysis is included in the report according to each type from the year 2017 to 2028, manufacturer from 2017 to 2022, region from 2017 to 2022, and global price from 2017 to 2028.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global HTCC Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2017 to 2028. by Application segment also provides consumption during the forecast period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
By Company
Kyocera
Hebei Sinopack Electronic Tech & CETC 13
NGK/NTK
Chaozhou Three-Circle (Group)
Maruwa
Qingdao Kerry Electronics
Jiangsu Yixing Electronics
CETC 43 (Shengda Electronics)
CETC 55
Ametek
Hebei Dingci Electronic
AdTech Ceramics
Shenzhen Cijin Technology
Egide
NEO Tech
RF Materials (METALLIFE)
Electronic Products, Inc. (EPI)
Fujian Minhang Electronics
Shanghai Xintao Weixing Materials
SoarTech
Beijing BDStar Navigation (Glead)
Shenzhen Zhongao New Porcelain Technology
Hefei Euphony Electronic Package
Fujian Nanping Sanjin Electronics
Segment by Type
HTCC Ceramic Shell / Housings
HTCC Ceramic PKG
HTCC Ceramic Substrates
Segment by Application
Consumer Electronics
Communication Package
Industrial
Automotive Electronics
Aerospace and Military
Others
Production by Region
North America
Europe
Japan
China
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Netherlands
Rest of Europe
South America
Mexico
Brazil
Rest of South America
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