Global Epoxy Molding Compounds (EMC) for Semiconductor Market Report, History and Forecast 2018-2029
The global market for Epoxy Molding Compounds (EMC) for Semiconductor was estimated at US$ 2248.89 million in the year 2022, is projected to reach a revised size of US$ 3170.26 million by 2029, growing at a CAGR of 4.73 % during the forecast period 2023-2029.
North American market for Epoxy Molding Compounds (EMC) for Semiconductor was valued at $ 161.16 million in 2022 and will reach $ 206.16 million by 2029, at a CAGR of 3.25% during the forecast period of 2023 through 2029.
Asia-Pacific market for Epoxy Molding Compounds (EMC) for Semiconductor was valued at $ 1,925.09 million in 2022 and will reach $ 2,767.50 million by 2029, at a CAGR of 5.02% during the forecast period of 2023 through 2029.
Europe market for Epoxy Molding Compounds (EMC) for Semiconductor was valued at $ 137.06 million in 2022 and will reach $ 164.49 million by 2029, at a CAGR of 2.30% during the forecast period of 2023 through 2029.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Epoxy Molding Compounds (EMC) for Semiconductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Epoxy Molding Compounds (EMC) for Semiconductor.
The Epoxy Molding Compounds (EMC) for Semiconductor market size, estimations, and forecasts are provided in terms of sales volume (K MT) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Epoxy Molding Compounds (EMC) for Semiconductor market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
This report will help the readers to understand the competition within the industries and strategies for the competitive environment to enhance the potential profit. The report also focuses on the competitive landscape of the global Epoxy Molding Compounds (EMC) for Semiconductor market, and introduces in detail the market share, industry ranking, competitor ecosystem, market performance, new product development, operation situation, expansion, and acquisition. etc. of the main players, which helps the readers to identify the main competitors and deeply understand the competition pattern of the market.
Market Segmentation
This report covers the Epoxy Molding Compounds (EMC) for Semiconductor segments by manufacturers, by Type, by Application, by region and country, and provides market size (value, volume and average price) and CAGR for the history and forecast period (2018-2022, 2023-2029), considering 2022 as the base year. It elucidates potential revenue opportunities across different segments and explains attractive investment proposition matrices for this market.
By Company
Sumitomo Bakelite
Showa Denko
Chang Chun Group
Hysol Huawei Electronics
Panasonic
Kyocera
KCC
Samsung SDI
Eternal Materials
Jiangsu Zhongpeng New Material
Shin-Etsu Chemical
Nagase ChemteX Corporation
HHCK
Scienchem
Beijing Sino-tech Electronic Material
Hysolem
Segment by Type
Solid EMC
Liquid EMC
Segment by Application
Memory
Non-memory
Discrete
Power Module
By Region
North America
U.S.
Canada
Mexico
Asia-Pacific
China
Japan
Korea
India
Southeast Asia
Europe
Germany
France
UK
Belgium
Netherlands
South America
Brazil
Middle East & Africa