Global Electronic Fusing IC Market Insights, Forecast to 2030

Global Electronic Fusing IC Market Insights, Forecast to 2030

The global Electronic Fusing IC market is projected to grow from US$ 198.01 million in 2024 to US$ 401.92 million by 2030, at a Compound Annual Growth Rate (CAGR) of 12.52% during the forecast period.

The US & Canada market for Electronic Fusing IC is estimated to increase from $ 62.15 million in 2024 to reach $ 123.56 million by 2030, at a CAGR of 12.13% during the forecast period of 2025 through 2030.

The China market for Electronic Fusing IC is estimated to increase from $ 40.47 million in 2024 to reach $ 89.79 million by 2030, at a CAGR of 14.20% during the forecast period of 2025 through 2030.

The Europe market for Electronic Fusing IC is estimated to increase from $ 49.74 million in 2024 to reach $ 94.50 million by 2030, at a CAGR of 11.29% during the forecast period of 2025 through 2030.

The global key manufacturers of Electronic Fusing IC include Texas Instruments, onsemi, Toshiba, STMicroelectronics, Littelfuse, Alpha and Omega Semiconductor, Wuxi ETEK Micro-Electronics, Elmos Semiconductor SE, and etc. In 2023, the global top five players had a share approximately 82.73% in terms of revenue.

In terms of production side, this report researches the Electronic Fusing IC production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.

In terms of consumption side, this report focuses on the sales of Electronic Fusing IC by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.

This report presents an overview of global market for Electronic Fusing IC, capacity, output, revenue and price. It analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.

This report researches the key producers of Electronic Fusing IC, also provides the consumption of main regions and countries. It highlights of the upcoming market potential for Electronic Fusing IC, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.

This report focuses on the Electronic Fusing IC sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Electronic Fusing IC market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.

This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Electronic Fusing IC sales, projected growth trends, production technology, application and end-user industry.

Descriptive company profiles of the major global players, including Texas Instruments, onsemi, Toshiba, STMicroelectronics, Littelfuse, Alpha and Omega Semiconductor, Wuxi ETEK Micro-Electronics, Elmos Semiconductor SE.

Market Segmentation

By Company

Texas Instruments

onsemi

Toshiba

STMicroelectronics

Littelfuse

Alpha and Omega Semiconductor

Wuxi ETEK Micro-Electronics

Elmos Semiconductor SE

Segment by Type

With Internal FET

With External FET

Segment by Application

Consumer Electronics

Enterprise and Communication

Automotive

Others

Production by Region

North America

Europe

China

Japan

Sales by Region

US & Canada

U.S.

Canada

China

Asia (excluding China)

Japan

South Korea

China Taiwan

Southeast Asia

India

Australia

Europe

Germany

France

U.K.

Italy

Russia

Middle East, Africa, Latin America

Brazil

Mexico

Turkey

Israel

GCC Countries

Chapter Outline

Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.

Chapter 2: Electronic Fusing IC production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.

Chapter 3: Sales (consumption), revenue of Electronic Fusing IC in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.

Chapter 4: Detailed analysis of Electronic Fusing IC manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.

Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.

Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.

Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.

Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.

Chapter 9: China by Type, and by Application, sales, and revenue for each segment.

Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.

Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.

Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Electronic Fusing IC sales, revenue, price, and gross margin, etc.

Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.

Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges faced by manufacturers in the industry.

Chapter 15: The main points and conclusions of the report.