The electrodeposited copper foil market is a critical segment within the global electronics and energy storage industries. Electrodeposited copper foil is widely used in printed circuit boards (PCBs), flexible printed circuit boards (FPCBs), and lithium-ion batteries due to its excellent electrical conductivity, thermal stability, and mechanical strength. The market is expected to witness significant growth from 2025 to 2030, driven by the increasing demand for consumer electronics, electric vehicles (EVs), and renewable energy storage solutions.
The global electrodeposited copper foil market was valued at approximately $6.8 billion in 2025 and is projected to grow at a compound annual growth rate (CAGR) of 8.5%-10% from 2025 to 2030, reaching a market size of $10.2 billion-$11.5 billion by 2030. This growth is primarily attributed to the rising adoption of electric vehicles, which require high-performance lithium-ion batteries, and the expansion of 5G infrastructure, which drives demand for advanced PCBs.
The market is segmented into standard electrodeposited copper foil and high-performance electrodeposited copper foil. High-performance copper foil, which offers superior conductivity and durability, is expected to grow at a faster rate, with a projected CAGR of 9.5%-11% during the forecast period. This segment currently holds a market share of 45%-50%.
The market is highly competitive, with key players including Mitsui Mining & Smelting, Furukawa Electric, Fukuda, Nippon Denkai, JX Nippon Mining & Metals, KCF Technologies (KCFT)/SKC, Solus Advanced Materials, ILJIN Materials, Nan Ya Plastic, LCY Technology, Co-Tech, Chang Chun Group, Wason Copper Foil/SKC, Kingboard Copper Foil, Chaohua Tech, NUODE, Guangdong Jia Yuan Technology, Ganzhou Yihao, Tongling Nonferrous Metals, Shandong Jinbao, Jiangxi Copper, and Hubei Zhongyi. Mitsui Mining & Smelting and Furukawa Electric collectively account for 20%-25% of the global market share.
The electrodeposited copper foil manufacturing process includes surface treatment, rolling, and electroplating. Surface-treated copper foil, which enhances adhesion and performance, is expected to dominate the market with a share of 60%-65% by 2030.
The market is segmented by application into FPCB, PCB, lithium batteries, and others. The lithium battery segment is anticipated to grow at the highest CAGR of 10%-12%, driven by the increasing demand for EVs and energy storage systems. The PCB segment currently holds the largest market share at 40%-45%.
Key end-use industries include consumer electronics, automotive, industrial, and energy storage. The automotive sector is expected to witness the fastest growth, with a CAGR of 11%-13%, due to the rapid adoption of electric vehicles.
Asia-Pacific dominates the market, accounting for 65%-70% of global demand in 2025, driven by the presence of major electronics manufacturers and battery producers in countries like China, Japan, and South Korea. North America and Europe are also expected to grow significantly, with CAGRs of 7%-9% and 6%-8%, respectively, due to increasing investments in EV infrastructure and renewable energy projects.
Recent developments in the electrodeposited copper foil market include:
The following segment forecasts highlight the expected growth trends in the electrodeposited copper foil market:
The electrodeposited copper foil market is poised for robust growth from 2025 to 2030, driven by the increasing demand for high-performance materials in electronics, electric vehicles, and renewable energy storage. Key players are focusing on capacity expansions and technological innovations to capitalize on emerging opportunities. With supportive government policies and rising investments in EV infrastructure, the market is expected to reach $10.2 billion-$11.5 billion by 2030, offering significant growth prospects for stakeholders across the value chain.
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