“M2M/IoT Development - Sub-1GHz Communications” Technologies, Markets, Applications

Best Price Guarantee	Length	Publisher	Published Date	SKU
from $2,850	201 Pages	Practel, Inc.	October, 2022	PT17419401

Best Price Guarantee
Price	from $2,850
Length	201 Pages
Publisher	Practel, Inc.
Published Date	October, 2022
SKU	PT17419401

“M2M/IoT Development - Sub-1GHz Communications” Technologies, Markets, Applications

The rapid development of Internet-of-Things (IoT) and Machine-to-Machine (M2M) communications requires plenty of the frequency spectra.

This report addresses features and properties of Sub-1GHz communication, and its applications for IoT/M2M. The Sub-1GHz unlicensed industrial, scientific, and medical (ISM) bands of 315, 433, 800 and 902 to 928 MHz represent a great solution for some uses. Based on pure physics, these lower frequencies naturally deliver more distance than higher frequencies for a given power level, receiver sensitivity, and antenna gain.

The following Sub-1GHz technologies, related markets, standards and applications have been addressed to show their value in the IoT/M2M development:

Short range communications

ZigBee/802.15.4
Z-Wave
EnOcean.

Long range communications

IEEE 802.15.4g
IEEE 802.11af
IEEE 802.11ah
IEEE 802.22
Weightless
UNB (Ultra-narrow Band)
Other.

The major attractions of these Sub-1GHz technologies for IoT/M2M communications include:

Extended range – they allow 5-10 times longer reaches over 2.4 GHz band transmissions. This is the result of smaller losses when signal is traveling through various obstacles; besides, Sub-1GHz ISM bands are less crowded
Low power consumption
Support of multiple applications.

The industry and consumers show great interest in the utilization of Sub-1GHz ISM bands for IoT/M2M communications; there are great opportunities that have not been realized until recently.

The report also surveys related to this report industries and patents.

The report is written for a wide audience of technical and managerial staff involved in the development of the IoT/M2M market.

1.0 Introduction: 1.1 General; 1.2 Specifics; 1.3 Scope; 1.4 Research Methodology; 1.5 Target Audience
2.0 Efforts: Development of M2M Communications and IoT: 2.1 M2M Communications Development; 2.1.1 Special Needs; 2.1.1.1 Spectrum; 2.1.1.2 Summary; 2.1.2 Standardization – Industry Activities; 2.1.2.1 IEEE; 2.1.2.2 ETSI; 2.1.2.3 ITU; 2.1.2.4 oneM2M Alliance; 2.1.2.4.1 Service Layer Architecture; 2.1.2.4.2 Benefits; 2.1.2.5 M2M Alliance; 2.1.2.6 Open Mobile Alliance (OMA); 2.1.2.7 Summary; 2.1.3 Market; 2.1.3.1 Statistics; 2.1.3.2 Estimate; 2.1.4 Industry: Innovations; Arqiva/Sensus; Iota Networks; Kore Telematics; SigFox/Telit; Telensa/Plextek; 2.2 IoT; 2.2.1 M2M and IoT; 2.2.1.1 M2M; 2.2.1.2 IoT; 2.2.1.3 IoT – M2M; 2.2.2 Open Interconnect Consortium; 2.2.3 Industrial Internet Consortium; 2.2.4 IoT Platforms; 2.2.5 IoT and ITU; 2.2.6 IoT International Forum; 2.2.7 IEEE 2413 and IoT; 2.2.7.1 2413.1; 2.2.7.2 P2413.2; 2.2.8 ISO/IEC; 2.2.8.1 Layered Structure; 2.2.9 IoT – Market; 2.2.10 Applications
3.0 Specifics of Sub-1GHz Transmission: 3.1 ITU Designation; 3.2 Sub-1GHz Transmission Benefits and Limitations; 3.3 Generations; 3.3.1 Details
4.0 Sub-1GHz Transmission: Support for Long-reach IoT/M2M Communications: 4.1 IEEE-802.15.4g-Smart Utility Network; 4.1.1 General; 4.1.2 Need; 4.1.3 Value; 4.1.4 Overview - PHY; 4.1.5 Regions; 4.1.5.1 Frequencies Allocations; 4.1.6 Details; 4.1.6.1 Requirements: Major Characteristics; 4.1.6.2 Considerations; 4.1.6.3 Network Specifics; 4.1.6.4 PHY/MAC Modifications; 4.1.7 Market; 4.1.8 Summary; 4.1.9 Wi-SUN; 4.1.10 Manufacturers – Examples; Analog Devices; Elster (a part of Honeywell); Microchip; TI; 4.2 IEEE 802.22-19; 4.2.1 General; 4.2.2 Status – IEEE 802.22-19; 4.2.3 Developments; 4.2.4 IEEE 802.22-2019 Overview; 4.2.4.1 Major Characteristics; 4.2.5 IEEE 802.22 Details; 4.2.5.1 Physical Layer – Major Characteristics; 4.2.5.2 MAC Layer; 4.2.6 Cognitive Functions; 4.2.7 IEEE 802.22 – Marketing Considerations for SG; 4.2.8 Major Applications; 4.2.9 Usage Models; 4.2.10 Benefits; 4.2.11 Summary; 4.2.12 Group; 4.2.12.1 IEEE 802.22.1; 4.2.12.2 IEEE 802.22.2; 4.2.12.3 IEEE 802.22a-2014; 4.2.12.4 IEEE 802.22b-2015; 4.2.12.5 IEEE P802.22.3 - Standard for Spectrum Characterization and Occupancy Sensing; 4.2.12.6 8802-22:2015/Amd 1-2017; 4.3 IEEE 802.11ah (Wi-Fi HaLow); 4.3.1 General; 4.3.2 Goal and Schedule; 4.3.3 Attributes; 4.3.4 Use Cases; 4.3.5 PHY; 4.3.5.1 Bandwidth; 4.3.5.2 Channelization; 4.3.5.3 Transmission Modes and MIMO; 4.3.6 MAC Layer; 4.3.7 Summary; 4.3.8 Vendors; Methods2Business; Morse Micro; Newracom-Aviacomm; Palma Ceia SemiDesign; Silex; 4.4 IEEE 802.11af – White-Fi; 4.4.1 General: Expectations – White-Fi; 4.4.2 Differences; 4.4.3 Benefits; 4.4.4 Specifics; 4.4.4.1 Interference; 4.4.4.2 Main Principles; 4.4.5 PHY; 4.4.6 Architecture; 4.4.7 Market; 4.4.8 Vendors; Aviacomm; Carlson Wireless; 4.5 Ultra Narrow Band (UNB); 4.5.1 Origin; 4.5.2 Support; 4.5.3 Major Features; 4.5.4 SigFox; 4.5.4.1 Company; 4.5.4.2 Technology - Details; 4.5.4.3 Uplink; 4.5.4.4 Downlink; 4.5.4.5 SmartLNB; 4.5.4.6 Coverage; 4.5.4.7 Use Cases; 4.5.4.8 Industry; Adeunis RF; Innocomm; Microchip; On Semiconductor; Telit; TI; 4.6 Weightless Communications; 4.6.1 SIG; 4.6.2 Weightless-N; 4.6.2.1 General; 4.6.2.2 Open Standard; 4.6.2.3 Nwave; 4.6.2.4 Summary; 4.6.3 Weightless-P; 4.6.3.1 General; 4.6.3.2 Details; 4.6.3.3 Vendors; 4.6.4 Weightless Technologies and Competition
5.0 Sub-1GHz Transmission: Support of Short-reach IoT/M2M Communications: 5.1 ZigBee – IEEE 802.15.4; 5.1.1 General; 5.1.2 Sub-1GHz ZigBee: Specifics; 5.1.3 ZigBee Acceptance; 5.1.4 Major Features: ZigBee/802.15.4; 5.1.5 Device Types; 5.1.6 Protocol Stack; 5.1.6.1 Physical and MAC Layers – IEEE802.15.4; 5.1.6.2 Upper Layers; 5.1.7 Security; 5.1.8 Power Consumption; 5.1.9 ZigBee Technology Benefits and Limitations; 5.1.10 Standardization Process; 5.1.10.1 Ratifications; 5.1.10.2 Alliance; 5.1.10.2.1 ZigBee Pro 2017; 5.1.11 Applications Specifics – Application Profiles; 5.1.11.1 “Green” ZigBee; 5.1.11.2 ZigBee Telecom Services; 5.1.11.3 Building Automation; 5.1.11.4 Smart Energy Profile; 5.1.11.4.1 Features; 5.1.11.4.2 Smart Energy Profile V.2.0; 5.1.11.4.3 ZigBee IP; 5.1.11.5 ZigBee Network Devices - IP Gateway; 5.1.12 Market; 5.1.12.1 Expectations-Technology Stack; 5.1.12.2 Segments; 5.1.12.3 Forecast; 5.1.13 Sub-1GHz ZigBee: Certification; 5.1.14 Industry; Adaptive Networks Solutions (RF Sub-1GHz); Microchip Technologies (Modules, Sub-1GHz); NXP; Renesas (Platforms, AMR, Sub-1GHz); Silicon Laboratories (Chipsets, Modules, Sub-1GHz); TI (Chipsets, Sub-1GHz); 5.2 EnOcean: General; 5.2.1 The Company; 5.2.2 EnOcean Alliance; 5.2.3 Standard; 5.2.3.1 Features; 5.2.3.2 Drivers; 5.2.4 Technology Details; 5.2.4.1 Framework; 5.2.4.2 Generations; 5.2.5 Profiles; 5.2.6 Benefits; 5.2.7 Market Estimate; 5.2.8 Industry; BSC Magnum; Beckhoff; Echoflex; Illumra; Leviton; Thermokon; 5.3 Z-Wave; 5.3.1 General; 5.3.2 Z-Wave Alliance; 5.3.3 Benefits; 5.3.4 Details; 5.3.4.1 General; 5.3.4.2 Characteristics; 5.3.4.3 ITU G.9959; 5.3.5 Advanced Energy Control Framework; 5.3.6 Z-Wave and Smart Metering; 5.3.7 Selected Vendors; Aeon Labs-Aeotec; NorthQ; Vera Control; 5.3.8 Market Estimate; 5.3.8.1 Model; 5.3.8.2 Results
6.0 Conclusions: Appendix I: IEEE 802.15.4g Characteristics; Appendix II: 802.11ah – related Patents Survey (2018-2022); Appendix III: Z-Wave – related Patents Survey (2018-2022); Appendix IV: 802.22 – related Patents Survey (2018-2022); Appendix V: EnOcean – related Patents Survey (2018-2022); Appendix VI: 802.11af – related Patents Survey (2018-2022); Figure 1: Regions: Sub-1GHz Band; Figure 2: IoT Environment; Figure 3: Key M2M Elements; Figure 4: ETSI Activity; Figure 5: Use Cases; Figure 6: ETSI-High-level M2M Architecture; Figure 7: oneM2M Layered Model; Figure 8: Service Layer Positioning; Figure 9: Summary – M2M Standardization; Figure 10: M2M Major Applications; Figure 11: Estimate: M2M Traffic Growth (PB/Month); Figure 12: Estimate-M2M Service Market – Global ($B); Figure 13: Estimate: Cellular Operators Revenue - M2M Services - Global ($B); Figure 15: IoT – Layered Structure; Figure 16: Estimate: IoT Technologies and Applications Market - Global ($T); Figure 17: Estimate – Total Number of Smart Devices in Smart Homes – Global (Bil. Units); Figure 18: M2M/IoT Spectrum of Applications; Figure 19: Bands – ITU Designation; Figure 20: Range; Figure 21: Power Consumption; Figure 22: Rates; Figure 23: Global Sub-1GHz Frequencies; Figure 24: Sub-1GHz Transmission Characteristics; Figure 25: ZigBee-2.4 GHz vs. 900 MHz; Figure 26: Properties Comparison; Figure 27: SUN Connectivity; Figure 28: 802.15.4g Radio Operating Bands; Figure 29: Estimate: Global Market – Smart Grid SUN ($B); Figure 30: Estimate: 802.22 Technology– U.S. Market Size ($B); Figure 31: IEEE 802.22 Usage Scenarios; Figure 32: Major Characteristics: IEEE 802.22; Figure 33: Standardized Frequency Spectrum (sub-1 GHz); Figure 34: 802.11ah – Channelization Plan in U.S.; Figure 35: 802.11ah Features Summary; Figure 36: 802.11af Network Setup; Figure 37: Comparison; Figure 38: Uplink Frame Format; Figure 39: Downlink Frame Format; Figure 40: ZigBee Characteristics; Figure 41: ZigBee/802.15.4 Protocol Stack; Figure 42: ZigBee/802.15.4 Characteristics; Figure 43: Profiles; Figure 44: ZigBee IP Gateway Protocol Stack; Figure 45: Technology Stack; Figure 46: Estimate – U.S. Market Size – ZigBee Chips Shipped ($B); Figure 47: Estimate – U.S. Market Size – ZigBee Chips – Sub-1GHz Shipped ($B); Figure 48: ZigBee Market Segmentation (2022); Figure 49: ZigBee Market Segmentation (2026); Figure 50: Functionalities; Figure 51: Major Features; Figure 52: Energy Consumption Requirements; Figure 53: Estimate: EnOcean Equipment Sales – Global ($B); Figure 54: Estimate: EnOcean Industry Modules Sales - Global (Mil. Units); Figure 55: Estimate: U.S. Small SH Z-Wave IC Market Size ($B); Figure 56: Estimate: U.S. Large SH Z-Wave IC Market ($B)