Thin Wafer Market Share, Size, Trends, Industry Analysis Report, By Wafer Size (125mm, 200mm, 300mm); By Process; By Technology (Grinding, Polishing, Dicing); By Application; By Region; Segment Forecast, 2022 - 2030

Thin Wafer Market Share, Size, Trends, Industry Analysis Report, By Wafer Size (125mm, 200mm, 300mm); By Process; By Technology (Grinding, Polishing, Dicing); By Application; By Region; Segment Forecast, 2022 - 2030

The global thin wafer market size is expected to reach USD 29 billion by 2030, according to a new study by Polaris Market Research. The report “Thin Wafer Market Share, Size, Trends, Industry Analysis Report, By Wafer Size (125mm, 200mm, 300mm); By Process; By Technology (Grinding, Polishing, Dicing); By Application; By Region; Segment Forecast, 2022 – 2030” gives a detailed insight into current market dynamics and provides an analysis of future market growth.

Due to their mechanical strength, flexibility, and ability to withstand stress, the growing demand for thin wafer products in the electronics, automotive, and healthcare sectors is expected to drive industry growth. Furthermore, increasing penetration of the product in expanding memory discs, consumer electronics, and wireless gadgets are contributing factors to spur the market growth.

Furtherly, the majority of manufacturer shifted toward thinner wafer as it is less expensive and requires less production time. The less time-consuming nature also reduces electricity consumption which is economical for both manufacturer and end users. Additionally, due to their inexpensiveness, producers tend to improve ultra-thin wafers to produce solar panels, bolstering market growth.

The growing adoption of micro-electro-mechanical systems (MEMS) in portable and power devices is increasing the sales of thin wafers. In addition, the demand for better manufacturing techniques for producing ultra-thin wafers for power and portable devices contributes to market growth. Furthermore, the need for radio frequency identification (RFID) devices for developing dicing equipment used in many end-use applications also supports market growth.

The COVID-19 pandemic negatively impacted the industry, as many electronic manufacturing units were temporarily shut down due to the global lockdown. The lack of skilled labor accounted for the delay in producing many consumers’ electronic items and portable devices, severely hampered the market.

Thin Wafer Market Report Highlights

The growing demand for the 300 mm size segment is due to its larger die per wafer and the cost-benefit associated with it. In addition, it offers high economies of scale and profitability to the manufacturer as it produces a lot in one batch, which increases its sales.

The temporary bonding and debonding segment accounted for the highest revenue share and is expected to continue its dominance owing to cost-efficiency, minimal wafer stress, and high operational throughput. The process is helpful in packaging next-generation devices and silicon’s backside processing, which supports market growth.

Asia Pacific is expected to grow dominantly over the forecast period due to increasing deployment in the semiconductor industry, rising consumer electronics gadgets, and availability of low-cost labor and cheap raw material across China, India, and Japan.

Major players operating in the industry include 3M, Applied Materials, Aecom Technology Co. Ltd, Brewer Science, Cree, Disco Corporation, EV Group, Globalwafers Co. Ltd, Infineon Technologies, LDK Solar, Mechatronic System Technik, Okmetic, PV Crystalox Solar PLC, Shanghai Simgui Technology Co. Ltd, Shin-Etsu Chemical Co. Ltd, Silicon Valley Microelectronics, and Siltronic AG.

Polaris Market Research has segmented the thin wafer market report based on wafer size, process, technology, application, and region:

Thin Wafer, Wafer Size Outlook (Revenue – USD Billion, 2018 – 2030)

125 mm

200 mm

300 mm

Thin Wafer, Process Outlook (Revenue – USD Billion, 2018 – 2030)

Temporary Bonding & Debonding

Carrier-Less/ Taiko Process

Thin Wafer, Technology Outlook (Revenue – USD Billion, 2018 – 2030)

Grinding

Polishing

Dicing

Thin Wafer, Application Outlook (Revenue – USD Billion, 2018 – 2030)

MEMS

CIS

Memory

RF Devices

LED

Interposer

Logic

Others

Thin Wafer, Regional Outlook (Revenue – USD Billion, 2018 – 2030)

North America

U.S

Canada

Europe

Germany

UK

France

Italy

Spain

Russia

Netherlands

Asia Pacific

China

India

Japan

South Korea

Indonesia

Malaysia

Latin America

Argentina

Brazil

Mexico

Middle East & Africa

UAE

Saudi Arabia

Israel

South Africa