SiC Wafer Polishing Market Share, Size, Trends, Industry Analysis Report, By Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions); By Application; By Process; By Region; Segment Forecast, 2023- 2032

SiC Wafer Polishing Market Share, Size, Trends, Industry Analysis Report, By Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions); By Application; By Process; By Region; Segment Forecast, 2023- 2032

The global sic wafer polishing market size is expected to reach USD 8.93 billion by 2032, according to a new study by Polaris Market Research. The report “SiC Wafer Polishing Market Share, Size, Trends, Industry Analysis Report, By Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions); By Application; By Process; By Region; Segment Forecast, 2023 - 2032” gives a detailed insight into current market dynamics and provides analysis on future market growth.

The increasing research activities in wafer polishing are driving new innovations in the marketplace. In the field of integrated circuits (ICs), single-crystal silicon wafers are frequently used. However, a significant number of abrasives are required during the polishing of single crystal silicon in order to achieve excellent surface quality and an effective material removal rate (MRR). This raises the processing cost and has an adverse environmental impact.

A study published in Science Direct in 2022 focused on the creation of a low-cost slurry polishing technique without abrasives for silicon wafers. This study showed that the polishing pad constructed with colloidal silica can improve the processing efficiency, stability, and quality of single-crystal silicon wafers in abrasive-free slurries including potassium carbonate, potassium hydroxide, or potassium silicate. This ongoing research activity will further reveal the new potential of SiC wafers in the coming years.

The evolution of technology is widening the scope of the wafer polishing process. With a larger wafer and a smaller integrated circuit feature size, it is difficult to increase the material removal rate (MRR) during the chemical mechanical polishing (CMP) of the silicon wafers. A study published in Science Direct focused on generating a slurry that effectively improved the MRR of these wafers during the CMP by using monodisperse alkaline colloidal silica, organic & in-organic & salts. This will further create new growth potential for market-driven innovations in the polishing process.

Electronic devices like power diodes, MOSFETs, microwave devices, & RF transistors use silicon carbide wafers to provide effective energy conversion & power management. SiC wafers are also used in aerospace systems, upcoming energy technologies, & automotive electronics. driving demand for wafer polishing in the next few years.

SiC Wafer Polishing Market Report Highlights

Diamond slurries segment is anticipated to witness the highest growth in the coming years due to its prevalence in jewelry manufacturing.

Power Electronics segment accounted for the largest market share owing to its ability to save power and high temperature capabilities.

Chemical-mechanical polishing segment held the largest share due to the rising demand for larger-diameter wafers.

Europe will grow rapidly, owing to the surge in demand for electric vehicles.

The global players include 3M, DuPont Incorporated, Engis Corporation, JSR Corporation, Kemet, Saint-Gobain & SKC.

Polaris Market Research has segmented the SiC wafer polishing market report based on product type, application, process, and region:

SiC Wafer Polishing, Product Type Outlook (Revenue - USD Billion, 2019 - 2032)

Abrasive powders

Polishing pads

Diamond slurries

Colloidal silica suspension

Others

SiC Wafer Polishing, Application Outlook (Revenue - USD Billion, 2019 - 2032)

Power Electronics

Light-emitting diodes (LEDs)

Sensors and detectors

Rf and microwave devices

Others

SiC Wafer Polishing, Process Outlook (Revenue - USD Billion, 2019 - 2032)

Mechanical polishing

Chemical-mechanical polishing (CMP)

Electropolishing

Chemical polishing

Plasma-assisted polishing

Others

SiC Wafer Polishing, Regional Outlook (Revenue - USD Billion, 2019 - 2032)

North America

U.S.

Canada

Europe

Germany

UK

France

Italy

Spain

Russia

Netherlands

Asia Pacific

China

India

Japan

South Korea

Indonesia

Malaysia

Latin America

Argentina

Brazil

Mexico

Middle East & Africa

UAE

Saudi Arabia

Israel

South Africa