Radiation Hardened Electronics Market Share, Size, Trends, Industry Analysis Report, By Product Type (Custom Made, Commercial-off-the-Shelf (COTS)); By Component; By Manufacturing Technique; By Application; By Region; Segment Forecast, 2024- 2032
The global Radiation Hardened Electronics market size is expected to reach USD 2.61 billion by 2032, according to a new study by Polaris Market Research. The report “Radiation Hardened Electronics Market Share, Size, Trends, Industry Analysis Report, By Product Type (Custom Made, Commercial-off-the-Shelf (COTS)); By Component; By Manufacturing Technique; By Application; By Region; Segment Forecast, 2024- 2032” gives a detailed insight into current market dynamics and provides analysis on future market growth.
The radiation-hardened electronics market refers to the industry segment that focuses on the development, manufacturing, and sale of electronic components and systems designed to withstand exposure to ionizing radiation. Ionizing radiation, which includes sources like cosmic rays, nuclear radiation, and high-altitude electromagnetic pulses, can pose a threat to electronic devices, leading to malfunctions or failures.
Electronic systems may be exposed to high levels of radiation in certain critical applications, such as aerospace, defense, space exploration, and nuclear power. To ensure the reliable operation of electronic components in these environments, radiation-hardened electronics are specifically engineered and tested to withstand the damaging effects of radiation.
Rad-hard electronics integration almost became a necessity for nuclear sensing and instrumentation as it provided an avenue to design more sophisticated nuclear systems at the detection level. Installation of sophisticated sensors in the reactor's crypt cell could lead to better control and improved monitoring of several parameters with more accurate data to ensure that we are getting the most efficient and safe process possible.
In the case of nuclear facilities, a significant amount of information is processed through electronic infrastructure, which entails the need for devices able to withstand high doses of radioactive radiation. Uncanny radiation-resistant electronics have to be employed strictly during the monitoring and transmission of data in such harsh environments, thus effectively guaranteeing dependable functioning. Not only do they provide a sophisticated tool for inspecting nuclear power plants, but also their use can significantly enhance the ability to conduct extensive surveying in scenarios when communication hardware may be inoperable during emergency episodes or in zones with an unprecedentedly high degree of radioactivity.
The primary threat to power lines, power plants, and standard electronic equipment often stems from electromagnetic and thermal radiation, leading to potential malfunctions. In response to these challenges, an increasing number of space agencies and private enterprises are directing investments toward radiation-hardened electronics. The projected growth of this market is fueled by the crucial demand for components that can reliably operate under stringent requirements. Anticipated new building programs for nuclear-propelled submarines are poised to be approved and initiated in the near future, introducing additional prospects and expanding opportunities within the radiation-hardened electronics market.
Radiation Hardened Electronics Market Report Highlights
- In 2023, the aerospace and defense segment accounted for the largest market share due to their frequent engagement in mission-critical operations where electronic system failure is not an option. Reliability and resilience are paramount in applications such as satellites, military aircraft, and missile systems, driving the demand for radiation-hardened electronics.
- The Radiation Hardened By Process (RHBP) technique is expected to witness the highest CAGR during the forecast period; it utilizes the integrated circuit (IC) fabrication process, incorporating specific modifications to fortify the resilience of electronic components. To overcome the challenges presented by radiation, RHBP primarily involves modifying the transistor bodies to reduce their susceptibility to the deteriorating effects of radiation exposure.
- In 2023, the North American region dominated the largest market share, primarily due to the substantial presence of major market players and space agencies within the region's countries. Furthermore, the market's growth is fueled by a focus on space and nuclear programs and government investments in radiation-hardened electronics for space missions.
- The global key market players include AMD, BAE Systems, Honeywell International Inc., Microchip Technology Inc., Renesas Electronics Corporation, STMicroelectronics, Teledyne Technologies Inc., TTM Technologies, Inc, and more.
Polaris Market Research has segmented the radiation hardened electronics market report based on product type, component, manufacturing technique, application, and region:
Radiation Hardened Electronics, Product Type Outlook (Revenue - USD Billion, 2019 - 2032)
- Custom Made
- Commercial-off-the-Shelf (COTS)
Radiation Hardened Electronics, Component Outlook (Revenue - USD Billion, 2019 - 2032)
- Memory
- Processors & Controllers
- Mixed Signal ICs
- Power Management
Radiation Hardened Electronics, Manufacturing Technique Outlook (Revenue - USD Billion, 2019 - 2032)
- Radiation-Hardening by Process (RHBP)
- Radiation-Hardening by Design (RHBD)
Radiation Hardened Electronics, Application Outlook (Revenue - USD Billion, 2019 - 2032)
- Medical
- Aerospace & Defense
- Space
- Nuclear Power Plant
- Others
Radiation Hardened Electronics, Regional Outlook (Revenue - USD Billion, 2019 - 2032)
- U.S.
- Canada
- Germany
- UK
- France
- Italy
- Spain
- Russia
- Netherlands
- Rest of Europe
- China
- India
- Japan
- South Korea
- Indonesia
- Malaysia
- Australia
- Rest of APAC
- Argentina
- Brazil
- Mexico
- Rest of LA
- UAE
- Saudi Arabia
- Israel
- South Africa
- Rest of MEA