Linear Resistors: World Markets, Technologies & Opportunities: 2022-2022

Linear Resistors: World Markets, Technologies & Opportunities: 2022-2022

(North Carolina, USA) Paumanok Publications, Inc. has published “Resistors: World Markets, Technologies & Opportunities: 2022-2027 ISBN# 1-89-3211-38-X (2022)”. This market study from Paumanok Publications, Inc. updates the 35-year commitment Paumanok has made to study the global market for linear resistors.

The study includes the following product lines-

PRODUCTS COVERED:

Paumanok has spent years analyzing global trade in the 8532 and 8533 HTS Codes for Capacitors, Resistors, Inductors and Circuit Protection Components, Publishing more than 300 digital assets on markets, technologies and opportunities and assisting the global supply chain in quantifying and qualifying opportunities by region and end-use market segment through product development, partnerships, mergers & acquisitions; technology advancement and supply chain visibility with an eye on Industry 4.0 and transparency from the finished product back down to engineered materials, ores and concentrates impacting multiple component and material ecosystems in fragmented end-use market segments.

Paumanok has also created its own taxonomy to best describe the actual trade of product, ands this coincides with the designations of the largest distributors of Passive Electronic Components in the world and reflects actual trade for consumption of these products. The more precise the taxonomy, the better the analytics, assessment, and forecasting. Paumanok covers 54 electronic component eco-systems and 14 materials supply chains for decades, collecting data each month and pushing it to our global clients- a verifiable who’s who of the OEM and EMS high tech economy and their FinTech partners. This study on Linear Resistors, 35 years in the making, covers the global markets, technologies and opportunities for linear resistors and related materials as follows-

LINEAR RESISTORS:

The resistor big data sets include fixed resistors in these 21 individual types and sub-categories-

Thick Film Chip Resistors (0201 Case Size Ru02 Thick Film on 96% Alumina)

This “thick film chip resistor” TFCR has the physical dimension of 0.02 x 0.01 inches and is extremely small, no bigger than a grain of salt. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product enables portable technology and is largely consumed in wireless handsets and enables module circuitry. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

Thick Film Chip Resistors (0402 Case Size Ru02 Thick Film on 96% Alumina)

This “thick film chip resistor” TFCR has the physical dimension of 0.04 x 0.02 inches and is extremely small,. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product enables portable technology and is largely consumed in wireless handsets, computers and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces. The 0402 is the largest volume chip resistor produced worldwide in terms of volume.

Thick Film Chip Resistors (0603 Case Size Ru02 Thick Film on 96% Alumina)

This “thick film chip resistor” TFCR has the physical dimension of 0.06 x 0.03 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers, automobiles and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

Thick Film Chip Resistors (0805 Case Size Ru02 Thick Film on 96% Alumina)

This “thick film chip resistor” TFCR has the physical dimension of 0.08 x 0.05 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers, automobiles and TV sets. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

Thick Film Chip Resistors (1206 Case Size Ru02 Thick Film on 96% Alumina)

This “thick film chip resistor” TFCR has the physical dimension of 0.12 x 0.06 inches and is small. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in computers and automobiles. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the hundreds of billions of pieces.

Thick Film Chip Resistors (1210-2512 Case Size Ru02 Thick Film on 96% Alumina)

This “thick film chip resistor” TFCR has the physical dimension of 0.12 x 0.10 to 0.25 x 0.12 inches and is large compared to other Components. This product is manufactured from ruthenium oxide resistive materials screen printed on a ceramic alumina substrate and terminated with solderable metal endcaps. This product is largely consumed in industrial electronics. It is used for creating ohmic values in all electronics and is a ubiquitous product line, produced worldwide in the tens of billions of pieces.

Carbon Film Resistor, Axial and Radial Leaded:

This is a legacy resistor product line that is constructed of carbon film deposited on a 96% alumina core. The product is consumed in consumer AV applications.

Metal Foil: (Nickel + Chromium Metal Foil in Axial, Radial and SMD Configurations):

This fixed resistor is a specialty resistor produced almost exclusively worldwide by Vishay Precision Group (VPG) and TDK Alpha Electronics. The product line is consumed in defense, oil & gas, instrumentation, space and laboratory electronics. Product line is sometimes referred to as Bulk Metal Foil. Invented by Dr. Felix Zandman founder of Vishay.

Tin-Oxide: (Antimony – 10 Resistive Element, also called Flameproof and High Voltage Resistors:

This resistor sold almost exclusively in axial leaded designs. This specialty resistor is sold primarily into high voltage and industrial end use markets.

Nichrome Film (Nickel + Chromium Deposited Metal Film on Ceramic Core):

This includes the MELF surface mount configurations; axial leaded and radial leaded designs. A large end-market in specialty resistors dominated by the Vishay-Dale and Beyschlag subsidiaries. The primary end-market is in automotive applications in Europe, including under-the-hood (MELF) and professional electronics in industrial markets.

Power Wirewound (Nickel + Chromium Wire wound on a Ceramic Core):

This resistor is available in axial, radial and molded chip surface mount designs) consumed in power electronics applications. A large market, also dominated worldwide by Vishay.

Resistor Network, The Multichip Array Network:

(Resistor network array in surface mount configuration manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a quad or octel package). The array is a “pick and place” solution whereby customers save money on pick and place costs by picking and placing four or eight chips in an array at once. This product is consumed in the computer markets.

Resistor Network, Coated SIP Network

(Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Single-In-Line Package- radial type unique lead).

Resistor Network, SMD DIP Network:

(Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Dual-In-Line Package in a surface mount molded chip with gull type metal leads). Consumed in computers and telecom infrastructure.

Resistor Network, Molded DIP Network

(Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Dual-In-Line Package- a surface mount package). Consumed in computers.

Resistor Network, Molded SIP Network

(Resistor network array manufactured from ruthenium oxide resistive paste on a ceramic 96% alumina substrate in a Single-In-Line Molded Package- a radial mount package). Consumed in computers and telecom infrastructure.

Thin Film Chips 0402 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.04 x 0.02 inch EIA designated case size consumed in specialty electronics, computers and communications modules. For precision circuits. Ultras-small Chip.

Thin Film Chips 0603 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.06 x 0.03 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits

Thin Film Chips 0805 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:

This is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.08 x 0.05 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits

Thin Film Chips 1206 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films:

This resistor is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.12 x 0.06 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits.

Thin Film Chips 1210-2512 Chips: Nickel + Chromium or Tantalum + Nitride Thin Films

This is sputtered on silicon or ceramic substrate in traditional chip case sizes- competes with thick film chips but is a precision part that is more expensive. In the 0.12 x 0.06 inch EIA designated case size consumed in specialty electronics, computers and communications. For precision circuits.

Ruthenium (For Resistor Inks):

This is an important precious metal as it is consumed as the primary resistive element in all thick film chip resistors and resistor networks. The consumption of ruthenium is almost 95% in resistors and therefore the price of ruthenium is directly impacted by the supply and demand of thick film chip resistors. Ruthenium is mined as a byproduct of platinum and is also impacted by the platinum mining industry. In the monthly report we track the price per troy ounce.

RESEARCH METHODOLOGY:

The methodology employed to create this study combines secondary and primary data sources, including government data; company financial data and primary human intelligence resources to draw conclusions. This is called a “legacy” of data that is designed to make sure that all pieces of the market “puzzle” fit together. Also we have the unique capability to benchmark the markets we study with previous studies under the same title produced in the past two decades. This enables us to establish the “Delphi -Method” which suggests that the trend of sales over time will support a similar rate of growth in the future. We caveat this approach by also employing a “Box-Jenkins” method of market research which adjusts forecasts based upon our knowledge of current events and their impact on the supply chain, and how that might impact future sales.