Global 3D Semiconductor Packaging Market 2023-2030

Global 3D Semiconductor Packaging Market 2023-2030

Global 3D Semiconductor Packaging Market Size, Share & Trends Analysis Report by Technology (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin and Ceramic Package), and by Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication and Aerospace & Defense), Forecast Period (2024-2031)

The global 3D semiconductor packaging market is anticipated to grow at a considerable CAGR of 10.2% during the forecast period (2024-2031). An increased demand for 3D semiconductor packaging in microelectronic devices drives the growth in the 3D semiconductor packaging industry. The growing adoption of advanced packaging technology with improved efficiency, and less power consumption is the key factor supporting the growth of the market globally. The market players are also focusing on introducing 3D semiconductor packaging solutions that further bolster the market growth. For instance, in November 2023, Amkor Technology, Inc., a provider of semiconductor packaging and test services, announced to building of an advanced packaging and test facility in Peoria, Arizona. By the time of full project completion, Amkor projects to invest approximately $2 billion and employ approximately 2,000 people at the new facility.

Segmental Outlook

The global 3D semiconductor packaging market is segmented on the technology, material, and industry verticals. Based on the technology, the market is sub-segmented into 3D through silicon via, 3D package on package, 3D fan out based and 3D wire bonded. Based on the material, the market is sub-segmented into organic substrate, bonding wire, leadframe, encapsulation resin and ceramic package. Further, on the basis of industry verticals, the market is sub-segmented into electronics, industrial, automotive & transport, healthcare, IT & telecommunication and aerospace & defense. Among the industry vertical, the electronics sub-segment is anticipated to hold a considerable share of the market owing to the rise in the development of 3D packaging integration to the next level by stacking multiple semiconductor dies on top of each other.

The 3D Through silicon via Sub-Segment is Anticipated to Hold a Considerable Share of the Global 3D Semiconductor Packaging Market

Among the technology, the 3D Through silicon via sub-segment is expected to hold a considerable share of the global 3D semiconductor packaging market. The segmental growth is attributed to the growing influence of the Through-Silicon Via (TSV) Structures in 3D Packages. TSVs are used to build 2.5D and 3D packages that contain multiple semiconductor dies. The structures enable vertical stacking without the edge wiring or wire bonding that was formerly used in stacked packages on organic substrates. For instance, in September 2022, EV Group (EVG) launched NanoCleave, a revolutionary layer release technology for silicon that enables ultra-thin layer stacking for front-end processing, including advanced logic, memory and power device formation, as well as 3D semiconductor advanced packaging.

Regional Outlook

The global 3D semiconductor packaging market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America. Among these, Asia-Pacific is anticipated to hold a prominent share of the market across the globe. The increased demand for compact electronic circuitry with the decreasing size of electronic devices for ease of access for users is a key contributor to the high share of the regional market.

Semiconductor Industry Value Added by Activity and Region 2021 (%)

Source: Semiconductor Industry Association

North America is Expected to Grow at a Considerable CAGR in the Global 3D Semiconductor Packaging Market

Among all regions, the North America regions is anticipated to grow at a considerable CAGR over the forecast period. Regional growth is attributed to the increasing production of semiconductor components, the presence of a large consumer base for electronics products, the high penetration of smartphones among the young population and a strong R&D pipeline for the semiconductor industries drive the growth of the market in the region. The key market players include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Microchip Technology Inc., NVIDIA Corp. and others.

Making substantial investments in domestic packaging capabilities and R&D is critical to creating a thriving semiconductor ecosystem in the region. For instance, in November 2023, the National Institute of Standards and Technology (NIST) released an approximately $3 billion National Advanced Packaging Manufacturing Program. The program boosts U.S. advanced packaging capabilities for semiconductors.

Market Players Outlook

The major companies serving the 3D semiconductor packaging market include Advanced Micro Devices, Inc., Amkor Technology, Intel Corp., Samsung Electronics Co., Ltd., United Microelectronics Corp., and others. The market players are considerably contributing to the market growth by the adoption of various strategies including mergers and acquisitions, partnerships, collaborations, funding, and new product launches, to stay competitive in the market.For instance, in June 2023, Cadence Design Systems, Inc. expanded collaboration with Samsung Foundry to accelerate 3D-IC design development for integrity 3D-IC platform supports Samsung’s new 3D CODE standard, enabling designers to create a variety of advanced packaging technologies.

The Report Covers

Market value data analysis of 2023 and forecast to 2031.

Annualized market revenues ($ million) for each market segment.

Country-wise analysis of major geographical regions.

Key companies operating in the global 3D semiconductor packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.

Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.

Analysis of market-entry and market expansion strategies.

Competitive strategies by identifying ‘who-stands-where’ in the market.