Molded Interconnect Devices (MID) Market Size By Process (Laser Direct Structuring (LDS), Two-Shot Molding), By Application (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication & Computing), COVID-19 Impact Analy

Molded Interconnect Devices (MID) Market Size By Process (Laser Direct Structuring (LDS), Two-Shot Molding), By Application (Automotive, Consumer Products, Healthcare, Industrial, Military & Aerospace, Telecommunication & Computing), COVID-19 Impact Analysis, Regional Outlook, Growth Potential, Price Trends, Competitive Market Share & Forecast, 2022 - 2030

The global molded interconnect devices (MID) market is projected to witness substantial growth over 2022-2030, on account of supportive government policies and the escalating investment in semiconductor manufacturing.

According to data from the Semiconductor Industry Association, since the beginning of 2021, the industry has announced over USD 80 billion in new investments through 2025 in the United States. Rapid advancements in consumer electronics are impacting the way semiconductor devices are wire bonded, thinned, encapsulated, and die-attached. These factors are likely to augment the use of molded interconnect device hardware to design compact, next-gen electronic components over the forthcoming years.

The molded interconnect devices (MID) market is bifurcated in terms of process, application, and regional landscape.

On the basis of the process, the market is segregated into two-shot molding, laser direct structuring (LDS), and others. The LDS segment among these will account for a substantial market share by 2030, which can be credited to the rising trend of miniaturization in the medical industry. Injection molding is being leveraged to mass-produce miniaturized medical devices with complex geometries. The LDS process is later adopted to draw the needed electrical trace layout to these medical components.

Through the adoption of this 3D-molded interconnect devices (MID) technology, the creation and design of electronics with complex functions have also been simplified and made more affordable, amplifying segmental expansion.

Based on application, the molded interconnect devices (MID) market is divided into Automotive & transportation, construction, water treatment, oil & gas, electrical and electronic, and others. Of these, the healthcare segment was valued at around USD 30 million in 2021.

The time and cost benefits offered by molded interconnect materials are aiding in the development of specialty sensors, implants, and antennas for healthcare solutions. MID manufacturers also work closely with healthcare professionals to develop prototypes and match the specific needs of medical devices, further augmenting segmental growth.

From a regional frame of reference, Europe’s molded interconnect devices (MID) market is poised to depict a CAGR of over 15% through 2030, driven by the implementation of strict regulatory frameworks associated with electronic waste management in the region. The auto industry size in countries, including France, Germany, and the Netherlands, has also grown commendably in recent years, which may increase the regional demand for MIDs for vehicle applications such as infotainment systems.

Latin America will also emerge as a lucrative revenue pocket for the molded interconnect devices market over the forecast period. This can be attributed to the emergence of small-scale electrical and electronic component manufacturers in major LATAM countries, including Brazil.