Asia Pacific Heat Pump Coils Market, Opportunity, Growth Drivers, Industry Trend Analysis and Forecast, 2024-2032

Asia Pacific Heat Pump Coils Market, Opportunity, Growth Drivers, Industry Trend Analysis and Forecast, 2024-2032


Asia Pacific Heat Pump Coils Market was valued at USD 1.8 billion in 2023 and is projected to grow at a CAGR of 10.5% by 2032. This growth is driven by increasing investments in residential and commercial infrastructure development, along with rising demand for energy-efficient technologies. The growing focus on sustainability and supportive government regulations, including new grants and incentives, is further accelerating the adoption of energy-efficient systems.

The Asia Pacific Heat Pump Coils Industry is categorized based on Heat Pump Type and Country.

The air source segment is expected to witness significant growth, surpassing USD 4 billion by 2032. This segment is gaining traction due to rising demand for energy-efficient space heating, cooling, and hot water solutions. Growing environmental awareness and the shift from traditional heating and cooling systems are key factors driving this demand. Government mandates focused on energy efficiency and carbon footprint reduction further fuel the trend. Technological advancements that enhance system efficiency and provide operational flexibility across residential and commercial applications are playing a pivotal role in shaping the market dynamics for air source heat pumps.

Meanwhile, the ground source heat pump segment is set for growth due to the increasing demand for advanced heat pump units, which are known for their precise temperature control and zoning capabilities. The market is also being propelled by a growing focus on energy efficiency, the rising adoption of renewable technologies, and efforts to reduce energy consumption and operational costs. These factors are driving the deployment of ground source heat pumps in various applications.

The water source heat pump segment is also expected to see significant growth, driven by the demand for energy-efficient heating and cooling systems. Increasing efforts to limit emissions and favorable regulatory initiatives are further accelerating the adoption of heat pump technologies across emerging markets in the Asia Pacific region.

In particular, China’s heat pump coils market is projected to exceed USD 2.5 billion by 2032. This growth is fueled by the development of residential and commercial infrastructure, favorable economic conditions, and stringent energy efficiency regulations. Government support through policies and financial incentives like grants, subsidies, and tax benefits is significantly contributing to the adoption of heat pump technologies in the country.


Chapter 1 Methodology and Scope
1.1 Market definitions
1.2 Base estimates and calculations
1.3 Forecast calculation
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid
1.4.2.2 Public
Chapter 2 Industry Insights
2.1 Industry ecosystem analysis
2.2 Regulatory landscape
2.3 Industry impact forces
2.3.1 Growth drivers
2.3.2 Industry pitfalls and challenges
2.4 Growth potential analysis
2.5 Porter's analysis
2.5.1 Bargaining power of suppliers
2.5.2 Bargaining power of buyers
2.5.3 Threat of new entrants
2.5.4 Threat of substitutes
2.6 PESTEL analysis
Chapter 3 Competitive Landscape, 2024
3.1 Strategic outlook
3.2 Innovation and sustainability landscape
Chapter 4 Market Estimates and Forecast, By Heat Pump Type, 2021 - 2032 (‘000 Units and USD Million)
4.1 Key trends
4.2 Air source
4.3 Ground source
4.4 Water source
Chapter 5 Market Estimates and Forecast, By Country, 2021 - 2032 (‘000 Units and USD Million)
5.1 Key trends
5.2 China
5.3 Japan
5.4 Australia
5.5 South Korea
Chapter 6 Company Profiles
6.1 Armstrong International Inc.
6.2 Carrier
6.3 CIG
6.4 Daikin
6.5 EVAPCO, Inc.
6.6 Hangzhou Shenshi Energy Conservation Technology Co., Ltd.
6.7 HPL Technology (Malaysia) Sdn Bhd
6.8 Kelvion Holding GmbH
6.9 MODINE MANUFACTURING COMPANY
6.10 Shanghai Shenglin M&E Technology Co., Ltd
6.11 TRANS ELECTRICAL ENGINEERING SDN BHD
6.12 TTP – Thermal Transfer Products

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