Semiconductor Packaging Market - Growth, Trends, Covid-19 Impact, and Forecasts (2023 - 2028)
The semiconductor packaging market is expected to witness a CAGR of 6.84% over the forecast period. Packaging has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product owing to the growing demand across various end-user verticals of the industry. Additionally, owing to this increasing demand, packaging has witnessed a continuous transformation in terms of characteristics, integration, and energy efficiency of the product.
Key HighlightsThe semiconductor packaging market is moderately fragmented as there are various packaging solution providers for the semiconductor market. Players adopt strategies like product innovation, expansions, and partnerships to stay ahead of the competition and expand their market reach. The competition will likely only increase considering the anticipated demand from new customers from end-user industries like Consumer Electronics and Automotive.
In July 2022, ChipMOS Technologies Inc. agreed to spend NTD 12.5 billion (USD 418.2 million) on Taiwan capacity expansion, according to the Ministry of Economic Affairs, which accepted the driver IC and memory chip test and packager's proposal to join in a governmental incentive program. The capacity increase would enable ChipMOS to pursue new commercial prospects in the 5G and automotive sectors.
In June 2022, ASE Group announced VIPack, an advanced packaging platform designed to enable vertically integrated packaging solutions. The VIPack represents ASE's next-generation 3D heterogeneous integration architecture that expands design rules and delivers ultra-high density and performance.
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