The Semiconductor Etch Equipment Market size is estimated at USD 23.80 billion in 2024, and is expected to reach USD 34.32 billion by 2029, growing at a CAGR of 7.60% during the forecast period (2024-2029).
The Semiconductor Etch Equipment Market is moderately competitive owing to the presence of some established players. The brand identity associated with the companies has a major influence in this market. As the barrier for the new entrants is high in the market due to the high capital incorporated, major players are adopting mergers and acquisition strategies to gain more market share. Some major players operating in the market include Applied Materials Inc., Hitachi High Technologies America, Inc., Lam Research Corporation, and Tokyo Electron Limited.
In June 2022, AlixLab developed a new, innovative method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the manufacturing process - Atomic Layer Etch Pitch Splitting (APS). According to the company, the method makes the components cheaper and less resource-intensive. The company also announced the completion of the Atomic Layer Etch (ALE) equipment hook-up in its clean room at ProNano RISE in Lund, Sweden.
In February 2022, Lam Research Corp. announced a new suite of selective etch products that apply breakthrough wafer fabrication techniques and novel chemistries to support chipmakers in developing gate-all-around (GAA) transistor structures. Composed of three new products, Argos, Prevos, and Selis, the company's selective etch portfolio provides a powerful advantage in the design and manufacture of advanced logic and memory semiconductor solutions.
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