2.5D & 3D Semiconductor Packaging Market - Growth, Trends, Covid-19 Impact, and Forecasts (2023 - 2028)
The 2.5D & 3D semiconductor packaging market is expected to register a CAGR of 13.68% over the forecast period.
Key HighlightsThe 2.5D & 3D semiconductor packaging market is moderately fragmented, with the presence of various significant players like ASE Group, Amkor Technology Inc., Intel Corporation, Samsung Electronics Co. Ltd, and Siliconware Precision Industries Co. Ltd., among others. The key players are continuously making efforts for partnerships, mergers, acquisitions, innovations, and investments in the market to retain their market positions.
In August 2022, Intel showcased the most recent architectural and packaging breakthroughs that enable 2.5D and 3D tile-based chip designs, ushering in a new era in chipmaking technologies and their significance. Intel's system foundry model features improved packaging. The company intends to increase the number of transistors on a package from 100 billion to 1 trillion by 2030.
In June 2022, ASE Group announced VIPack, an advanced packaging platform designed to enable vertically integrated packaging solutions. The VIPack represents ASE's next-generation 3D heterogeneous integration architecture that expands design rules and delivers ultra-high density and performance.
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