Category: Optoelectronics
Optoelectronics market research reports by MarketsandMarkets
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Silicon Photonics Market by Product (Transceivers, Variable Optical Attenuators, Switches, Sensors, and Cables), By Components (Lasers, Modulators, Optical Waveguides, Optical Interconnects, Photodetectors) - Global Forecast to 2029
Silicon Photonics Market by Product (Transceivers, Variable Optical Attenuators, Switches, Sensors, and Cables), By Components (Lasers, Modulators, Optical Waveguides, Optical Interconnects, Photodetectors) - Global Forecast to 2029 The silicon photonics market was valued at USD 2.16 billion in 2024 ... Read More
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Quantum Dot Market by Material (Cadmium-based Quantum Dots, Cadmium-free Quantum Dots), Product (Displays, Lasers, Solar Cells/Modules, Medical Devices, Photodetectors/Sensors, LED Products), Display, Vertical and Region - Global Forecast to 2029
Quantum Dot Market by Material (Cadmium-based Quantum Dots, Cadmium-free Quantum Dots), Product (Displays, Lasers, Solar Cells/Modules, Medical Devices, Photodetectors/Sensors, LED Products), Display, Vertical and Region - Global Forecast to 2029 The quantum dot market is projected to reach USD 23.9 ... Read More
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Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029
Interposer and Fan-out Wafer Level Packaging Market by Packaging Component & Design (Silicon, Organic, Glass, Ceramic), Packaging (2.5D, 3D), Device (Logic ICs, LEDs, Memory Devices, MEMS, Imaging & Optoelectronics), Industry - Global Forecast to 2029 The global interposer and FOWLP market is expect ... Read More
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Spin on Carbon Market by Type (Hot-Temperature Spin on Carbon, Normal-temperature Spin on Carbon), Application (Logic Devices, Memory Devices, Power Devices, Photonics, Advanced Packaging), End User and Region - Global Forecast to 2028
Spin on Carbon Market by Type (Hot-Temperature Spin on Carbon, Normal-temperature Spin on Carbon), Application (Logic Devices, Memory Devices, Power Devices, Photonics, Advanced Packaging), End User and Region - Global Forecast to 2028 The spin on carbon market is projected to grow from USD 199 mill ... Read More
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3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028
3D Stacking Market by Method (Die-to-Die, Die-to-Wafer, Wafer-to-Wafer, Chip-to-Chip, Chip-to-Wafer), Technology (Through-Silicon Via, Hybrid Bonding, Monolithic 3D Integration), Device (Logic ICs, Optoelectronics, Memory, MEMS) - Global Forecast to 2028 The 3D stacking market is projected to reach ... Read More
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Quantum Photonics Market Size by Offering (Systems, and Services), Application (Quantum Communications, Quantum Computing, and Quantum Sensing & Metrology), Vertical (Banking & Finance, Agriculture & Environment) and Region - Global Forecast to 2030
Quantum Photonics Market Size by Offering (Systems, and Services), Application (Quantum Communications, Quantum Computing, and Quantum Sensing & Metrology), Vertical (Banking & Finance, Agriculture & Environment) and Region - Global Forecast to 2030 The quantum photonics market is valued at USD 0.4 ... Read More
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Silicon Photonics Market with Recession Impact Analysis by Product (Transceivers, Switches, Sensors), Application (Data Centers & High-Performance Computing, Telecommunications), Waveguide, Component and Geography - Global Forecast to 2028
Silicon Photonics Market with Recession Impact Analysis by Product (Transceivers, Switches, Sensors), Application (Data Centers & High-Performance Computing, Telecommunications), Waveguide, Component and Geography - Global Forecast to 2028 The silicon photonics market was valued at USD 1.3 billion i ... Read More
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3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028
3D IC and 2.5D IC Packaging Market by Packaging Technology (3D Wafer-Level Chip Scale Packaging, 3D TSV and 2.5D), Application (Logic, Memory, MEMS/Sensors, Imaging & Optoelectronics, LED), End User and Region - Global Forecast to 2028 The 3D IC and 2.5D IC packaging market is projected to reach USD ... Read More
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Compound Semiconductor Market by Type (GaN, GaAs, SiC, InP), Product (LED, Optoelectronics, RF Devices, Power Electronics), Application (Telecommunication, General Lighting, Automotive, Consumer Devices, Power Supply) & Region - Global Forecast to 2027
Compound Semiconductor Market by Type (GaN, GaAs, SiC, InP), Product (LED, Optoelectronics, RF Devices, Power Electronics), Application (Telecommunication, General Lighting, Automotive, Consumer Devices, Power Supply) & Region - Global Forecast to 2027 The global compound semiconductor market size i ... Read More
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Laser Technology Market by Type (Solid, Liquid, Gas), Product (Laser, System), Application (Laser Processing, Optical Communication, Optoelectronic Devices), Vertical (Telecommunications, Industrial) and Region - Global Forecast to 2027
Laser Technology Market by Type (Solid, Liquid, Gas), Product (Laser, System), Application (Laser Processing, Optical Communication, Optoelectronic Devices), Vertical (Telecommunications, Industrial) and Region - Global Forecast to 2027 The laser technology market size is expected to grow from USD 1 ... Read More
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Bonding Sheet Market by Adhesive Material (Polyesters, Polyimides, Acrylics, Modified Epoxies), Application (Electronics/Optoelectronics, Telecommunication/5G Communication, Automotive, Building & Construction and Region - Global Forecast to 2027
Bonding Sheet Market by Adhesive Material (Polyesters, Polyimides, Acrylics, Modified Epoxies), Application (Electronics/Optoelectronics, Telecommunication/5G Communication, Automotive, Building & Construction and Region - Global Forecast to 2027 The global bonding sheet market size is projected to ... Read More
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Digital Isolator Market by Technology (Capacitive, Magnetic, GMR), Data Rate (Below 25 MBPS, 25-75 MBPS, Above 75 MBPS), Channel, Insulation Material, Application (Gate Drivers, DC/DC Converters, ADCs), Vertical and Geography - Global Forecast to 2027
The global digital isolator market size is estimated to be USD 1.8 billion in 2022 and projected to reach USD 2.7 billion by 2027, at a CAGR of 8.3% during the forecast period. Digital isolators are emerging as substitutes for optocouplers which is fuelling the market growth. Further, due to noise-f ... Read More
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