Global Thin Wafer Processing and Dicing Equipment Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Thin Wafer Processing and Dicing Equipment Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Market Overview:

The latest research study on the global Thin Wafer Processing and Dicing Equipment market finds that the global Thin Wafer Processing and Dicing Equipment market reached a value of USD 1520.48 million in 2022. It’s expected that the market will achieve USD 2595.73 million by 2028, exhibiting a CAGR of 9.32% during the forecast period.

Influence of COVID-19 Outbreak on Thin Wafer Processing and Dicing Equipment Industry Development

The impact of COVID-19 on the thin wafer processing and dicing equipment industry will involve all major links and all entities in the industry chain. The company's management efficiency has declined, commuting has been severely impeded, production plans have been severely impeded, network expansion has been delayed, marketing has been delayed, brand adjustments have been forced, market sales have declined, and company and employee income have been damaged.
COVID-19 has a huge impact on the operation of the industry, of which the impact on SMEs is more obvious. The suspension of production not only exacerbates the shortage of funds for SMEs, but also reduces the solvency of the enterprise and may affect production and sales. Some enterprises are in business difficulties and even go bankrupt.
Although the epidemic in China has been brought under control, production is gradually being resumed. However, considering that there may be a second wave of the epidemic, so that companies and workers are extremely cautious; and as another major market for thin wafer processing and dicing equipment, the US epidemic continues to ferment, and the turning point has not yet appeared. Therefore, we expect the market's growth rate to decline this year.

The Growing Market

Although various regions are actively developing semiconductor production bases, the Asia-Pacific region is expected to be the fastest growing semiconductor market in the world. Government support is an important factor. Increasingly developing initiatives such as the Made in India proposed by the Indian government and the Vision 2020 proposed by the Chinese government are increasingly attracting the attention of international participants to establish local production bases. The development of the semiconductor manufacturing bases in the Asia-Pacific region is expected to drive the growth of the thin wafer processing and cutting equipment industry in the near future.

Increasing downstream demand

In an era of rapid economic development, intelligence has gradually penetrated into all walks of life. As an important part of the industrial chain, thjn wafer processing and dicing equipment industry are greatly affected by the development of downstream demands. First of all, the increasing consumer demand for consumer power has driven the electronic packaging industry, and customers have put forward higher expectations for the functions of new electronic devices. Secondly, companies hope to develop technologically advanced smart home devices and wearable devices to help the company build a competitive advantage and seize market share. Finally, the proliferation of the Internet of Things and connected devices has received strong government support, and the penetration rate is expected to increase. These factors have led to a surge in the absorption of thin wafers and are stimulating global demand for thin wafer processing and cutting equipment.

Fierce Competition

Although the growing downstream demand for thin wafers has created opportunities for the industry, the competition among companies is also fierce. The market concentration of thin wafer processing and dicing equipment is relatively high. The main players with a significant share in the market are gradually expanding their overseas customer base. These companies are using new and innovative technologies to increase their visibility and market share, and increase their profitability. The relatively high entry threshold of this industry is not friendly to new entrants, unless new entrants have strong capital, excellent technical advantages and mature sales channels, otherwise it is difficult to gain a foothold in the market.

Region Overview:

From 2023-2028, Asia Pacific is estimated to witness robust growth prospects.

Company Overview:

DISCO Corporation is one of the major players operating in the Thin Wafer Processing and Dicing Equipment market, holding a share of 50.51% in 2023.

DISCO Corporation

DISCO Corporation is a Japanese precision tool manufacturer, especially in the semiconductor manufacturing industry.The company produces dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinding machines used to process silicon and compound semiconductor wafers to ultra-thin levels; polishers remove abrasive damage layers from the back of the wafer and increase chip strength.

SPTS Technologies

SPTS Technologies is a KLA company that designs, manufactures, sells and supports etching, PVD, CVD and MVD capital equipment to provide advanced wafer processing technologies and solutions for the semiconductor and microelectronics industries. End market applications include micro-electromechanical systems (MEMS), advanced packaging, LEDs, high-speed RF device ICs and power semiconductors.

Segmentation Overview:

By type, Thinning Equipment segment accounted for the largest share of market in 2022.

Application Overview:

By application, the MEMS segment occupied the biggest share from 2018 to 2022.

Key Companies in the global Thin Wafer Processing and Dicing Equipment market covered in Chapter 3:

Suzhou Delphi Laser
Hanslaser
Panasonic
Advanced Dicing Technologies
Plasma-Therm
DISCO Corporation
SPTS Technologies
Eotechnics
Accretech

In Chapter 4 and Chapter 14.2, on the basis of types, the Thin Wafer Processing and Dicing Equipment market from 2018 to 2029 is primarily split into:

Thinning Equipment
Blade Dicers
Laser Saws
Plasma

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Thin Wafer Processing and Dicing Equipment market from 2018 to 2029 covers:

MEMS
RFID
CMOS Image Sensor
Other

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)