Global Thick Film Hybrid Integrated Circuits Market Research Report 2024-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2030

Global Thick Film Hybrid Integrated Circuits Market Research Report 2024-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2030

Thick-Film Hybrid Integrated Circuits is a hybrid integrated circuit made by using thick film processes such as screen printing and sintering to make a passive network on the same substrate, and assemble discrete semiconductor device chips or monolithic integrated circuits or micro-components on it, and then package them.

Market Overview:

The latest research study on the global Thick Film Hybrid Integrated Circuits market finds that the global Thick Film Hybrid Integrated Circuits market reached a value of USD 1107.52 million in 2023. It’s expected that the market will achieve USD 1796.08 million by 2029, exhibiting a CAGR of 8.39% during the forecast period.

The evolution of automotive electronics has emerged as a significant driver for the Thick-Film Hybrid Integrated Circuits (HICs) market. This trend is propelled by the increasing intricacy of automotive systems, accelerated by shifts toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS). As these technologies redefine the automotive landscape, the demand for electronics that can seamlessly handle the demands of this evolving ecosystem is intensifying.

Electric vehicles, with their intricate battery management systems, power electronics, and energy-efficient components, necessitate electronic solutions that can perform reliably while maximizing limited space. Here, HICs shine by offering robust designs, efficient thermal management, and the capacity to integrate diverse components within confined spaces. Additionally, the rise of ADAS, including radar, lidar, cameras, and advanced sensor systems, underscores the requirement for electronics capable of real-time data processing, sensor fusion, and complex control algorithms. HICs play a pivotal role by providing the performance, reliability, and miniaturization necessary to enable these safety-critical functionalities.

The HICs market is poised to thrive within the realm of automotive electronics as the industry navigates the convergence of electrification, connectivity, and automation. The ability of HICs to address the multifaceted challenges posed by this paradigm shift positions them as an indispensable solution for delivering cutting-edge, reliable, and efficient electronic systems that shape the future of automotive technology.

Region Overview:

Asia Pacific had the highest growth rate of all regions in 2022.

In 2022, the share of the Thick Film Hybrid Integrated Circuits market in North America stood at 37.31%.

Company Overview:

Zhenhua Microelectronics Ltd. is one of the major players operating in the Thick Film Hybrid Integrated Circuits market, holding a share of 11.30% in 2023.

Zhenhua Microelectronics Ltd., Fenghua Advanced Technology Holding CO.,LTD,, Chongqing Sichuan Instrument Microcircuit Co., Ltd., Kolektor Siegert GmbH and AUREL s.p.a. are the five key players in the global Thick Film Hybrid Integrated Circuits market. These companies have shown consistent growth in revenue, larger volumes of sales and a prominent presence in terms of share in the global Thick Film Hybrid Integrated Circuits market in the past 5 years.

Fenghua Advanced Technology Holding CO.,LTD., founded in 1984, is a high-tech enterprise specializing in high-end new components, electronic materials and other electronic information basic products, listed on the Shenzhen Stock Exchange in 1996. Since entering the electronic components industry, Fenghua Hi-Tech has achieved leapfrog development, and has now become a large-scale domestic scientific research, production and export base for new components and electronic information basic products, and an internationally renowned new electronic components industry company with independent intellectual property rights and key technologies of core products.

Segmentation Overview:

The BeO Ceramic Substrate segment by type showed a value growth of 11.94% in 2022.

Among different product types, 96% Al2O3 Ceramic Substrate segment is anticipated to contribute the largest market share in 2028.

Application Overview:

By application, the Defense and Aerospace segment occupied the biggest share from 2018 to 2022.

Key Companies in the global Thick Film Hybrid Integrated Circuits market covered in Chapter 3:

AUREL s.p.a.
China Electronics Technology Group Corporation
Cermetek Microelectronics
Integrated Technology Lab
Kolektor Siegert GmbH
Metallux
Fenghua Advanced Technology Holding CO.,LTD,
JRM
Advance Circtuit Technology
Corintech
Custom Interconnect
Midas Microelectronics
Zhenhua Microelectronics Ltd.
Xin Jingchang Electronics Co.,Ltd
Chongqing Sichuan Instrument Microcircuit Co., Ltd.

In Chapter 4 and Chapter 14.2, on the basis of types, the Thick Film Hybrid Integrated Circuits market from 2019 to 2030 is primarily split into:

96% Al2O3 Ceramic Substrate
BeO Ceramic Substrate
AIN Based
Other Substrates

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Thick Film Hybrid Integrated Circuits market from 2019 to 2030 covers:

Defense and Aerospace
Automotive
Other

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2019-2030) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)