Global Thick Film Ceramic Substrates Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Thick Film Ceramic Substrates Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Ceramic substrate materials are widely used in electronic package substrates because of their high strength, good insulation, excellent thermal and thermal resistance, low thermal expansion coefficient and good chemical stability.

Market Overview:

The latest research study on the global Thick Film Ceramic Substrates market finds that the global Thick Film Ceramic Substrates market reached a value of USD 1800.28 million in 2022. It’s expected that the market will achieve USD 2511.66 million by 2028, exhibiting a CAGR of 5.71% during the forecast period.

The thermal expansion coefficient of the ceramic substrate is close to that of the silicon chip

The thermal expansion coefficient of the ceramic substrate is close to that of the silicon chip, which can save the Mo layer of the transition layer, save labor, materials, and reduce costs.

Electrical properties

Insulation resistance and insulation breakdown voltage are high;
Low dielectric constant;
Low dielectric loss;
Stable performance under high temperature and high humidity conditions ensures reliability.

Production technology improvement and product upgrade

With the improvement of the technology of various suppliers, the production technology of Thick Film Ceramic Substrates is also constantly improving. The development of a wider range of applications, higher product performance and more affordable products will be one of the growth opportunities in this market in the future.

Region Overview:

From 2023-2028, Japan is estimated to witness robust growth prospects.

Company Overview:

Kyocera is one of the major players operating in the Thick Film Ceramic Substrates market, holding a share of 14.77% in 2023.

Kyocera

Kyocera Corporation develops, produces, and distributes ceramic and electronic components, and telecommunications and information equipment worldwide.

Maruwa

Maruwa Co., Ltd. produces and sells ceramics and electronic parts in Japan, Europe, the United States, China, Taiwan, Korea, Malaysia, and India. The company offers ceramics, including ceramic substrates and fillers, metalized/multilayer ceramic substrates, and pressed ceramic products; and electronic components/devices, such as antennas, EMC and RF components, inductors, and capacitors.

Segmentation Overview:

Among different product types, Al2O3 segment is anticipated to contribute the largest market share in 2028.

Al2O3

Aluminum oxide is a chemical compound of aluminum and oxygen with the chemical formula Al2O3. Al2O3 is significant in its use to produce aluminum metal, as an abrasive owing to its hardness, and as a refractory material owing to its high melting point.

AlN

Aluminum Nitride (AlN), a covalently-bonded ceramic, is synthesized from the abundant element’s aluminum and nitrogen. It does not occur naturally. AlN is stable in inert atmospheres at temperatures over 2000°C. It exhibits high thermal conductivity but is, uniquely, a strong dielectric. This unusual combination of properties makes AlN a critical advanced material for many future applications in optics, lighting, electronics and renewable energy.

Application Overview:

By application, the LED segment occupied the biggest share from 2018 to 2022.

LED

A light-emitting diode (LED) is a semiconductor light source that emits light when current flows through it. Electrons in the semiconductor recombine with electron holes, releasing energy in the form of photons.

Chip Resistor

Chip resistors have the characteristics of limiting DC or AC. Such characteristics are used to drop the voltage or maintain the current at a certain level inside an electronic circuit.

Wireless Modules

The wireless module (RF wireless module) is a modular product of digital data transmission radio (digital radio), which refers to a high-performance professional data transmission radio module realized by DSP technology and radio technology.

Key Companies in the global Thick Film Ceramic Substrates market covered in Chapter 3:

Ceramtec
Cicor Group
Noritake
Chaozhou Three-circle
TTM Technologies
NEO Tech
Kyocera
Maruwa
CoorsTek
Nippon Carbide
Tong Hsing
LEATEC Fine Ceramics
Phonon Meiwa
Holy Stone Enterprise

In Chapter 4 and Chapter 14.2, on the basis of types, the Thick Film Ceramic Substrates market from 2018 to 2029 is primarily split into:

Al2O3
AlN
Others

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Thick Film Ceramic Substrates market from 2018 to 2029 covers:

LED
Chip Resistor
Wireless Modules
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)