Global Semiconductor Tape Market Research Report 2024-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2030

Global Semiconductor Tape Market Research Report 2024-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2030

Semiconductor tape is used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting.

Market Overview:

The latest research study on the global Semiconductor Tape market finds that the global Semiconductor Tape market reached a value of USD 1153.58 million in 2023. It’s expected that the market will achieve USD 1647.04 million by 2029, exhibiting a CAGR of 6.11% during the forecast period.

New Production Equipment for Semiconductor-Related Tape Due to Rising Demand for Semiconductors and the Move to Making Thinner, Multilayered Tapes

August 1, 2022
In response to the recent rapid growth in semiconductor demand, aggressive investment by semiconductor manufacturers to increase production capacity, and dramatic technological innovation, LINTEC has decided to invest approximately 4.5 billion yen in the Agatsuma Plant (Gunma Prefecture). The investment will cover the installation of new state-of-the-art production equipment for related tapes essential to the semiconductor manufacturing process and mounting in order to increase production capacity and further raise product quality.

Sustained growth, demand upgrading, downstream manufacturing transfer changes

The semiconductor tape industry is strongly influenced by the growth of the semiconductor industry. As the demand for smaller, faster, and more powerful electronic devices continues to grow, so does the need for thinner, more precise wafer manufacturing processes, which is driving the continued development of the demand for semiconductor tapes. In addition, with the continuous advancement of semiconductor technology, such as the development of smaller feature sizes and more complex integrated circuits, the downstream technology changes, placing higher demands on semiconductor tape performance, requiring advanced semiconductor tapes to provide consistent and reliable results. For example, progress is being made in the development of solvent-resistant cutting tapes that can not only temporarily hold wafers, but also clean them directly with solvents; For BG tape, it is necessary to develop a heat-resistant tape that can be used during heat treatment while the tape remains attached after grinding. In addition, with the increasing heap of memory, BG tape and cutting tape need higher functionality. The change in the location of downstream semiconductor manufacturing facilities has also changed the need for semiconductor tape, with the growth of semiconductor demand in the Asia-Pacific region, especially the huge semiconductor consumer demand in the Chinese market, semiconductor manufacturing tends to shift to the Asia-Pacific region, in order to better develop supporting facilities for semiconductor manufacturing and provide a sound industrial chain. This has promoted the development of the semiconductor materials market in Asia.

Region Overview:

Asia Pacific is projected to account for a considerable share of the Semiconductor Tape market and is expected to become the largest region by 2028.

Company Overview:

LINTEC is one of the major players operating in the Semiconductor Tape market, holding a share of 31.51% in 2023.

LINTEC is a comprehensive manufacturer of adhesive-related products established in 1934.

Segmentation Overview:

Among different product types, Dicing Tape segment is anticipated to contribute the largest market share in 2028.

It is protection tape for circuit of semiconductor wafer surface in back grinding process.

Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame.

Application Overview:

By application, the Semiconductor segment occupied the biggest share from 2018 to 2022.

Semiconductor tape is mainly used in semiconductor wafer etching, wafer thinning and cutting, sealing and other links, the main terminal downstream for the semiconductor industry, electronic equipment manufacturing industry, IC manufacturing industry and so on.

Key Companies in the global Semiconductor Tape market covered in Chapter 3:

Semiconductor Equipment
DaehyunST
Furukawa Electric
Mitsui Chemicals
AMC
Nitto
3M
Maxell Holdings
Lintec

In Chapter 4 and Chapter 14.2, on the basis of types, the Semiconductor Tape market from 2019 to 2030 is primarily split into:

Back Grinding Tape
Dicing Tape
Others

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Semiconductor Tape market from 2019 to 2030 covers:

Semiconductor
Electronic Devices
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2019-2030) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)