Global Semiconductor Packaging Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Semiconductor Packaging Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

The semiconductor production process consists of wafer manufacturing, wafer testing, chip packaging, and post-package testing. Semiconductor packaging refers to the process of processing the tested wafers to obtain independent chips according to product model and functional requirements.

Market Overview:

The latest research study on the global Semiconductor Packaging market finds that the global Semiconductor Packaging market reached a value of USD 33455.83 million in 2022. It’s expected that the market will achieve USD 50253.6 million by 2028, exhibiting a CAGR of 7.02% during the forecast period.

the COVID -19 Impact on the Semiconductor Packaging Industry

Affected by COVID -19, the manufacturing, transportation, logistics and other industries of key technology industry centers in many regions of the world have been suspended. The semiconductor industry chain is long, and the upstream and downstream relationships are complex. Under the current COVID -19, the impact on different levels of the semiconductor industry is different.
Because of the spread of COVID -19, logistics restrictions will impact the global supply chain. In addition to labor and logistics, the procurement of Semiconductor Packaging companies will also have problems, and the supply chain will inevitably experience unpredictable interruptions.
COVID -19 makes the factory labor shortage, resulting in a decline in production and capacity. Because of delayed construction and personnel isolation, the original sales orders and contract plans will be broken, which will affect the normal production of Semiconductor Packaging companies. In addition, logistics stagnation and other conditions often affect not only upstream or downstream enterprises, but also some of the main Materials also face the risk of material outages, so they will affect the entire global supply chain.
COVID -19 brings uncertainty to the long-term release plan, supply chain and distribution channels of electronic consumer products. For example, global mobile phone manufacturers have a backlog of inventories, new product release is delayed, and new project development is lagging, which will inevitably have an impact on the global semiconductor industry and Semiconductor Packaging industry. Fluctuations in the electronic consumer market will cause ups and downs in the Semiconductor Packaging industry.
For the medical and automotive electronics industries, the current medical products used for COVID -19 detection and treatment are mainly concentrated in handheld thermometers, infrared imaging monitors, CT imaging equipment, ultrasonic atomization equipment, and equipment for monitoring patient vital signs Wait. Basically, it will not affect the semiconductor industry and Semiconductor Packaging industry.

Automotive electronics grew rapidly

After a long period of development, the automobile industry has realized the automobile electronic front loading with safety and comfort as the core. However, safety-related electronic systems are rapidly gaining ground, driven by government regulation and consumer demand. Today, much of the industry's innovation is in electronics rather than machinery. Automation, electrification, digital interconnection and security. These four trends will drive the growth of Semiconductor Packaging in automotive electronics and subsystems over the next decade.

The development of communication technology

Nowadays, with the development of communication technologies, they have penetrated into many areas of our lives and are still expanding. The Semiconductor industry is the upstream industry of the technology industry such as the communication industry. All areas of communication require semiconductor technology. Advances in satellites, broadcast radio, microwaves, mobile communications systems, wi-fi, and technologies such as bluetooth and Zigbee are driving the Semiconductor components and Semiconductor Packaging industry.

Asia-pacific market demand is stable

Asia-pacific will remain the world's largest consumer market for semiconductors. An increase in the share of Chinese products is spurring growth across the Asia-pacific market and will provide the main driver. In addition, the increased Merger and acquisition activity will be beneficial to the future development of the semiconductor industry.

Region Overview:

China dominated the Semiconductor Packaging market in 2022, with a market share of 33.97%.

Company Overview:

ASE Technology Holding Co., Ltd. is one of the major players operating in the Semiconductor Packaging market, holding a share of 16.92% in 2023.

ASE Technology Holding Co., Ltd.

ASE Technology Holding Co., Ltd. offers assembly and testing services. The Company provides outsourced assembly, semiconductor testing, semiconductor packaging, and other related services.

Amkor Technology

As the original pioneers of the OSAT industry, Amkor Technology has helped define and advance the technology manufacturing landscape. Since 1968, Amko have delivered innovative packaging solutions with the service and capacity global customers rely on.

Segmentation Overview:

Among different product types, Flip Chip segment is anticipated to contribute the largest market share in 2028.

Application Overview:

By application, the Consumer Electr segment occupied the biggest share from 2018 to 2022.

Key Companies in the global Semiconductor Packaging market covered in Chapter 3:

SPIL
UTAC Holdings Ltd and its subsidiaries (“UTAC”)
ChipMOS Technologies Inc.
ASE Technology Holding Co., Ltd.
King Yuan Electronics CO., Ltd.
JCET (STATS ChipPAC)
TongFu Microelectronics Co., Ltd.
Amkor Technology
Tianshui Huatian Technology Co., Ltd
Powertech Technology Inc.

In Chapter 4 and Chapter 14.2, on the basis of types, the Semiconductor Packaging market from 2018 to 2029 is primarily split into:

Flip Chip
Embedded Die
Fan-in Wafer Level Packaging (Fi Wlp)
Fan-out Wafer Level Packaging (Fo Wlp)

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Semiconductor Packaging market from 2018 to 2029 covers:

Consumer Electronics
Aerospace and Defense
Medical Devices
Communications and Telecom
Automotive Industry

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)