Global Semiconductor Microchip Thermal Management Technology Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Semiconductor Microchip Thermal Management Technology Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Semiconductor microchip thermal management technology is a technology that controls the temperature of the heat generated by semiconductor microchips during operation.

Market Overview:

The latest research study on the global Semiconductor Microchip Thermal Management Technology market finds that the global Semiconductor Microchip Thermal Management Technology market reached a value of USD 10930.6 million in 2022. It’s expected that the market will achieve USD 18083.0 million by 2028, exhibiting a CAGR of 8.75% during the forecast period.

Affect the normal operation of the industry

The raging COVID-19 has plunged the global economic environment into depression. The influence of COVID-19 on semiconductor microchip thermal management technology industry will involve all major links and entities in the industrial chain. The management efficiency of the company declined, commuting was hindered and the company's development strategy and marketing methods were forced to adjust. In addition, during the COVID-19 period, the logistics speed slowed down or even stopped, and the supply of raw materials for semiconductor microchip thermal management product production was tight. The company's production is limited to some extent, and the production of related enterprises in the hardest hit areas is greatly affected. After the epidemic is over, it will also face the financial pressure of rising costs caused by the shortage of raw materials.

Affect industry supply chain

The epidemic will have a short-term impact on the semiconductor microchip thermal management technology industry. Affected by the epidemic situation, the enterprises that produce thermal management hardware, Interface and Substrates, the procurement and transportation supply of raw materials and equipment are difficult to reach the designated position, and the upstream enterprises affect the work progress of downstream enterprises. Equipment manufacturing and product manufacturing enterprises in semiconductor microchip thermal management technology industry are affected to varying degrees, and production and delivery may be delayed to some extent. At the same time, if it can't meet the customer's delivery time requirements according to the contract, it may cause the customer to find another enterprise and lose business. In addition, the COVID-19 epidemic has led to the closure of many manufacturing plants around the world. The epidemic caused huge income loss to the end-user industry. The blockade of coronavirus has inhibited the production of several key raw materials in the global market, thus pushing up the price. The strict blockade imposed by the government limits the cross-border trade between countries, which is another factor that is not conducive to the market share of semiconductor microchip thermal management technology. In addition, it is expected that after the blockade is lifted in many countries, the product demand of the end-user department may increase.

Development of 5G technology

As 5G infrastructure and compatible devices continue to be deployed, 5G applications are in full swing, and mid-band infrastructure installed by the end of 2021 is already almost 6 times that of 2019. Much of the current 5G infrastructure is repurposing 4G equipment in lower frequency bands. The real transition to 5G lies in higher frequency applications, which can be largely divided into sub-6 GHz and millimeter wave (>20 GHz) frequency bands. Thermal management is one of its key challenges. As 5G deployments transition to higher frequencies, the choice of antenna design, technology and materials will also change. This will affect various factors, such as related semiconductor technology, chip attach materials and thermal interface materials.
Millimeter-wave is a high-frequency technology that enables 5G potential applications with extremely high download speeds and extremely low latency. The challenge comes mainly from signal propagation, which attenuates the signal as the frequency increases, resulting in reduced coverage. To increase antenna gain, the number of antenna elements will increase, but the antenna elements themselves will shrink thanks to the smaller wavelength.
This results in a tighter array of power amplifiers and beamforming electronics, which creates greater thermal management challenges. Also, more millimeter-wave small base stations are needed to provide sufficient coverage. Active cooling schemes are unlikely due to their deployment scenarios, coupled with densified beamforming components will place higher demands on thermal management solutions such as thermal interface materials.

Technical Progress

Manufacturers such as Samsung and Xiaomi have started showing interest in the adoption of passive cooling technology on their devices, especially smartphones. Thus thermal component makers for these companies are building up their production capacities. For instance, In May 2020, Realme X50 Pro Player Edition launched as a cheaper version of Realme X50 Pro. It features a vapor chamber and a multilayer solid graphite for thermal management.
In the current market scenario, thermal management technologies are evolving rapidly, especially in consumer electronics, due to greater processing capacity. Usually, the chip design and the chip cooling system are independent and separate. But now, researchers at the Swiss Federal Institute of Technology Lausanne (EPFL) have announced that they have combined these two design steps into one, developing a direct cooling system with a liquid cooling system built into the chip.
Compared with the traditional electronic cooling method, the cooling performance of this method can be up to 50 times that of the traditional design, which is a promising, sustainable and cost-effective method. Researchers say that by eliminating the need for large external heat sinks, this method can integrate more compact electronic devices (such as power converters) into a single chip.
The continuous progress of semiconductor microchip thermal management technology promotes its wider application.

Region Overview:

In 2022, the share of the Semiconductor Microchip Thermal Management Technology market in United States stood at 26.76%.

Company Overview:

Vertiv is one of the major players operating in the Semiconductor Microchip Thermal Management Technology market, holding a share of 9.77% in 2023.

Vertiv

Vertiv designs, makes and markets uninterruptible power supply (UPS) units, thermal management equipment, data center racks and enclosures, and monitoring equipment that helps protect and support IT environments. Its products are used by companies in the communications, energy, data center, transit, government, industrial, and utilities sectors.

Boyd Corporation

Boyd Corporation provides advanced sealing, thermal management and protection solutions. The Company offers bonding, adhesive system, extrusions, linear, gaskets seals, air, conduction, liquid cooling, and related accessories. Boyd serves clients worldwide.

Segmentation Overview:

As for product types, the Hardware segment held the largest market share in 2022.

Application Overview:

The market's largest segment by application is the segment Automotive Industry, with a market share of 31.12% in 2022.

Key Companies in the global Semiconductor Microchip Thermal Management Technology market covered in Chapter 3:

Comair Rotron
Ansys
Cps Technologies Corp
II-VI Incorporated
Boyd Corporation
Ferrotec
Honeywell International
Mikros Technologies
Parker Hannifin Corp
Cool Innovations
Qualtek Electronics Corp
Vertiv
Dynatron
EBM-Papst
European Thermodynamics

In Chapter 4 and Chapter 14.2, on the basis of types, the Semiconductor Microchip Thermal Management Technology market from 2018 to 2029 is primarily split into:

Hardware
Software
Interface
Substrates

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Semiconductor Microchip Thermal Management Technology market from 2018 to 2029 covers:

Automotive Industry
Medical Equipment
Networking and Telecommunications
Consumer Electronics
Military and Aerospace
Renewable Energy
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)