Global Reflow Soldering System Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Reflow Soldering System Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029


Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.

Market Overview:

The latest research study on the global Reflow Soldering System market finds that the global Reflow Soldering System market reached a value of USD 1011.38 million in 2022. It’s expected that the market will achieve USD 1459.46 million by 2028, exhibiting a CAGR of 6.3% during the forecast period.

Market Opportunities and Drivers

A reflow oven with unique multi-nozzle airflow control. In order to better control the temperature field in the reflow oven to achieve better welding results, the new reflow oven is equipped with a unique multi-nozzle airflow control device in the furnace. There are several small nozzles evenly distributed in the furnace. It is sprayed through the nozzle to form a small loop around it to provide an optimum temperature distribution. The equipment adopts a regional separation system. The airflow speed, airflow direction, air volume and air temperature in each zone are controlled by special software to achieve the full convection effect of hot air.

Market Risks/Restraints

Reflow soldering is poor
Component lead PCB pads have been oxidized and contaminated; excessive reflow temperatures; poor solder paste quality. Both will result in poor wettability and severe soldering in severe cases.
Contaminant covered with solder paste after reflow soldering
Paper from the scene, foreign objects from the tape, human touch PCB pads or components, misprinted characters, and contaminants covering the pads.
Part shifting during reflow soldering due to the problem that the soldered end of the component cannot overlap with the pad.

Region Overview:

In 2022, the share of the Reflow Soldering System market in Asia Pacific stood at 45.06%.

Company Overview:

Illinois Tools Works is one of the major players operating in the Reflow Soldering System market, holding a share of 11.32% in 2023.

Illinois Tools Works

Illinois Tool Works Inc. designs and manufactures fasteners, components, equipment, consumable systems, and a variety of specialty products and equipment. The Company's products include industrial fluids and adhesives, tooling for specialty applications, welding products, and quality measurement equipment and systems. Illinois Tool Works operates worldwide.

Heller Industries

Heller Industries, Inc. provides reflow technology solutions. The Company offers curing systems, semiconductors, and reflow equipment for electronic manufacturers and assemblers. Heller Industries serves customers worldwide.

Segmentation Overview:

By type, Convection Reflow Soldering segment accounted for the largest share of market in 2022.

Application Overview:

By application, the Consumer Electronics segment occupied the biggest share from 2018 to 2022.

Key Companies in the global Reflow Soldering System market covered in Chapter 3:

Tamura Corporation
BTU International
Shenzhen JT Automation
Unisplendour Technology
Manncorp
Kurtz Ersa
Heller Industries
Rehm Thermal Systems GmbH
Folungwin
Illinois Tools Works
SMT Maschinen und Vertriebs GmbH
Eightech Tectron
SEHO Systems GmbH

In Chapter 4 and Chapter 14.2, on the basis of types, the Reflow Soldering System market from 2018 to 2029 is primarily split into:

Convection Reflow Soldering
Condensation Reflow Soldering

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Reflow Soldering System market from 2018 to 2029 covers:

Automotive Electronics
Consumer Electronics
Telecommunication
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)


Chapter 1 Market Definition and Statistical Scope
Chapter 2 Research Findings and Conclusion
Chapter 3 Key Companies’ Profile
Chapter 4 Global Reflow Soldering System Market Segmented by Type
Chapter 5 Global Reflow Soldering System Market Segmented by Downstream Industry
Chapter 6 Reflow Soldering System Industry Chain Analysis
Chapter 7 The Development and Dynamics of Reflow Soldering System Market
Chapter 8 Global Reflow Soldering System Market Segmented by Geography
Chapter 9 North America
Chapter 10 Europe
Chapter 11 Asia Pacific
Chapter 12 Latin America
Chapter 13 Middle East & Africa
Chapter 14 Global Reflow Soldering System Market Forecast by Geography, Type, and Downstream Industry 2023-2029
Chapter 15 Appendix

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