Global Plating for Microelectronics Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Plating for Microelectronics Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Metal plating (also known as electroplating or electrodeposition) is a coating technology that deposits a thin layer of a metal or alloy on a conductive surface to impart particular functional or aesthetic properties. During the plating process, the object to be plated functions as the positively charged cathode while the desired plating material serves as the negatively charged anode and source of the metallic ions that will form the final coating. Immersing both materials in a bath or solution of electrolyte salts and adding an electrical current causes an oxidation/reduction reaction on the surface of the cathode where the metallic ions are deposited.

Market Overview:

The latest research study on the global Plating for Microelectronics market finds that the global Plating for Microelectronics market reached a value of USD 1996.29 million in 2022. It’s expected that the market will achieve USD 2687.46 million by 2028, exhibiting a CAGR of 5.08% during the forecast period.

Region Overview:

Asia-Pacific had the highest growth rate of all regions.

Company Overview:

The top three companies are Atotech, DOW, Mitsubishi Materials Corporation, with the revenue market share of 18.92%, 8.61%, and 8.02% in 2017.

Atotech is an international speciality chemicals company with its main office in Berlin, Germany. Atotech provides specialty chemical processes and equipment for the printed circuit board, IC-substrate and semiconductor industries as well as the decorative and functional surface finishing industries.

Atotech operates in more than 40 countries with chemistry and equipment production sites in Germany, Czech Republic, Slovenia, Spain, China, Korea, Taiwan, Singapore, India, Japan, USA, Canada, Mexico and Brazil. In 2012, the company employed about 4,000 people. Atotech was founded in 1993, when ELFAtochem merged its M&T Harshaw operations with the electroplating division of Schering AG.

Dow Electronic Materials is a global supplier of materials and technologies to the electronics industry, including the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets.

Segmentation Overview:

Among different product types, Electroplating segment is anticipated to contribute the largest market share in 2027.

Application Overview:

By application, the Copper segment occupied the biggest share from 2017 to 2022.

Key Companies in the global Plating for Microelectronics market covered in Chapter 3:

Coatech
Moses Lake Industries
XiLong Scientific
Meltex
Atotech
MAGNETO special anodes
Heraeus
Vopelius Chemie AG
Materion
Mitsubishi Materials Corporation
Raschig GmbH
Japan Pure Chemical
DOW
Yamato Denki
Ishihara Chemical

In Chapter 4 and Chapter 14.2, on the basis of types, the Plating for Microelectronics market from 2018 to 2029 is primarily split into:

Electroplating
Electroless
Immersion

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Plating for Microelectronics market from 2018 to 2029 covers:

Gold
Zinc
Nickel
Bronze
Tin
Copper
Other

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)