Global Multi-layer Flexible Printed Circuit (FPC) Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029
Flexible Printed Circuit (FPC) is a special printed circuit board. It is characterized by light weight, thin thickness, softness and bendability. Multi-layer Flexible Printed Circuit (FPC) is an FPC with at least three conductor layers.
Market Overview:
The latest research study on the global Multi-layer Flexible Printed Circuit (FPC) market finds that the global Multi-layer Flexible Printed Circuit (FPC) market reached a value of USD 6465.48 million in 2022. It’s expected that the market will achieve USD 10844.74 million by 2028, exhibiting a CAGR of 9.0% during the forecast period.
Industry Impact Analysis
Globally, 6.49 million people have died since the outbreak began, and the toll continues to rise. At present, the global economy continues to recover, but due to the disruption of supply chains, the uncertainty of the epidemic has increased, the uncertainty of global economic recovery has increased, and the momentum of recovery has weakened. It's the worst global recession in decades, despite a massive government effort to fight it, backed by fiscal and monetary policy. But in the longer term, a severe recession triggered by the pandemic is expected to lead to a prolonged downturn in the economy by reducing investment. The recession could get worse if the COVID-19 outbreak continues, if restrictions on liquidity are extended or reintroduced, or if economic activity is disrupted for a prolonged period. Businesses may struggle to service debt, and increased risk aversion could lead to higher borrowing costs.
The outbreak has had a complex impact on the Multi-layer Flexible Printed Circuit (FPC) industry. First of all, for the Multi-layer Flexible Printed Circuit (FPC) industry, the epidemic has had an impact on the production plans of companies in the Multi-layer Flexible Printed Circuit (FPC) industry. Due to the outbreak of the COVID-19 epidemic, the raw material manufacturing plant has been suspended, therefore, the supply of raw materials including electronic components, FCCL, electromagnetic shielding film materials, etc. has been affected. This could lead to disruptions in the supply of raw materials in the Multi-layer Flexible Printed Circuit (FPC) industry, thereby affecting the company's production schedule. At the same time, the epidemic also has an impact on STM process processing companies, these companies suspend patch services, and the production of industry companies is affected. On the other hand, due to the impact of the new crown pneumonia epidemic, in order to prevent the further spread of the epidemic, the government issued restrictions on personnel travel and related isolation policies, which reduced the management efficiency of enterprises in the industry and affected the company's production plan.
Region Overview:
From 2022-2027, China is estimated to witness robust growth prospects.
Company Overview:
NOK is one of the major players operating in the Multi-layer Flexible Printed Circuit (FPC) market, holding a share of 20.28% in 2022.
NOK is Japan's oldest oil seal manufacturer. Functional components such as oil seals manufactured by the company through NOK's advanced sealing technology are used in automobiles, construction machinery, agricultural machinery, electronic equipment, office equipment and residential equipment, etc., to support society and people's daily lives behind the scenes. In addition, as Japan's first flexible printed circuit (FPC) manufacturer, we have greatly contributed to the development of smaller, lighter and better performing electronic devices. In addition, NOK also launched a business focusing on copier rollers, which further promoted the stable development of the company.
Founded in 2006, ZDT mainly provides various types of printed circuit board products (flexible circuit boards, carrier-like boards, high-density connection boards, rigid circuit boards, IC carrier boards, flex-rigid boards, flip-chip films, modules) design, A professional service company with one-stop shopping and all-round solutions for R&D, manufacturing, and sales. It is widely used in terminal products such as smart phones, network equipment, tablet computers, wearable devices, notebook computers, servers, base stations, smart home appliances, automobiles and medical equipment.
Segmentation Overview:
Among different product types, Circuit with Adhesive segment is anticipated to contribute the largest market share in 2027.
Application Overview:
By application, the Consumer Electronics segment occupied the biggest share from 2017 to 2022.
Key Companies in the global Multi-layer Flexible Printed Circuit (FPC) market covered in Chapter 3:
Suzhou Dongshan Precision Manufacturing Co., Ltd.
ZDT
SI Flex
NOK
MFS Technology
Fujikura
Flexium
Sumitomo Electric Group
BHflex
CMD Circuits
Nitto Denko
Interflex
QualiEco Circuits
In Chapter 4 and Chapter 14.2, on the basis of types, the Multi-layer Flexible Printed Circuit (FPC) market from 2018 to 2029 is primarily split into:
Circuit with Adhesive
Circuit without Adhesive
In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Multi-layer Flexible Printed Circuit (FPC) market from 2018 to 2029 covers:
Consumer Electronics
Automotive
Medical
Aerospace & Defense
Others
Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:
North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)
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