Global Molded Underfill Material Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Global Molded Underfill Material Market Research Report 2023-Competitive Analysis, Status and Outlook by Type, Downstream Industry, and Geography, Forecast to 2029

Underfill materials are compound formulations of inorganic fillers and organic polymers which are applicable in semiconductor packaging to attain enhanced thermomechanical enactment. Molded underfill material is mold materials used as over mold compounds in wire-bonded or flip-chip CSP devices. Additional components added to the underfill formulation are flow agents, adhesion promoters, and dyes. Molded underfill material is mainly used for Flip Chip devices, Ball Grid Array (BGA) and Chip Scale Packaging (CSP).

Market Overview:

The latest research study on the global Molded Underfill Material market finds that the global Molded Underfill Material market reached a value of USD 64.73 million in 2022. It’s expected that the market will achieve USD 81.93 million by 2028, exhibiting a CAGR of 4.01% during the forecast period.

Market Opportunities

The increasing adoption of advanced packaging technologies such as flip chip, ball grid array (BGA) and chip scale packaging (CSP) by major manufacturers will provide important growth opportunities for the molded underfill material market in the next few years.

Market Driving Force

As the demand and application of electronic products in the global market continue to grow, such as mobile phones, computers, etc., the use of molded underfill materials in flip-chip and chip-scale packaging has increased. The extensive use of molded underfill materials in chip-scale packaging and flip-chip packaging is the main driving factor for the global market demand for molded underfill materials during the forecast period. The main factor driving the growth of the molded underfill material market is the increasing use of molded underfill materials in flip chip packaging. Outstanding consumer trends are driving the growth of the global molded underfill materials market. The growing demand for high-performance, low-cost, and small-size equipment is a key driving factor for the growth of the global molded underfill materials market. In addition, the advancement and upgrading of molding underfill materials market technology is directly affected by the innovation and future progress of the electronics industry. In addition, few molded underfill manufacturers on the market offer molded underfill products with lead-free solder paste. As the parent market of the global molded underfill material market, the global underfill material is growing rapidly and will continue to expand at a high compound annual growth rate in the next few years.

Region Overview:

From 2022-2027, Asia-Pacific is estimated to witness robust growth prospects.

Company Overview:

Sumitomo Bakelite Co., Ltd. is one of the major players operating in the Molded Underfill Material market, holding a share of 20.69% in 2021.

Sumitomo Bakelite Co., Ltd. engages in the manufacture and sale of phenolic resin and plastic products. Sumitomo Bakelite will create more advanced functions in the plastics industry and provide safe and reliable products for many fields such as information communication, automobiles, medical care, food, construction, etc., in order to achieve the purpose of giving back to the society.

Henkel is a German chemical and consumer goods company headquartered in Düsseldorf, Germany. It is a multinational company active both in the consumer and industrial sector. Henkel is organized into three business units: Adhesive Technologies, Beauty Care, and Laundry & Home Care. Henkel leads the global market in the field of adhesives. Henkel's Beauty Care and Laundry & Home Care consumer businesses also hold top positions in numerous markets and categories. Henkel is the world's number one adhesives producer. The business unit offers a broad portfolio of adhesives, sealants, and functional coatings for both Industry and Consumers with brands like Loctite, Technomelt, Teroson, Bonderite, and Aquence, and Consumers, Craftsmen and Building businesses with brands like Pritt, Loctite, Ceresit and Pattex.

Segmentation Overview:

Among different product types, Transfer Mold segment is anticipated to contribute the largest market share in 2027.

Application Overview:

By application, the Flip Chips segment occupied the biggest share from 2017 to 2022.

Key Companies in the global Molded Underfill Material market covered in Chapter 3:

Hitachi, Ltd.
SDI Chemical
Namics
Shin-Etsu Chemical
Sumitomo Bakelite Co., Ltd.
Henkel
Panasonic

In Chapter 4 and Chapter 14.2, on the basis of types, the Molded Underfill Material market from 2018 to 2029 is primarily split into:

Compression Mold
Transfer Mold

In Chapter 5 and Chapter 14.3, on the basis of Downstream Industry, the Molded Underfill Material market from 2018 to 2029 covers:

Ball Grid Array
Flip Chips
Chip Scale Packaging
Others

Geographically, the detailed analysis of consumption, revenue, market share and growth rate, historic and forecast (2018-2029) of the following regions are covered in Chapter 8 to Chapter 14:

North America (United States, Canada)
Europe (Germany, UK, France, Italy, Spain, Russia, Netherlands, Turkey, Switzerland, Sweden)
Asia Pacific (China, Japan, South Korea, Australia, India, Indonesia, Philippines, Malaysia)
Latin America (Brazil, Mexico, Argentina)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa)